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 Publisher's Letter
SEMICON West: What a Difference a Year Makes!

 Assembly Lines
STS Defies Conventional Onshore Model for IC Package Assembly Plant

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RF Packaging Poses New Challenges

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Standardization of Quad and Dual-Inline Leadframe-Based CSPs Is Accelerating

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Stanford Seminar Program Gauges the Impact of WLP

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Strip Handling Promises Better Throughput

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Special Report: Flip-Chip Packaging - A 32-Year-Old Infant Grows Up
Bumping Services Provider Directory

Cover Story: Steppers vs. Aligners - Two Technologies Race for the Finish Line in Wafer-Level Packaging

Stacked Chip-Scale Packages: They're Not Just for Cell Phones Anymore!

Known-Good Die for Stacked CSPs: It's Not Your Father's KGD Anymore!

Packaging Trends in Cellular Phone Applications

An Expert Looks at the Issues: Dr. Tadatomo Suga on Interconnection Technology

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Wafer Bumping: A Guide to Selecting the 'Correct' Process

 Technical Forum
A Semi-Additive Electroless Ni/Au Process Offers a Low-Cost Wafer-Bumping Method

The Effects of Pb Contamination on Lead-Free Sn/Ag/Cu/In Solder

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ESEC's 3088iP Wire Bonder and more...

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Wafer-Level Packaging Is the Next IC Revolution

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CSP Manufacturing Process Lowers Production Cost and Improves Yield

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Current Issue
An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics
July 2001

SEMICON West: What a Difference a Year Makes!
Gene Selven
Publisher

Well, here we are again. It's nearly time for one of the premier semiconductor equipment shows in the world. This time around, however, the industry has been humbled. Last year, the sky was the limit. This year, we've come back down to earth.

Still, there's one thing we can count on: The inevitable recovery is just around the corner (or perhaps around the second half).

Since I'm writing this column before the show, I won't be able to comment on the exhibits or what visitors said in San Jose. But for a moment, let me speak about my trip to SEMICON Europa in April.

Held at the magnificent New Munich Trade Fair Centre in Munich, Germany, there were more than 900 companies represented, with an estimated attendance of 13,000.

I estimated that we would need 750 copies of Chip Scale Review to pass out to visitors over the three days. The magazines were gone the first day as 3,000-4,000 people passed through the entrance.

The mood of the exhibitors and attendees was relatively bullish. Europe, traditionally, has followed a U.S. downturn (or recovery) by about six months. Judging from many of the companies I spoke with, this still seems to be the case, although business discussions were sprinkled with some caution.

At the same time, many of the exhibiting companies, such as Datacon, Epoxy Technology, ESEC and Suss were announcing new products, while others talked about launching major product lines at SEMICON West.

Chip Scale Review is no exception regarding new programs and products to complement our existing publication.

Beginning with the next issue, we'll add editorial material on optical and MEMS packaging. These explosive growth areas will extend the roadmap of our magazine well into the next decade.

Beginning with this issue, we are introducing ChipLinks,ª a dynamic online reader service. Look for further details in this issue (and at our website: ChipScaleReview.com). This web-based reader service will enable you to get the latest product information from advertisers quickly and easily.

Don't forget to stop by Civic Hall booth 15125 in San Jose and say hello during SEMICON West.

Gene Selven, Publisher

[gselven@ChipScaleReview.com]

 
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