An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics July - August 2000 Email the editor

Las Vegas - The 50th Electronic Components & Technology Conference attracted a record attendance of more than 1,000 to this grown-up's Magic Kingdom, plus another 200 who staffed the 75 exhibits.

Sponsored by ECA, CPMT and IEEE, there were also 38 sessions with a total of 280 technical papers by presenters from more than 20 countries. Next year's conference is slated for May 29-June 1 in Lake Buena Vista, Fla. [ectc.net]

Dr. Thomas G. Reynolds III, general chairman for this year's event (left), discusses the 51st ECTC with Dr. Peter Slota Jr., next year's ECTC general chairman.	Vegas' gaming palaces are distinguished by their unique architecture. Although you might expect to find a castle at Disneyland, this is the Excalibur Hotel.
Masako Robertson, a consultant from Austin, Texas, discusses the show with Dr. C.P. Wong of Georgia Tech.	A small part of Caesar's Palace was turned into the ECTC exhibit venue for two days.
Dr. Klaus-Jurgen Wolters of Dresden University, Germany (left), Dr. Rao Tummala of Georgia Tech and Prof. Jim Morris of SUNY, Binghamton (right) discuss a technical paper.	Karl Loh (left) and John Crane worked the Zymet booth. Visitor at right is not identified.
Conference visitor looks at samples from National Semiconductor's Die Products Business Unit, South Portland, Maine. Pictured from National are Jacqueline Collard, marketing manager for die products, and Sherb Bridges, business unit director.	Members of the Electronic & Thermal Solutions Group of Sumitomo Electric USA prepare for visitors. From left, Masaki Nagai, assistant manager, Izumi Nakamura, senior manager, Toshifumi Onishi, assistant manager and Hideko Koyama, sales coordinator.
Lewis Hwan (left), Chipbond Technology, discusses marketing strategy with his U.S. reps, Carl Lehtonen and Ray Petit (right) of SiCoast.	The program chairman's luncheon on the final day of the conference draws a packed house.
Chip Coolers' General Manager William Rife (seated) checks in with headquarters.	Bill Farrel of IBM (left) asks Unitive's Robert Lanzone, vice president of sales and marketing and Frank Gaughan about the latest additions to Unitive's wafer bumping services.
Wayne J. Howell, ECTC assistant program chairman (left), stops at the Tempo Electronics booth to talk tape with Rob Sierra, marketing director.	ECTC attendees take time out during a break in the technical presentations.