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List of the sponsors

 Publisher's Letter
Good News for CSR Readers
 
 Assembly Lines
Amkor Technology Inc. Plans Expansion to China and Taiwan
 
 Electronic Trends
IC Packaging Foundries Can Look Forward to Solid Growth
 
 Standards
Changes to JEDEC's Moisture Sensitivity Classification for SMDs Likely Soon
 
 Wafer - Level Watch

Packaging's Value Added: Greater Functionality for Integrated Circuits

 
 Harvey Miller's Notebook

Lead in Solder, Bromine in Epoxy: Guilt by Association?

 
 On Test
ATE Conspiracy? Vendors Can't Cooperate Enough to Conspire!
 
 CSP Automation
Die Trace for CSPs Isolates Manufacturing Problems
 
 Flip - Chip Focus
Flip-Chips: Some History, a Tutorial and a Few New Perspectives
 
 Industry News
50th ECTC Packs 'Em in Amid Vegas' Glitter
Korean Multi-National Firm Acquires Signetics Korea Ltd.
People in the News
Company News
Calendar of Events
 
 Features
IC Packaging: Advanced Technology, Not Cheap Labor, Is Now the Driver
IC Packaging Foundries
What IC Packaging Foundry Users Want
Will Wall Street and IC Assemblers Make the Perfect Marriage
High Silicon Integration Levels and CSPs to Meet Wireless' Tight Space Demands
Dynamic Growth and Change Highlight the IC Packaging Industry
BGA Nomenclature
The Good, the Bad and the Ugly: How to Select a Packaging Foundry
Comparing Flip-Chip and Wire-Bond Interconnection Technologies
Selecting the "Right" Test Vendor Can Improve Yields and Cut Costs
An Expert Looks at the Issues™
 
 Technology Trends
A Novel Approach to Ball Attachment Maximizes Efficiency and Floorspace
 
 Tools & Technologies
Universal Instruments Adds Camera and more
 
 Literature Review
New Book in Professional Engineering Series and more
 
 Patents
Chip and Board Stress Relief Interposer
 
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An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics

July - August 2000

Email the editor

 Calendar of Events

Subject to space available, Chip Scale Review will list conferences of interest to the international chip-scale-electronics community without cost to the sponsoring organizations. Please fax your listing at least two months in advance of issue date to the Editor at 209.824.2799. You may also e-mail your listing to chipscale@cs.com.

JULY

10-14


SEMICON West

10-12 Moscone Center, San Francisco
  Wafer processing
10-11 10 a.m. - 6 p.m.
12 10 a.m. - 4 p.m.
  Exhibits: 12-14,
  San Jose Convention Center
  Packaging, Assembly and Test
  Exhibits:
12-13 10 a.m. - 6 p.m.
14 10 a.m. - 4 p.m.
  SEMI [semi.org]
AUGUST

July 30-4

International Symposium on
Optical Science and Technology
(45th Annual Meeting of SPIE)

San Diego, Calif.
SPIE [spie.org]

SEPTEMBER

9-15

IPS Works 2000
Hyatt Regency, Miami, Fla.
IPC [ipc.org]
John Perry [perrjo@ipc.org]

13-15

SEMICON Taiwan
Taiwan World Trade Center
SEMI [semi.org]

24-28

International Assembly
Technology Expo
Rosemount (Illinois)
Convention Center
SMTA [joann@smta.org]
OCTOBER

3-4

PackCon
Santa Clara (Calif.) Convention
Center (with IEMT, October 2,
and MEPTECH,October 4)

SEMI [semi.org]

3-5

31st International Test Conference

Atlantic City, New Jersey
[itc.org]

3-6

SEMI Expo CIS

Moscow, CIS
SEMI [semi.org]

17-18

SEMICON Southwest

Austin, Texas, Convention Center
SEMI [semi.org]
 
 
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