Universal Instruments Adds Camera
Using the 0.8 mil per pixel MegaView, devices up to 16 mm square, with a lead pitch of 4 mils and features as small as 2 mils can be scanned in a single field of view. Universal Instruments Corp., P.O. Box 7429, Endicott, NY 13760, universal@uic.com, phone 800.432.2607. [uic.com] Shin-Etsu Debuts New Fluoroelastomers Shin-Etsu MicroSi has introduced a new series of fluoroelastomer materials, Shin-Etsu SIFEL products, developed and manufactured by its Tokyo-based parent company, Shin-Etsu Chemical Ltd. The manufacturer terms SIFEL products "an entirely new class of fluoroelastomers, which are available in paste or liquid form. SIFEL cures into resilient elastomers and is highly versatile for preparing high-performance liquid injection molding/ molding compounds, adhesives, coatings and potting gels. Shin-Etsu says SIFEL is easily fabricated and is exceptionally resistant to a wide variety of chemicals, including solvents, fuels, oils and strong acids. Compared to conventional fluoroelastomers, which become solid at temperatures below 0oC and lose their elasticity, SIFEL maintains elasticity even at temperatures below -50oC. Shin-Etsu MicroSi Inc., 10028 S. 51st St., Phoenix, AZ 85044, phone 480.893.8898. [microsi.com] Fuji Color-Coded Replacement Nozzles WP Sales, an after-market supplier of nozzles and parts, has introduced a new line of color-coded replacement nozzles for the Fuji CP-IV and CP-VI placement systems. Color coding enables immediate size determination without the need for calipers, which reduces the chance for errors on the production floor.
WP Sales, 2317-D Roosevelt Drive, Arlington, TX 76016, phone 817.459.1091. [wpsales.com] IDI Offers Replacement HP Test Probe Interconnect Devices Inc. has added the SX-25-HP-3.5-DG as a drop-in replacement probe for Hewlett Packard's 3070 Series test systems. Additionally, the probe is well suited for functional and in-circuit fixtures. The probe features a large tip diameter designed for contacting mispositioned leads, connector terminals and very large pads. Other design attributes include a 0.090 in. (2.29 mm) diameter raised, serrated tip with 21 points to ensure excellent electrical contact and a probe barrel of DuraGold, IDI's proprietary high-performance material. A gold-plated stainless steel spring provides a force of 3.5 oz. at 0.170-in. (4.32 mm) rated travel. IDI, 5101 Richland Ave., Kansas City, KS 66106, info@idinet.com, phone 913.342.7043. [idinet.com] Chipscale Robotics Introduces New Prober Chipscale Robotics Inc. has introduced the APS 200 automatic film-frame wafer prober, which can be used either as a stand-alone system or docked directly to Chipscale Robotics' line of pick-and-place tape-and-reel systems. Chipscale Robotics Inc., P.O. Box 640758, San Jose, CA 95164, 510.490.4104. [chipscalerobotics.com] CDS Enhances Package Design Software CAD Design Software has added advanced stacked-die packaging-specific EDA tools to its Semiconductor Packaging Designer Suite.
The suite is a complete IC packaging design system that now includes stacked-die commands for automating stacked die package design. Among the special software features that automate stacked-die design is the ability to stack up two or three dies and automatically locate bond wires and bond fingers at the correct angles. Users can place any number of dies into the same stack-up to provide for multiple die sourcing. Before the development of these enhanced stacked-die tools, a design engineer had to painstakingly calculate each bonding location and angle and then draw them manually. Now, the engineer keys in the design parameters and the software automatically generates the custom bond pads at their correct angle. CAD Design Software, 3211 Scott Blvd., Santa Clara, CA 95054, gjensen@cad-design.com, phone 408.748.0124. [cad-design.com]
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