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Good News for CSR Readers
 
 Assembly Lines
Amkor Technology Inc. Plans Expansion to China and Taiwan
 
 Electronic Trends
IC Packaging Foundries Can Look Forward to Solid Growth
 
 Standards
Changes to JEDEC's Moisture Sensitivity Classification for SMDs Likely Soon
 
 Wafer - Level Watch

Packaging's Value Added: Greater Functionality for Integrated Circuits

 
 Harvey Miller's Notebook

Lead in Solder, Bromine in Epoxy: Guilt by Association?

 
 On Test
ATE Conspiracy? Vendors Can't Cooperate Enough to Conspire!
 
 CSP Automation
Die Trace for CSPs Isolates Manufacturing Problems
 
 Flip - Chip Focus
Flip-Chips: Some History, a Tutorial and a Few New Perspectives
 
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50th ECTC Packs 'Em in Amid Vegas' Glitter
Korean Multi-National Firm Acquires Signetics Korea Ltd.
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IC Packaging: Advanced Technology, Not Cheap Labor, Is Now the Driver
IC Packaging Foundries
What IC Packaging Foundry Users Want
Will Wall Street and IC Assemblers Make the Perfect Marriage
High Silicon Integration Levels and CSPs to Meet Wireless' Tight Space Demands
Dynamic Growth and Change Highlight the IC Packaging Industry
BGA Nomenclature
The Good, the Bad and the Ugly: How to Select a Packaging Foundry
Comparing Flip-Chip and Wire-Bond Interconnection Technologies
Selecting the "Right" Test Vendor Can Improve Yields and Cut Costs
An Expert Looks at the Issues™
 
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A Novel Approach to Ball Attachment Maximizes Efficiency and Floorspace
 
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Chip and Board Stress Relief Interposer
 
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An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics

July - August 2000

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 IC Packaging Foundries

Company
Manufacturing Location
Contact
Year Founded
Employees

A=<100; B=100-500
C=501-1,000
D=1,001-2,000
E=2,001-5,000;
F=>5,000

Stock Symbol
(if public company)

Customers by
Region (%)

A=Asia (except Japan);
E=Europe; J=Japan;
N=North America;
R=Rest of World

CSPs?
Maximum # of
Leads
(all packages)
Currently operate dedicated lines?
Total manuf.
area in square
meters
(all Locations)

Quality Audits
A=ISO9001; B=ISO9002;
C=ISO14000;D=SAC
Level 1; E=QS9000

Computer
access to work in
progress?
Web Site
Contact
Additional Offices
IPAC

2221 Oakland Rd.
San Jose, CA 95131

408.321.3600; 408.321.3603 fax

1993

 B
(Now a sunsidary of OSE, Taiwan)

N 100 Yes 900/BGA
No
25,908

A

Yes

[ipac.com]

sales@ipac.com

Kingpak Technology

No. 84 Taiho Road, Chupei 302
Hsinchu Hsien, Taiwan

1998

 B

A 50
E 10
N 40

Yes
500/PBGA
No
30,000

 

[kingpak.com]

Larry Sannes, Sales Director

3350 Scott Bldv., Bldg. 48
Santa Clara, CA 95054
larry@kingpak.com
408.988.1408

Meicer Semiconductor Inc.

No. 1 Ding An Rd., Industrial Park Jung Li, Taiwan 320

+886.3.461.6666; +886.3.461.7777 fax


1987

 B
E 25
J  25
Taiwan 50
Yes
64/LQFP
No 80,000
B

Yes
[meicer.com.tw]

W. Yueh
w.yueh@meicer.com.tw
Alex Wu, Product Manager
alex@meicer.com.tw
Multichip Assembly

71 Daggett Dr.
San Jose, CA 95134

408.324.0244; 408.324.1036 fax

1991

 A
N 100 Yes
2,200/Wafer-level CSP
Yes N/A
ISO 9000 Pending

Yes
John J. Strinic,
VP-Sales & Marketing
jjs@multichipassy.com

Natel Engineering Co. Inc.

9340 Owensmouth Ave.
Chatsworth, CA 91311

818.734.6500; 818.734.6530 fax


N/A

 B
E 3
N 95
R 2

Yes
150/MCM-L
Yes  15,000

A, MIL-PRF 38534

No
[natelengr.com]

Jim Angeloni,
VP-Manufacturing Services
jima@natelengr.com
NS Electronics Bangkok

40/10 Sukhumvit Rd., Soi
Sukhumvit, Bangkok
Thailand 10260

1973

 E (Owned by National Semiconductor until 1995).

A 30
E 30
J 10
N 20
R10
Yes
84/BCC-QFN (9x9)
No  
54,864
A, C, D, E

Yes
[nseb.com]

Jerry Kirby,
Engineering/Sales Manager
jkirby@nseb.com

408.749.9155; 408.749.9239 fax

Orient Semiconductor
Electronics Ltd.


12-2 Hei Huan South Road
Kaohsiung 811, Taiwan

+886.7.3613131
+886.7.3632319 fax


1971

E

1994
(Taiwan Stock Exchange
identifier number)

A 35
E 20
J 5
N 40
Yes
863/EBGA
Yes  
518,160
B, E, SAC Level II, ISO-14,001

Yes
[ose.com.tw]

Tonwey Cheng,
Marketing Director

tonwey_cheng@ose.com.tw
Pantronix Corp.

2710 Lakeview Court
Fremont, CA 94538

510.656.5898
510.656.7779 fax
1974

D
  No
600/pbga
Yes
30,480
B, MIL-PRF 38535

Yes
[pantronix.com]

Mike H. Chen,
Technical Marketing Director

mchen@pantronix.com

Bret Buckler,
Program Manager

bbuckler@pantronix.com

Sampo Semiconductor Corp.

1F 1, Kao-Ping Section,
Chung-Feng Road, Tao Yuan, Taiwan

USA Silicon Coast Inc.

1997

 C (Sampo Corp. 5000+)

1604
(Taiwan Stock Exchange
identifier number)

A 75
N 25
No
438/PBGA
Yes
24,400

B

Yes

See Chipbond Technology
Signetics Korea Ltd.

272 Yomchang-dong, Seoul, Korea +82.348.940.7661; +82.348.940.7691 fax

Signetics High Technology Inc.

1737 N. First St., Suite 400
San Jose, CA 95112

408.467.0660; 408.467.0667 fax

Greg Johnson, VP-Sales

gjohnson@signeticsusa.com

1996

 D

A 45
E 40
N 15
Yes
782/S-TBGA/
EPBGA

Yes
210,336

A, E, D
EIA 599
DESC/NASA
Certified

Yes

[signetics.com]

East Coast: Antony Iantosca
16 Somerset Dr.
Andover, MA 01810

978.681.6203; 978.688.0973 fax

Europe: Signetics Ltd. Europe
13 Chemin du Levant
01210 Ferney-Voltaire, France

+33.450.40.61.63 +33.450.40.62.57 fax

Siliconware Precision
Industries Co., Ltd. (SPIL)


No. 123, Section 3, Da Fong Rd. Tantzu, Taichung 427, Taiwan

+886.4.534.1525; +886.4.534.0472 fax

USA: Jack Snyder, Vice President
info@spilca.com

888.215.8632; 408.573.5530 fax

1984

 E

2325
(Taiwan Stock Exchange
identifier number)

A 40
E 5
J  10
N 45

Yes
1,521/Flip-chip BGA
Yes
284,988

A, C, D, IECQ
ISO-9002 and ISO-
17025 pending

Yes

[spil.com.tw]

Taiwan/Japan Shine Huang, VP
shinechuang@spil.com.tw

+886.3.579.5678; +886.3.577.0173 fax

Europe/Middle East/Singapore
Frank Hsu, Vice President
frankhsu@spil.com.tw

+886.3.579.5678 ext. 3310 +886.3.577.0173 fax


ST Assembly Test Services Ltd.
(Singapore)

1450 McCandless Drive
Milpitas, CA 95035

408.941.1500; 408.941.1501 fax


1994

 D

STTS (NASDAQ)
A 28
E 3
N 69
Yes
1,200/FEBGA
N/A
127,680
A, C, D

Yes
[statsus.com]

George Brathwaite,
Sales Director


gab@statsus.com
STECO Ltd.

Myunghad-Li, Dong-Myon
Yeongi-Gun, Korea

+82.415.861.1855 +82.415.861.1892fax

1995

 N/A

J 40
N 60
Yes
557/COF
N/A
9,830
B

N/A
[steco.co.kr]

Oh Seoh Hyuk, Manager
oshcap@steco.co.kr

(Joint venture of
Samsung and Toray)
Team Pacific Corp.

Electronics Avenue, FTI Complex,
Taguig, Manila, Philippines

+632.838.4671; +632.838.5012 fax

Luisa Merana, Marketing Manager
louie@teamglac.com

1986

 E

CSCS (EASDAQ)
A 10
E 15
J  2
N 73


No
40/CDIP
Yes 
15,846

B, E

No
[teamglac.com]

USA: Golden Link America Corp.
1799 Old Bayshore Highway
Burlingame, CA 94010

Renato L. Chu
rene@teamglac.com
Tong Hsing Electronic

Industries 4th Floor,
85 Yenping South Rd.,
Taipai, Taiwan

USA: Silicon Coast Inc.

1975

 N/A

A 16
E 13
J  5
N 66
Yes
500/CBGA
Yes  
N/A
A, B, E

Yes
See Chipbond Technology
VLSI Packaging Corp.

750 Presidential Dr.
Richardson, TX 75681

972.437.5506
972.644.1286 fax


1984

 B
E 5
J  15
N 80

Yes
1,200/BGA

Yes
21,336

ISO-9002 pending,
MIL-SPEC 88.38510

Yes

[vlsip.com]

Robert Gilbert,
Marketing Manager

sales@vlsip.com

Information was supplied by the listed companies. Only packaging foundries who responded to our survey are listed. Issue advertisers or their parent corporations or subsidiaries are highlighted in boldface type. Specialized suppliers, i.e., bumping or redistribution providers, will be listed in a future issue.


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