Media Kit
For advertisements and demographics
click here
On Line Reader Service
 Publisher's Letter
300 mm Bumps and Grinds at 'Europa'

 Assembly Lines
UTAC's J.C. Lee Is 'The Man with the Plan' for the Singapore IC Assembler

 Opto-Electronically Speaking
Keep Those Cards & Letters Coming

 Electronic Trends
Chip Industry Growth to Return

 The View from Europe
European Fabless Companies Facing a Variety of IC Packaging Challenges

 The View from Asia
Hong Kong's Laissez Faire Approach Hastens Local IC Packaging's Demise

 Wafer-Level Watch
Wafer-Level Packaging Is Driving the Convergence of Fab and Assembly

 Packaging Insights
Look for Wafer-Level Packaging to Rule as the Natural Choice for Opto Packages

 Harvey Miller's Notebook
E-Waste Is the New Growth Industry!

 Industry News
Company News
Packaging Foundries
Opto/Nanotechnology
People in the News
Calendar of Events
Editorial Index

 Features
Special Feature: IC Package Design - Growing Chip Complexity Is Pushing the Envelope in CAD Design Tools
Special Feature: STATS Develops Design/Documentation Interface

IC Package Design Software Suites

Cover Story: Wafer Bumping - As the Technology Moves into the Mainstream, Some Technical Issues Remain

Cover Story: APiA - Advanced Packaging and Interconnect Alliance: Targeting Enhanced Productivity

Cover Story: SECAP - A Consortium to Address Equipment Integration Issues in Wafer-Level Packaging

International Directory of Wafer Bumping Service Providers

Cover Story: How Automated Visual Inspection and CD Metrology Will Impact Wafer-Level Packaging

Feature: Wafer-Level Packaging - Making 300mm a Reality

Emerging Technolgies: High-Resolution, Large-Area Projection Lithography Offers a New Alternative for Wafer-Level Packaging

Emerging Technolgies: A Lithography Cluster for Wafer-Level Packaging

 Tools & Technologies
K & S Introduces Bonder and more...

 Patents
Chip-Stacking Method Employs Standard Packaging Technology

 Archives
2002
Jan-Feb Mar-Apr May-Jun
July    
2001
Jan-Feb March April
May-June July Aug-Sep
October Nov-Dec  
2000
Jan-Feb Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec
1999
Jan-Feb Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec
1998
  Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec


Subscription

 
Current Issue
The International Reference for Chip-Scale Electronics, Flip-Chip Technology, Optoelectronic Interconnection and Wafer-Level Packaging
July 2002

Chip Industry Growth to Return
Steve Berry and Sandra Winkler
Contributing Editors

After a fabulous upturn in 1999 and 2000, the semiconductor industry crashed downward last year, continuing the boom/bust cycle that has characterized the industry from its beginning.

This latest boom/bust cycle was, in large part, created by the "dot com to dot compost" saga. However, the electronics industry deserves a share of the blame, because the layers added to the supply chain over the last decade contributed heavily to an out-of-control inventory situation.

The Future

So where does the industry go from here? We are optimistic that growth will return this year. Based on the expected worldwide economic growth in 2002 of just over three percent, IC units should grow a bit over 10 percent in 2002.

Unit growth should continue to propel the industry, as IC volume grows from 68.5 billion units in 2001 to 123.0 billion units in 2006-a compound annual growth rate (CAGR) of 12.4 percent. The table details our expectations for the split of IC packages by package family.

While the prospects for unit growth seem solid, we believe that the astonishing level of competition in the semiconductor industry will tend to keep the industry in a general state of oversupply. We expect IC revenue growth to trail IC unit growth throughout the coming years, as a result of price pressure created by this oversupply.

IC Packaging Revenue

If all IC packages had been assembled by independent IC packaging foundries, the total assembly "revenue" would have been $13.7 billion in 2001, representing a 34 percent decrease from 2000.

Worldwide IC Shipments by Package Family
Units(M) 2001 2002 2003 2004 2005 2006 CAGR
DIP 6505 6397 6855 7060 6930 7355 2.49%
SO 41555 46841 54171 62825 65579 73017 11.93%
CC 1770 1778 1912 2141 2152 2369 6.00%
QFP 7493 7925 8954 10306 10737 12347 10.50%
PGA 256 261 319 359 401 476 13.20%
BGA 2302 2691 3280 3930 4155 4916 16.38%
CSP 3258 4585 6481 8871 10373 12671 31.21%
DCA 5410 6053 7188 8341 8784 9895 12.83%
Total 68549 76531 89161 103833 109111 123045 12.41%
Source: Electronic Trend Publications
As the table illustrates, demand for ICs will grow from 68.5 billion units in 2001 to 123 billion units in 2006.

This figure is predicted to expand to $21.6 billion by 2006, at a 9.5 percent CAGR. As with overall industry revenue, packaging revenue growth will trail unit growth over the next five years as competition leads to considerable pricing pressure.

Packaging Providers

The forces at work in 2001 caused a considerable disruption in the efforts of the packaging foundries to assume a larger share of the industry's IC packaging work.

In 2001, packaging foundries assembled a total of 14.3 billion ICs. This was an astonishing 27 percent drop from 2000. This number will grow, however, to 29.5 billion packages in 2006-a CAGR of 15.5 percent, which is far below the high-growth days of the previous decade. Packaging providers today are more focused on profitability than on growth.

The revenue generated by the packaging foundries was $5.2 billion in 2001-a huge 41 percent drop from 2000. Revenue should grow to $9.7 billion in 2006.

Sounding a Cautionary Note

ETP believes that the semiconductor industry will grow in 2002 and the immediate years beyond. However, a cautionary note should be sounded: The industry rode PCs, cell phones and Internet infrastructure equipment through the last boom.

After two decades of growth, however, these products are nearing saturation levels in the developed countries. To continue high growth levels over the next two decades, significant new products-in the class of "killer" applications-must be added to the mix. Such products have yet to appear.

Electronic Trend Publications (ETP), San Jose, is a market research firm specializing in all phases of electronics manufacturing, from wafer fabrication through final assembly. [electronictrendpubs.com]

 
Copyright © 2002