Fancort offers a full line of manual and semi-automatic die bonders with platforms that can integrate many assembly processes. These processes include picking from wafer or waffle pack, eutectic bonding, adhesive dispensing or stamping and the new flip-chip placement system. Featuring a large area substrate capability of 11" x 11", the bonders are user-friendly, extremely flexible and can be easily upgraded to incorporate the many options available. In addition, Fancort offers stand-alone flip-chip bonding systems with eutectic- or ultrasonic bonding and wafer scribe/break machines. Call 1-888-FANCORT or email rantonellil@fancort.com. Vist our website at www.fancort.com.
Flexible Benchtop Plasma System
The new Plasma Etch PE-200 benchtop plasma system is compact and offers great flexibility. The unit measures only 30" W x 34" D x 26.5" H. System specifications include patented absolute process temperature control, electrostatic vacuum chamber shielding, loading flexibility and RIE capabilities. For more information, visit our website at www.plasmaetch.com.
Test and Burn-in Systems
Micro Control Company manufactures a complete line of test and burn-in systems for logic, memory, and high-power devices. Each burn-in system is available as a complete turnkey package with burn-in boards, high-performance burn-in sockets, burn-in-board carts, and test software to fill any customer requirement. Other Micro Control products include design-for-test systems, continuity testers, board loaders/unloaders, and prescreening equipment. For more information, visit our website at www.microcontrol.com.
