Datacon Offers 3D Inspection System Datacon is offering the Model 8000is 3D inspection system, targeted for quality assurance in the production of bumped wafers. The unit analyzes the 3D images employed in bump-, wire-, wafer- and post-bonding inspection and can also be used to inspect the quality of bonding and soldering pastes. The "eye" of the unit is a specially developed 3D laser scanner head incorporated in an X-Y positioning system.
The 8000is can be used to inspect 4 inch (100 mm) through 12 inch (300 mm) wafers, as well as substrates and leadframes. Datacon Semiconductor Equipment GmbH, Innstrasse 16, A-6240 Radfeld, Austria, +43.5337.600.104. [datacon.at] Quad Systems Unveils IC Tube Feeders Quad Systems has introduced multilane, belt-driven tube feeders, an alternative to vibratory feeders, for faster and more accurate component presentation for most PLCC, SOIC and SOJ packages. The feeders enable users to replenish components without removing the feeder from the assembler and without halting production. The feeders also reduce parts pick-up errors, common with vibratory feeders, when one component puts pressure on the next device being picked, according to Quad Systems.
Quad Systems Corp., Willow Grove, PA, phone 800.782.3872 or 215.657.6202. [quad-sys.com] CAMALOT Adds Dispensing Enhancements Two new features on Speedline CAMALOT's Xyflex dispensing machine offer the IC packaging market greater speed and accuracy for underfill and encapsulation. The enhancements are an automated weight calibration system, coupled with a fast, highly repeatable, multi-piston pump.
The weight calibration system ensures greater precision in process control and more economic use of materials, according to CAMALOT. Speed and precision are enhanced with the new multihead pump that offers better than +/-1% repeatablility and a "no-drip" design. The pump requires no recharge time. Speedline Technologies, 16 Forge Park, Franklin, MA 02038, clazinsky@speedline.cookson.com, phone 978.521.7309. [speedlinetechnologies.com] TI Debuts 0.5 mm Pitch Burn-in Sockets Texas Instruments Interconnection Business has announced a 0.5 mm pitch CSP burn-in test socket designed for high-volume use with logic and memory ICs. The socket is aimed at supporting the growing market of wireless devices, such as cell phones and PDAs, which rely on fine-pitch ICs to achieve high performance. The socket features a clamshell design for easy insertion, and compression-style micro-spring contacts for robust yet sensitive contact with the delicate solder balls. To ensure a robust connection during testing, the new socket is held onto the burn-pin board with screws that compress the contact elements and provide a semipermanent interconnection. Texas Instruments Interconnection Business, 111 Forbes Blvd., Mansfield, MA 02048. [ti.com/mc/igb] New Printer for Machine Vision Verification Surface Mount Techniques has introduced the 2220PTV inline-automated printer for applications where machine vision verification is essential to maintaining high yields against changing board tolerances, varied product mix and ultra-fine-pitch printing. The unit incorporates SMT's advanced ACCU-LIGN Series 3 vision system, which offers visual recognition of fiducials/pads and motor-driven alignment of the tooling plate for highest accuracy. Advanced features include adjustable magnetic PWB support, an understencil wiper module and motorized or programmable conveyor width adjustment. A Pentium/Windows-based single-processor-controlled operating system offers the simplicity of an interactive point and click graphical user interface. Surface Mount Techniques, 23042 Alcalde, Unit C, Laguna Hills, CA 92653, phone 768.949.0178. [surfmntteq.com] Electroglas Adds Film-Frame Wafer Prober Electroglas Inc. has introduced the Model 4090f film-frame wafer prober, aimed at ultra-thin or diced wafers. Where needed, such as with micromachined accelerometers and other die that require special processing, probing can be postponed until after dicing. The prober's software automatically compensates for the slight spread of the separated chips.
The ability to probe after dicing also facilitates the delivery of known good die from various CSPs and c-o-b processes. The 4090f is also suited for use with brittle GaAs wafers. The unit will enable makers of GaAs devices to avoid physical stress on finished wafers during testing. Electroglas Inc., 6024 Silver Creek Valley Rd., San Jose, CA 95138, phone 408.528.3000. [electroglas.com]
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