An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics July - August 2000 Email the editor

For Information on placing a Literature Review ad, e-mail csradv@aol.com

The deadline is the first of the month preceding the month of publication.

New Book in Professional Engineering Series Looks at Low-Cost Flip-Chip Methods

New York - A new book, Low Cost Flip Chip Technologies, by prolific author and editor Dr. John A. Lau, has been released by McGraw-Hill for its professional engineering series.

The book contains 450 pages and 150 illustrations in hardcover form and is claimed by the publishers to be "the first book detailing the application of the new generation of low-cost flip-chip technologies."

This book "is a little different from Lau's others, in that the technical level is slightly lower and the topic broader," McGraw-Hill says. Dr. Lau, president of Express Packaging Systems, Palo Alto, Calif., authored a related title, Flip Chip Technology, which was released in 1994.

Chapters in the book cover such topics as:

• Wire bonding technology
• Flip-chip technology
• Wire bonding chip-on-board
• Solder-bumped FCOF substrate
• Solder bumped flip-chip on glass
• Wire bonding chip-on-board in a package
• Wire bonding chip on flex substrate in a package
• Solder bumped flip-chip on flex substrate in a package

The book is priced at $89.95 and is available at most trade booksellers and from many Internet sites.

"Low-cost flip-chip technologies have become, by removing the actual package from the equation, the ultimate in packaging. This is the direction everything is moving in, and everyone knows Lau's expertise here," according to Charles A. Harper, series advisor for McGraw-Hill. [mcgrawhill.com]

New Paste Die Attach Adhesives

Ablestik has introduced a new generation of IC packaging adhesives for lead-less assembly. ABLEBOND 2000 series electrically conductive die attach adhesives are designed specifically for PBGA packaging and matrix-style BGA designs. These materials can withstand higher temperature reflow for lead-less electronics assembly with optimized adhesion, stress and moisture absorption.

Engineered with a low modulus, these materials are suitable for a wide range of die sizes, 150 x 150 mil square to 1000 x 1000 mils square. For more information, contact Ablestik, 20021 Susana Rd., Rancho Dominguez, CA 90221, phone 310.764.4600, fax 310.764.2425. [ablestik.com]

Allteq Industries System 888 Air Ionizer

The Allteq System 888 cleans leadframes at the process point while it controls static discharge. Allteq can quickly fit the System 888 directly to your die or wire bonders, inspection stations or molding equipment. We can even supply a fully automatic cleaning system for you.

While it's not possible to give exact figures, in many cases, the yield savings alone will pay for the unit in as little as six weeks. For no-obligation details, write cleanair@allteq.com or visit our Web site at allteq.com.

Ismeca MP600 Wafer-to-Tape Machine

Ismeca is offering an illustrated data sheet detailing the features and specifications of its MP600, a fully-automatic die transfer system designed to pick bare die from wafers for vision inspection and output to carrier tape.

The MP600's advanced vision system inspects for mark, ink dot, mechanical integrity and orientation. For a free copy of the MP600 data sheet, please call 760.305.6200, or visit Ismeca online at [ismeca.com.]

Fastest Tray - to - Tape Solution

Logical Automation's innovative LA 8300 tape handler with dual taping stations moves five devices at a time for non-stop productivity. Contact us for details on Logical Automation's entire backend roadmap, including strip test, off-line sort and next generation BGA handlers. Logical Automation, 3374 Gateway Blvd., Fremont, CA 94538, phone 510.438.6600, fax 510.438.6609. [logicbot.com]

Onshore Hi-Rel IC Package Assembly

Pantronix, Corp., with 26 years of experience in IC assembly, offers an extensive selection of package formats. Quality-certified to almost all international standards, Pantronix offers fast cycle times and unmatched responsiveness. Through our affiliation with Amertron in the Philippines, we can package ICs in virtually any quantity.

Visit our website at www.pantronix.com.

S-TBGA Package Assembly

Signetics, the experience leader in IC assembly, offers one of the industry's widest ranges of package types, including the S-TBGA format. The S-TBGA is available in body sizes of 27 mm x 27 mm, 31 mm x 31 mm and 40 mm x 40 mm with a variety of ball counts. Since 1966, Signetics has delivered quality, global customer support and advanced packaging and test technology.

For more information, e-mail: department400@signeticsusa.com or visit our web site at www.signetics.com