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This month issue
An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics
July - August 2000
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Publisher's Letter
Good News for CSR Readers
Assembly Lines
Amkor Technology Inc. Plans Expansion to China and Taiwan
Electronic Trends
IC Packaging Foundries Can Look Forward to Solid Growth
Standards
Changes to JEDEC's Moisture Sensitivity Classification for SMDs Likely Soon
Wafer - Level Watch
Packaging's Value Added: Greater Functionality for Integrated Circuits
Harvey Miller's Notebook
Lead in Solder, Bromine in Epoxy: Guilt by Association?
On Test
ATE Conspiracy? Vendors Can't Cooperate Enough to Conspire!
CSP Automation
Die Trace for CSPs Isolates Manufacturing Problems
Flip - Chip Focus
Flip-Chips: Some History, a Tutorial and a Few New Perspectives
Industry News
50th ECTC Packs 'Em in Amid Vegas' Glitter
Korean Multi-National Firm Acquires Signetics Korea Ltd.
People in the News
Company News
Calendar of Events
Features
IC Packaging: Advanced Technology, Not Cheap Labor, Is Now the Driver
IC Packaging Foundries
What IC Packaging Foundry Users Want
Will Wall Street and IC Assemblers Make the Perfect Marriage
Packaging Trends: High Silicon Integration Levels and CSPs to Meet Wireless' Tight Space Demands
Dynamic Growth and Change Highlight the IC Packaging Industry
BGA Nomenclature
The Good, the Bad and the Ugly: How to Select a Packaging Foundry
Comparing Flip-Chip and Wire-Bond Interconnection Technologies
Selecting the "Right" Test Vendor Can Improve Yields and Cut Costs
An Expert Looks at the Issues™
Technology Trends
A Novel Approach to Ball Attachment Maximizes Efficiency and Floorspace
Tools & Technologies
Universal Instruments Adds Camera and more
Literature Review
New Book in Professional Engineering Series Looks at Low-Cost Flip-Chip Methods and more
Patents
Chip and Board Stress Relief Interposer
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