Best Paper at BiTS Conference Fred Taber, Burn-in and Test Symposium (BiTS) general chairman, presents the best paper award to Isaac Chang for "Power Decoupling Optimizer-A Systematic Frequency Domain Approach to BiB Noise Decoupling Simulation."
Flatow, Richards Join Tessera Technologies' Management San Jose-Kirk Flatow and Stephen Richards have joined Tessera Technologies as senior vice president of marketing and sales and vice president of corporate development/ corporate counsel, respectively. They report to Bruce McWilliams, president and CEO. Flatow was most recently at Novera Optics, where he was president and CEO. Earlier, he held several executive posts with Harmonic Inc., where he was most recently a divisional president. Richards joined Tessera from Robertson Stephens, an investment banking firm, where he was vice president of corporate finance. [tessera.com] CAD Design Software Moves Santa Clara, Calif. - CAD Design Software has moved to a new facility in nearby Los Gatos. The company is now located at 15055 Los Gatos Blvd., Suite 300, Los Gatos, CA 95032. Current phone and fax numbers will remain valid through this year. [cad-design.com] Wafer-Level Packaging Symposium Set for June 6-8 Whitefish, Mont.-A wafer-level packaging symposium, "Peaks in Packaging," will be held at the Grouse Mountain Lodge from June 6-8. Comprehensive topics to be discussed include 300 mm stacked chips, lead-free, thick film and reliability. Sponsored by EP&P, SECAP, Semitool and Semiconductor International, the confab will focus on the latest advances in low-cost, high-density packaging. [semitool.com/seminars/advpkg-seminar/ index.html] MEMC Electronic Materials Appoints Pirooz VP and CTO St. Peters, Mo.-Dr. Saeed Pirooz has been named vice president and chief technology officer for MEMC Electronic Materials Inc. He replaces Dr. John De Luca, who retired at the end of January. Dr. Pirooz holds bachelor's, master's and doctorate degrees in chemical engineering from Washington University. [memc.com] ESEC USA Relocates to Larger Quarters for Customer Support Phoenix-Switzerland-based ESEC has moved its U.S. Customer Support Center to a larger facility in Tempe, Ariz., significantly increasing the space for applications engineering and customer support, according to the company. The expanded facility is located at 1407 W. Drivers Way, Tempe, AZ 85284; phone 480.893.6990. [esec.com]
Pacific Rim Technology Associates Signs Tong Hsing Electronics Reps in Western States San Jose-Pacific Rim Technology Associates has signed an agreement to represent Tong Hsing Electronics, a Taiwan-based IC packaging contractor, in California, Oregon and Washington state, according to Ray Pettit, PRTA president. Tong Hsing operates an additional "duplicate" facility in Canlubang, Republic of the Philippines. The company specializes in packaging RF and power modules, photonic parts and MCMs. The company also has extensive experience in thick film hybrid ICs. [pacificrimtech.com] Carsem and Ellipsiz Sign Memo for Wafer Bumping City of Industry, Calif.-Malaysian-based Carsem has signed a memo of understanding to form a wafer-bumping partnership with Ellipsiz MicroFab, a wafer-bumping company located in Singapore. The agreement, according to Carsem, will enable the packaging foundry to provide customers with "seamless flip-chip packaging services." Carsem said it earlier investigated setting up internal wafer bumping at its Ipoh, Malaysia, facilities. "It became clear to us as we saw bumped wafers from many sources over the past two years that the industry and its technology are still evolving," said David Comley, Carsem's group managing director. [carsem.com] [ellipsiz.com] Add Micro Control Co. to Vendor Directory Add Micro Control Co. to your list of socket vendors. Due to a production error, Micro Control was not included in our recent list of suppliers. Micro Control is in Minneapolis, Minn. Phone 763.277.9211, Fax 763.786.6543, [microcontrol.com] UTAC Orders LTX's Fusion for RF Device Test Singapore-LTX Corp., Westwood, Mass., will deliver its first Fusion CS test system to United Test and Assembly Center (UTAC), a packaging foundry headquartered here. The system will be used to test a broad range of RF devices, including GPS receivers, Bluetooth, wireless LAN/PLL/LNA/ Mixers, GSMs and CDMAs. [utac.com.sg] Datacon Announces New U.S. Subsidiary Radfield, Austria-Datacon Technology AG, a maker of assembly equipment, has established a U.S. subsidiary with branches in Trevose, Pa., and Phoenix for marketing, sales and technical support for the U.S. Earlier, Datacon's U.S. presence was represented by Kulicke & Soffa Inc. [datacon.at] Amkor Technology Orders 60 ASM Bonders Hong Kong-ASM Pacific Technology Ltd., Hong Kong, the majority-owned subsidiary of ASM International N.V., Bilthoven, Netherlands, has received an order from Amkor Technology Inc. for 60 Eagle gold wire bonders. The units will be installed at Amkor's Korean facilities. Amkor, according to ASM, will employ the ultra fine pitch bonders for both capability and capacity needs. [asm.com] TSMC Names Sheldon Wu Chief China Liaison Hsin-Chu, Taiwan-Taiwan Semiconductor Manufacturing Co. (TSMC) has appointed Sheldon Wu, formerly vice president of business management for TSMC North America, to the new post of chief representative and general manager of TSMC's Shanghai Liaison Office. [tsmc.com]
Asymtek Promotes Hoffman to PCBA Product Manager's Post Carlsbad, Calif.-Asymtek has promoted Bob Hoffman to printed circuit board assembly product manager from business development manager. A 10-year Asymtek veteran, Hoffman earned a BSE degree from UCLA's School of Engineering and Applied Sciences. [asymtek.com] IPC Forms Photonics Manufacturers' Council Northbrook, Ill.-The IPC trade association has formed the Photonics Manufacturers Association (PMA) Council to organize and coordinate roadmapping, standardization, legislation, market research and education within the photonics industry. [ipc.org] Correction for Yamaichi Electronics USA We incorrectly spelled the name of Ron Muranaga, Yamaichi Electronics USA, in the March-April issue. We also printed an incorrect address for Frank Lessani, also of Yamaichi. His correct e-mail address is frank.l@yeu.com.
PIC Subsystems and Components May Reach $11 Billion by 2006 Norwalk, Conn.-The market for photonic integrated circuits (PICs) and subsystems, currently estimated to be worth $4.3 billion, will grow at an AAGR (annual average growth rate) of 20.5 percent, reaching $11 billion by 2006, according to an industry research firm. The preponderance of growth for photonic chips is expected in 2003 and beyond. PICs are the monolithic integration of two or more integrated optical circuits (IOCs) on a single substrate, and are the photonic equivalent of microelectronic ICs. However, instead of guiding electricity, a PIC routes lightwaves. In PICs, waveguides (typically made of silica or polymers), act as the photonic analog of copper circuits, serving as interconnects between discrete components on a chip. In its report, Photonic Integrated Circuits: New Directions, market research firm Business Communications Company Inc. claims the market for these devices has now reached a critical commercial threshold. Since the introduction of PICs in 1997, the optical components industry has slowly migrated from the manual assembly of discrete optical devices to automated semiconductor wafer-processing techniques and single-chip solutions. During that time, simultaneous upgrades to both network architecture and bandwidth, specifically the all-optical and 40 Gb/s networks, established sizeable end markets for advanced optical components. These next-generation devices are predominately based on chip architectures. Separately, BCC forecasts, the market for discrete devices or IOCs, will grow at an AAGR of 18.5 percent. Although sales in this segment more than doubled in the five years prior to this reporting period, negative growth last year and a slowdown in telecommunications spending will result in healthy but more modest growth. [bccresearch.com]
Kyocera Adds Glass-to-Metal Packages for Fiber-Optic Use Vancouver, Wash.-Kyocera Industrial Ceramics has expanded its line of ceramic packages for fiber-optic devices with the addition of hermetically sealed glass-to-metal units. The glass-to-metal packages employ a wide range of lead-free, environmentally safe glass materials with low-to-high-temperature (280-900°C) sealing capabilities. The manufacturing process used will support a wide range of custom package designs, according to the company. [kyocera.com] |
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