May 1998 - ChipScale Review

May 1998


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Taltec Systems Adds to µFIex™ Product Line

Taltec Systems Inc. has added a segmenter and carrier assembler to its µFIex family of automated products for CSP package production. The ,uFlex products were specially developed for use with Tessera's pBGA~ package and other specialized CSPs, according to the company.

Segmentation (cutting a continuous strip of tape into a segment) of flexible substrate from a spool and attachment to a process carrier with adhesive tape is the first step in ~BGA assembly. Current manual methods are slow, tedious for operators and imprecise, Taltec says.

The segmenter and carrier assembler is available in both a fully-automatic version (SCA-400A) and a semi-automatic model (SCA-400S).

Equipment features include a touch screen operator console, an easy-to-use "teach mode" programming interface and precision pressure compliance applicator and rollers and film supply preheating. The fully automatic SCA-400A integrates a coinstack module with interchangeable cassettes to facilitate the supply of input carriers. Taltec has also introduced a covertape assembler, available as models CTA-380A (fully automatic) and CTA-380S (semi-automatic). The assemblers are employed in the covertape attachment step of the ~BGA packaging process.

Contact Gene Sequeira, Sales Manager, TaltecSystemsInc., 130 Robin Hill Rd., Santa Barbara, CA 93117. Phone 805.681.3434 orfax, 805.681.3437. www.taltecnet



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