Current Issue The International Reference for Chip-Scale Electronics, Flip-Chip Technology, Optoelectronic Interconnection and Wafer-Level Packaging May - June 2002 Email the editor

Subject to space available, Chip Scale Review will list conferences of interest to the international chip-scale-electronics community without cost to the sponsor. We regret, however, that we are unable to list events sponsored by commercial organizations. Please fax or e-mail your listing at least two months prior to cover date to the editor at 209.824.2799 or chipscale@cs.com.

May 28-31 ECTC 2002 The 52nd Electronic Components and Technology Conference Sheraton San Diego Hotel & Marina CPMT, ECA, EIA, IEEE [ectc.net]

June 4-6 FiberComm New Munich Trade Fair Centre, Germany [munichtradefairs.com] 12-13 IPC 2nd Annual International Conference on Opto-Electronics Sheraton Gateway Hotel, San Francisco Airport IPC/Cookson Electronics [ipc.org] 19 Nano Engineering Trends & Investing Conference NASA AMES Research Center Moffett Field (Mountain View), Calif. ASME [asme.org] Raj Manchanda [manchandar@asme.org] 24-25 Semiconductor 2002 EICC, Edinburgh, Scotland JEMI (Joint Equipment & Materials Initiative) [jemiuk.com]

July 15-16 PhoPack 2002 Photonic Devices & Systems Packaging, Stanford University Palo Alto, Calif. [cpmt.org/phopack] 17-19 SEMICON West (Final Manufacturing) San Jose Convention Center SEMI [semi.org] Register by June 14 to receive free show entrance and your badge by mail before the show. 22-24 SEMICON West (Wafer Processing) Moscone Center, San Francisco SEMI [semi.org]