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Features Chip-Scale Packaging Final Test: The Paradigm Shift Begins Jack Kessler, Amkor Electronics Inc. The technology and materials employed for CSPs are driving the industry to new "package-independent" test-handling concepts which require no tooling, no sockets and no singulated parts handlers. Chip-Scale Package Testing Paul Emmett, ChipPAC Inc. Revolutionary thinking is required to address the complex test needs of CSPs. Technical Forum Good Contact Design Improves Test Performance in BGA/CSP Applications Randy Knudsen, Johnstech International Removable Chip Modules Provide Temporary Interconnections James Rathburn, Gryphics Inc.