Media Kit
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 Current Advertisers

List of the sponsors

 Publisher's Letter
Good News for CSR Readers
 
 Assembly Lines
Amkor Technology Inc. Plans Expansion to China and Taiwan
 
 Electronic Trends
IC Packaging Foundries Can Look Forward to Solid Growth
 
 Standards
Changes to JEDEC's Moisture Sensitivity Classification for SMDs Likely Soon
 
 Wafer - Level Watch

Packaging's Value Added: Greater Functionality for Integrated Circuits

 
 Harvey Miller's Notebook

Lead in Solder, Bromine in Epoxy: Guilt by Association?

 
 On Test
ATE Conspiracy? Vendors Can't Cooperate Enough to Conspire!
 
 CSP Automation
Die Trace for CSPs Isolates Manufacturing Problems
 
 Flip - Chip Focus
Flip-Chips: Some History, a Tutorial and a Few New Perspectives
 
 Industry News
50th ECTC Packs 'Em in Amid Vegas' Glitter
Korean Multi-National Firm Acquires Signetics Korea Ltd.
People in the News
Company News
Calendar of Events
 
 Features
IC Packaging: Advanced Technology, Not Cheap Labor, Is Now the Driver
IC Packaging Foundries
What IC Packaging Foundry Users Want
Will Wall Street and IC Assemblers Make the Perfect Marriage
High Silicon Integration Levels and CSPs to Meet Wireless' Tight Space Demands
Dynamic Growth and Change Highlight the IC Packaging Industry
BGA Nomenclature
The Good, the Bad and the Ugly: How to Select a Packaging Foundry
Comparing Flip-Chip and Wire-Bond Interconnection Technologies
Selecting the "Right" Test Vendor Can Improve Yields and Cut Costs
An Expert Looks at the Issues™
 
 Technology Trends
A Novel Approach to Ball Attachment Maximizes Efficiency and Floorspace
 
 Tools & Technologies
Universal Instruments Adds Camera and more
 
 Literature Review
New Book in Professional Engineering Series and more
 
 Patents
Chip and Board Stress Relief Interposer
 
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An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics

July - August 2000

Email the editor

 Good News for CSR Readers

I've got good news for readers of this magazine: Next year, Chip Scale Review will expand its publishing schedule from six to eight issues. Our stunning growth is due largely to you, our loyal readers, and to our growing roster of advertisers. That means, more than ever before, that we need your original articles. We need you to sit down at the computer and let the pride of authorship surround you!

Tell us what you're doing in the world of advanced IC packaging and test. Neatness counts, but we don't expect polished prose; we're looking for solid content. Our editorial staff will take care of the English niceties.

Got an idea? An abstract? An article ready to go? Contact Editor Ron Iscoff at chipscale@cs.com. As we've said before, "This is your magazine!"

Next year you'll receive bi-monthly issues for January-February, May-June, August-September and November-December. The balance will be issued monthly. Space permitting, we'll publish our 2001 editorial calendar in the September-October issue. (You'll also be able to find it at our web site: www.ChipScaleReview.com).

We would also like you to point your mouse in the direction of our web site, above, when you need advertiser information fast. Working with Supersite.Net, we've developed Online Reader Service, which promises to revolutionize the way you receive follow-up information from advertisers. Try it. I think you'll like it.

Finally, by early next year you should receive your copy of Chip Scale Review much faster than you do now.

We mail third class (bulk rate) from the Midwest, where the magazine is printed, and it often takes two weeks for copies to reach the West Coast. That will change as soon as we qualify for second class mailing, probably in the first quarter of next year. Thanks for your patience and your continued support.

Hopefully, most, if not all, of you will receive your copies prior to SEMICON West in July. Please stop by and visit us at booth 15125, Civic Hall, at the San Jose Convention Center.

Gene Selven, Publisher
gselven@aol.com.

 
 
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