Current Issue The International Reference for Chip-Scale Electronics, Flip-Chip Technology, Optoelectronic Interconnection and Wafer-Level Packaging July 2002 Email the editor

Editor's Note: Chip Scale Review recently asked APiA and SECAP to contribute a one-page summary of their mission and activities.

A rapidly growing semiconductor market likely contains the key to sustained advances in the electronics industry. Recently, considerable attention has been focused on advances in packaging and interconnect technologies as a way to bridge the gap between IC front- and backend manufacturing efficiencies.

Change provides opportunities for forward-thinking equipment and materials suppliers and companies that develop processes to implement new technologies cost effectively.

Many realize that addressing the challenges of creating high-performance, low-cost IC packaging requires innovative solutions that will only result from collaboration between the industry's leading companies.

The Advanced Packaging and Inter-connect Alliance is an association of leading equipment, process technology and process materials companies focused on accelerating the development and implementation of commercially viable, comprehensive and low-risk packaging solutions.

Diagram of APiA member's focus areas for flip chip and wafer-level packaging process flow.

Enhanced Productivity

APiA targets enhanced productivity with equipment and process innovations for advanced packaging and interconnect processes, and also develops guidelines and standards to enable adoption of these sophisticated solutions.

APiA's formation was announced in December, after more than a year of planning. That time was spent ensuring that the founding members had viable technical solutions, financial strength, a commitment to the market and global representation.

During the ensuing months, 16 additional member companies were admitted and 11 applicants are now being reviewed. Why have 34 of the world's leading companies and institutions begun collaborating to address market needs?

Clearly, the companies recognize an opportunity to benefit financially. APiA attracts this interest and support because of the Alliance's philosophy and approach, says Ellery Buchanan, the chairman of the Alliance and Ultratech Stepper's senior vice president of marketing and corporate development.

"The members realize that expanding the focus on packaging and interconnect solutions expands the available market," Buchanan says. "Commercial solutions that have the most dramatic beneficial impact on yield will then become widely adopted. Our ultimate focus is the final customer who designs, manufactures, assembles, tests and utilizes the flip chip or WLP in its final form." adds Buchanan.

Accelerating Development

The initiative's charter is to accelerate development and implementation of commercially viable packaging solutions for increasingly intricate, leading-edge chips.

APiA fosters an open dialogue between equipment suppliers and chipmakers-serving as a forum to discuss interconnect issues and requirements-as well as providing a venue for members to share technology, process and market information.

Also critical will be developing wafer-level chip-scale packaging and high-density substrate technologies for advanced applications. APiA will draw on member contributions and a steering committee to set policy and oversee activities with subcommittees contributing in defined areas.