The International Magazine for Device and Wafer-Level Test, Assembly, and Packaging Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS, MOEMS, RF/Wireless, Optoelectronic and Other Wafer-fabricated Devices for the 21st Century
Archives >> May - June 2003 issue
May - June 2003
Chip Scale Review is produced for a worldwide audience of engineers, specialists, researchers and end-users of chip-scale and wafer-level back-end electronics manufacturing in print and digital editions. Chip Scale Review covers the chip-scale, flip-chip and wafer-level packaging market with a thoroughness unmatched by any other magazine.

• China's Unlimited Market and Low Labor Rates Are Enticing IC Assemblers to Join the Stampede

• Return from the Abyss: IC Packaging Foundries Have Learned Some Painful Lessons in Surviving Bad Times

• The Global Packaging Foundry Business 2002: Units Up, Profits Taking a Slow Boat to China

• International Directory of IC Packaging Foundries

• Underbump Metallization for Flip-Chip Packaging

• The Semiconductor Assembly Council Provides Many Solutions for Supply Chain Management

Table of Contents

• Publisher's Letter: China Notebook

• Assembly Lines: Presenting My Take on Odds and Ends Since the April Issue's Lively Repartee

• Opto-Electonically Speaking: OFC Shows That Fiber Is Not the Answer

• Packaging Insights: Should We Pull Test and Shear Test Fine-Pitch Wedge and Ribbon Bonds?

• Electronic Trends: Packaging Foundries Show Growth Despite Hard Times

• Industry News

• Calendar

• Tools & Technologies

• Patent Review: Patent Illustrates a New Use for Old Technology - Tape Automated Bonding

• Ad Index