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Amkor Technology Inc. Plans Expansion to China and Taiwan
 
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IC Packaging Foundries Can Look Forward to Solid Growth
 
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Changes to JEDEC's Moisture Sensitivity Classification for SMDs Likely Soon
 
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Packaging's Value Added: Greater Functionality for Integrated Circuits

 
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Lead in Solder, Bromine in Epoxy: Guilt by Association?

 
 On Test
ATE Conspiracy? Vendors Can't Cooperate Enough to Conspire!
 
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Die Trace for CSPs Isolates Manufacturing Problems
 
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IC Packaging: Advanced Technology, Not Cheap Labor, Is Now the Driver
IC Packaging Foundries
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Will Wall Street and IC Assemblers Make the Perfect Marriage
High Silicon Integration Levels and CSPs to Meet Wireless' Tight Space Demands
Dynamic Growth and Change Highlight the IC Packaging Industry
BGA Nomenclature
The Good, the Bad and the Ugly: How to Select a Packaging Foundry
Comparing Flip-Chip and Wire-Bond Interconnection Technologies
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An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics

July - August 2000

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 IC Packaging Foundries

How We Compiled the Table of Packaging Foundries

We began compiling the table that begins on page 49 in early January, with letters to all of the IC packaging foundries we could identify. Although we list only 32, there are about 60 total. Generally, we sent each packaging foundry four letters before the deadline, inviting them to participate. Unfortunately, even some large companies failed to respond to our requests for information. A few others did respond, but the information they submitted ws incomplete, so they were not listed.


Company
Manufacturing Location
Contact
Year Founded
Employees

A=<100; B=100-500
C=501-1,000
D=1,001-2,000
E=2,001-5,000;
F=>5,000

Stock Symbol
(if public company)

Customers by
Region (%)

A=Asia (except Japan);
E=Europe; J=Japan;
N=North America;
R=Rest of World

CSPs?
Maximum # of
Leads
(all packages)
Currently operate dedicated lines?
Total manuf.
area in square
meters
(all Locations)

Quality Audits
A=ISO9001; B=ISO9002;
C=ISO14000;D=SAC
Level 1; E=QS9000

Computer
access to work in
progress?
Web Site
Contact
Additional Offices
Advanced Interconnect
Technologies (Hong Kong)

Southeast Industrial Building
5th Floor, 611-619 Castle Peak Rd.
Tsuen Wan, Hong Kong

+852.2499.6292

 

1990
 F

(Merger of Advanced Interconnect
Technologies and Hana
Technologies Ltd. H.K.)
A 10
E 30
J  5
N 55
Yes
900/PBGA
No
57,000

A, C, E

Yes

[aitna.com]

Garron Perrotti, Sales Director

Advanced Interconnect
Technologies, 6800 Koll
Center Parkway, #220,
Pleasanton, CA 94566

925.426.3100; 925.426.2323 fax

Alphatec Holding Co., Ltd.

19th Floor, Times Square Building
246 Sukhumvit Rd.
Bangkok, Thailand 10110


+66.2.229.4680
+66.2.229.4677 fax

1999

 E

A 5
E 5
J  85
N 5

Yes
336/MBGA
No
30,000

A, C, D, E

Yes

[alphatec.co.th]

Tom Reynolds,
President-ATS Services

treynolds@atssc.com


408.998.4620 ext. 105 408.998.4712 fax

Amertron Inc.

Maloma Street, CSEZ,
Pampanga, Philippines


1996

 C
N 100 Yes 100/PQFP
N/A
N/A
A

[amertron.com.ph]

see Pantronix
Amkor Technology Inc.

1245 Enterprise Dr.
West Chester, PA 19380
(All manufacturing is done in either Korea
or the Philippines.)


Al Luna, VP-Sales aluna@amkor.com

1900 South Price Rd.
Chandler, AZ 85248

480.821.5000; 480.821.2044 fax

Santa Clara, Calif.
Mike Lamble, VP-Sales
mlamb@amkor.com
1968

 F

AMKR (NASDAQ)
A 2
E 20
J 4 (includes Korea)

N 74
Yes
1,936/Flip BGA
Yes
1,066,800
A, C, E,
SEMITECH, DSCC
for products in the Philippines
[amkor.com]

Ellen Ware, Director of
Marketing Support
480.821.5000; 480.821.6937 fax
eware@amkor.com

Irving, Texas
Cecil Cherico, VP-Sales ccher@amkor.com

Europe: Amkor Technology
Euroservices-S.A.R.L.
Jean-Loup Rousseau, VP-Sales
jrous@amkor.com
Apack Technologies Inc.

#3, Li-Hsin Road V
Hsinchu, Taiwan


+578.8766; +563.2129 fax

1996

 B
A 25
J  40
N 35


Yes
>1000
Yes  8942

A (pending)

Yes
[apack.com]

Austin Jwo,
Sales Manager

austinj@apack.com.tw
Aptos Corporation

1557 Centre Point Dr.
Milpitas, CA 95035


408.941.2488; 408.956.7979 fax

1986

 B

A 35
E 15
N 50
Yes
1,500-2,000 solder
bump, FCBGA

Yes   5,000
A

No
[aptoscorp.com]

Ben Chao,
Executive Vice President

benchao@aptoscorp.com
ASAT Ltd.

QPL Industrial Bldg.
130 Texaco Rd.
Tsuen Wan, N.T., Hong Kong

+852.408.711?
+852.407.4056 fax
1988

 E
(Subsidiary of QPL
International Holdings)
A 42
E 10
N 48
Yes
732/TBGA

No
109,728

A, D, E

Yes

[asat.com]

Paul Smith
Executive Vice President

paul_smith@asat.com

ASAT Inc., 46335 Landing
Pkwy., Fremont, CA 94538


510.249.1281; 510.249.9105 fax
Automated Technology
(Phil.) Inc. (ATEC)

Light Industry & Science Park Cabuyao, Laguna, Philippines
1997

 D

A 20
E 5
J  2
N 70
R 3
Yes
>200 Grid Arrays
Yes
200,000

A, E, QML

Yes

[atecphil.com]

Sam Gomez, Vice President
of Sales & Marketing

sgomez@atec-us.com

408.573.6805; 408.573.6895 fax

Benchmark Electronics

3000 Technology Drive
Angleton, TX 77515

979.849.6550; 979.848.5269 fax

N/A

 F

BHE (NYSE)

N/A

Yes
1,100/BGA
Yes
N/A

A, C,

Yes

[bench.com]

David Chavez, Business
Development Manager

david.chavez@bench.com
CARSEM

Jalan Lapangan Terbang
30720 Ipoh, Perak Darul Ridzuan Malaysia
+60.5.3123333; +60.5.3125333 fax

1972

 C
N/A Yes
N/A
N/A
N/A
A

Yes
[carsem.com]

Carsem Inc.
17890 Castleton St., Suite 245
City of Industry, CA 91748
626.854.0939; 626.854.9139 fax

Chipbond Technology


21 Prosperity Road 1
Hsinchu, Taiwan

California: Ray Petit,
President, SiCoast Inc.

rppetit@sicoast.com

408.9245.0965; 408.924.0929 fax

1997

 N/A

A 5
E 50
N 30

R 15
Yes
100/ChipBGA
Yes
N/A
B

No
[sicoast.com]

Carl Lehtnonen, President
Silicon Coast, Inc
.
celehtonen@sicoast.com

809 Steve Hawkins Pkwy.
Marble Falls, TX 78654

830.798.0700; 830.798.2700 fax

ChipMOS Technologies Inc.

No. 1, R&D Road, Hsinchu, Taiwan

+886.3.577.0055
+886.3.566.8989 fax


1997

 D
A 45
E 5
J  25
N 20
R 5

Yes
100/L-TQFP
Yes  84,600

A, C, E

Yes
[chipmos.com.tw]

J.R. Lin
j.r._lin@chipmos.com.tw
CS2 (Custom Silicon
Configuration Services)


Hermesstraat 2A, Zaventem
Belgium 1930

+32.2.720.00.00;
+32.2.720.00.01 fax

1998

 B

CSCS (EASDAQ)

E 90
N 10
Yes
1,060/EBGA
Yes  
6,000
A, E

Yes
[cs2.be]

Ben Chao,
Executive Vice President
info@cs2.be
EEMS Italia S.p.A

Viale delle Scienze 5-02015 Cittaducale (Ri), Rieti, Italy

+39.0746.604.668
+39.0746.604.309 fax

1994

 C
E 100
Yes
100/QFP

Yes
12,000

B

Yes

[eems.it]

Paul Smith
Executive Vice President

pasqualeamideo@eems.it
Hana Microelectronics Inc.

10/4 Moo 3,
Vibhavadi-Rangsit Road, Soi 64
Bangkok, Thailand 10210
1978

 F

HANA
(Thailand Stock Exchange)

A 35
E 3
J 10
N 50
R 2
No
100/QFP
Yes  
53,000
A, E

No
[hanagroup.com]

Richard McKee, Director of
Sales and Marketing
richard_mckee@hanaus.com

408.452.7474; 408.452.7488 fax
IBM Microelectronics

1580 Route 52
Hopewell Junction, NY 12533
and Bromont, Ontario, Canada
N/A

 F

IBM (NYSE)
A 30
E 30
N 40
YES
1,657/BGA and
4,224/127x127
mm MCM

N/A  
N/A


A

N/A
[chips.ibm.com]

webmastr@us.ibm.com

800.934.0104

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