Embedded Passives Trimmer Introduced Electro Scientific Industries, Portland, Ore., has introduced the embedded passive laser trimming system. The unit trims resistors to tolerances of less than one percent in high-volume production. The ESI system handles panel sizes up to 600 mm (24 inches) x 750 mm (30 inches) and incorporates many field-proven features, according to its manufacturer. The unit enables PC board makers to achieve tighter tolerances and increase functionality by trimming embedded passive components within the inner layers of multilayer boards, according to ESI. [esi.com] Patented Blades Offer 'Double-Edge' Design JNJ Industries Inc., Franklin, Mass., is offering a patented combination metal and polymer blade for plastic and metal-mask stencils. The blade employs a polymer that is bonded to a stainless steel blade. The product is available in a variety of sizes and styles and can be fitted to most JNJ and other manufacturers' blades. [jnj-industries.com] New Software Tools Simplify Inspection View Engineering Inc., Simi Valley, Calif., has announced a set of software tools that combine the company's high performance metrology hardware platforms with computer-aided design. Known as "Elements," the software is designed to eliminate the complexity and long set-up times associated with programming vision measurement and inspection systems. Elements is CAD-driven and requires no programming. [vieweng.com]
X-Ray Unit Upgrade Increases Resolution FeinFocus USA, Stamford, Conn., has released an advanced slice resolution (ASR) software upgrade for its µ-3D Visualiser X-ray system. FeinFocus Rontgen-Systeme GmbH developed the software in partnership with Erlangen, Germany's Fraunhofer Institute. The ASR feature enables users to achieve resolution in the z-axis depth range of 8 microns and, for certain applications, sharp feature recognition as small as 3 microns. Current Visualiser owners can purchase the upgrade on CD, and it does not require installing new hardware. [feinfocus.com]
Laser Welding Unit for Opto Introduced The Axia Systems Division of Unitek Miyachi Corp., Monrovia, Calif., has announced the release of the SX1000 auto-align laser welding system for assembly of photonic devices. The unit is geared to single-mode fibers, laser diodes, photodetectors, lenses and other opto-electronic components. The nanometer-level motion system includes XY stages equipped with high-speed direct drive linear motors and air- or crossroller-bearings, precision rotary stages and parts-leveling tooling. [unitekmiyachi.com]
Aps Lab Simulates Customer Production Emerson & Cuming, Billerica, Mass., has established a sophisticated applications laboratory to enable customers to simulate the use of materials, such as encapsulants and sealants, used with actual production equipment. A Universal GMSxs pick-and-place system is at the heart of the new laboratory. The lab also features an inert gas blanketed reflow oven in which assembled ICs can be cured in a non-oxidizing environment. Inspection and test equipment, including a Sonoscan acoustic microscope, is also available. [nstarch.com]
Markem Targets Screen Printing of PC Boards Markem Corp., Keene, N.H., has released its Series 4000 drop-on-demand, white inkjet marker for silk-screen printing of PC boards. The 4000 Series of digital printers eliminates multiple steps needed for silk-screen printing and decreases downtime, according to the company. The process also results in a quick turnaround with high-contrast, high-resolution marks, the vendor claims. [markem.com]
New Aligner Bonder Handles Bare Die Eclipse Industries, Mechanicsburg, Pa., has introduced a semiautomatic aligner bonder, the DS-107, designed for the alignment, placement and attachment of bare die, components and packages. Applications for the unit include optoelectronics, die bonding, flip chip, MEMS attach and CSP assembly. It can handle die up to 50 mm2 and substrates as large as 300 mm2. The DS-107 is designed for an alignment accuracy of 1-2 microns and bond forces from 5g to 100 kg. [eclipseindustries.com] Isola AG, Taconic Plan Materials Alliance Isola AG, Dueren, Germany, and Taconic, Petersburgh, N.H., have formed an alliance to develop and produce substrate materials for high-speed digital PC board applications. Isola produces base materials for electronic interconnects and Taconic manufactures fluoropolymer laminates. [isola-use.com] [taconic-add.com] New Lead-Free Solder Made for Power ICs Honeywell Electronic Materials, Sunnyvale, Calif., has introduced Bi-Ag, a lead-free solder for die attach of power ICs. The Bi-Ag solder is a replacement for Pb5Sn and similar high-Pb alloys used in components subjected to reflow of lead-free board-level solders, such as Sn3.5Ag. Available in wire, ribbon and preforms, Bi-Ag is claimed to be the first economical lead-free die-attach solder capable of surviving secondary reflow at 260\°C. Additional applications in development for the solder include wafer bumping, lid sealing and BGA spheres for ceramic packages. [honeywell.com]
Silicon Optical Bench Targets Opto Packaging Zygo TeraOptix, Westborough MA., has introduced a new silicon optical bench platform targeted at optical telecom components. The bench provides a precision, flexible, scalable and automation-ready platform which is compatible with the company's current micro-optic subcomponent product offerings. [zygoteraoptix.com] Solid Adhesive Films, Preforms Developed TechFilm, Billerica, Mass., has developed a line of 100 percent solid adhesive films and die-cut preforms. According to the company, the new products eliminate problems such as residual solvent outgassing, which are with solvent-borne adhesives. Because materials are cast from 100 percent solids, the films can be manufactured to a thickness of up to 75 mm. The increased thickness enables the materials to be employed as preformed shapes for underfills, encapsulants and in-gasketing uses. [techfilm.com] Flex Circuits Bonder Gives Precise Temps Fancort Industries, West Caldwell, N.J., has announced the introduction of two machines aimed primarily at the pulse heat bonding and soldering of flexible circuits. Both employ microprocessor controls to deliver precise and consistent temperature control, according to the company. Two machines are available. The Model PHM 1-1 features a linear shuttle; the other unit, the Model PHM 2-2 offers a rotary table with two work positions, allowing the operator to load new work while the prior work is being bonded. [fancort.com] 2D Surface, 3D Bump Inspection Unit Offered Camtek, Migdal Haemek, Israel, has introduced the BIS, a fully automatic surface inspection and bump inspection system. The unit is based on technology developed by Inspechtech, an Israeli company that CAMTEK acquired last year. Developed as a fast inspection system for bumping and yield enhancement, the BIS combines 2D and 3D measurements with a data acquisition feature (CPC) for recording the inspection results. This feature enables immediate retrieval and analysis of the bumping process. [camtek.co.il] C Speed Awarded Patents for 3D MEMS Technology C Speed Corp., Anaheim, Calif., a developer of 3D MEMS-based, scalable optical switching subsystems, says it has been granted two U.S. patents for technologies used in the company's all-optical ASCENT architecture. At the heart of the architecture is a triple actuator 3D MEMS mirror that delivers typical switching speeds of less than 10 milliseconds, long-term reliability, and high vibrational stability. A second patent pertains to unique packaging for the switch fabric that brings the light beam over a very short path to the first steerable micromirror before the light can diverge. The package builds on C Speeds' mirror system that minimizes insertion loss and optimizes uniformity of path-to-path performance when switching all-optical signals. Ralph Ahlgren, senior vice president of engineering at C Speed, says this switch allows the mirrors to be packaged in a tiny, postage stamp-sized volume, which minimizes the effects of temperature and pressure. [cspeed.com] |
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