Media Kit
For advertisements and demographics
click here
On Line Reader Service
 Publisher's Letter
300 mm Bumps and Grinds at 'Europa'

 Assembly Lines
UTAC's J.C. Lee Is 'The Man with the Plan' for the Singapore IC Assembler

 Opto-Electronically Speaking
Keep Those Cards & Letters Coming

 Electronic Trends
Chip Industry Growth to Return

 The View from Europe
European Fabless Companies Facing a Variety of IC Packaging Challenges

 The View from Asia
Hong Kong's Laissez Faire Approach Hastens Local IC Packaging's Demise

 Wafer-Level Watch
Wafer-Level Packaging Is Driving the Convergence of Fab and Assembly

 Packaging Insights
Look for Wafer-Level Packaging to Rule as the Natural Choice for Opto Packages

 Harvey Miller's Notebook
E-Waste Is the New Growth Industry!

 Industry News
Company News
Packaging Foundries
Opto/Nanotechnology
People in the News
Calendar of Events
Editorial Index

 Features
Special Feature: IC Package Design - Growing Chip Complexity Is Pushing the Envelope in CAD Design Tools
Special Feature: STATS Develops Design/Documentation Interface

IC Package Design Software Suites

Cover Story: Wafer Bumping - As the Technology Moves into the Mainstream, Some Technical Issues Remain

Cover Story: APiA - Advanced Packaging and Interconnect Alliance: Targeting Enhanced Productivity

Cover Story: SECAP - A Consortium to Address Equipment Integration Issues in Wafer-Level Packaging

International Directory of Wafer Bumping Service Providers

Cover Story: How Automated Visual Inspection and CD Metrology Will Impact Wafer-Level Packaging

Feature: Wafer-Level Packaging - Making 300mm a Reality

Emerging Technolgies: High-Resolution, Large-Area Projection Lithography Offers a New Alternative for Wafer-Level Packaging

Emerging Technolgies: A Lithography Cluster for Wafer-Level Packaging

 Tools & Technologies
K & S Introduces Bonder and more...

 Patents
Chip-Stacking Method Employs Standard Packaging Technology

 Archives
2002
Jan-Feb Mar-Apr May-Jun
July    
2001
Jan-Feb March April
May-June July Aug-Sep
October Nov-Dec  
2000
Jan-Feb Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec
1999
Jan-Feb Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec
1998
  Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec


Subscription

 
Current Issue
The International Reference for Chip-Scale Electronics, Flip-Chip Technology, Optoelectronic Interconnection and Wafer-Level Packaging
July 2002
Opto/Nanotechnology
Photo: Nanotube tips are grown by CVD on a nickel substrate. The nanotubes taper at the top, making them look like nanoscopic versions of the Washington Monument. (Boston College Physics Department)

Start-Up Wins Army Contract to Ramp Nanotube Production

Boston, Mass.-NanoLab, a nanotech start-up, has been awarded $750,000 in SBIR Phase II contract funding from the U.S. Army to ramp up production of multiwalled carbon nanotubes.

The company expects to soon be able to produce one kilogram/day. NanoLabs develops products based on bulk and aligned carbon nanotubes-hollow crystals of carbon, less than 50 nm in diameter.

Nanotubes are stronger than steel and more electrically conductive than copper. Aligned carbon nanotube arrays can be employed to create chemical sensors, nanotweezers and field emission products such as FPDs.

Designs using nanotube arrays can also be used to reduce the cost of optical components such as fiber-optic signal demultiplexing devices.

Nanotubes are produced using a chemical vapor deposition (CVD), where growth is accomplished by exposing a carbon-containing gas to a catalyst. By patterning a catalyst film on a suitable substrate, patterned nanotube arrays can be grown. [nano-lab.com]

Vishay Completes Acquisition of Infineon's Malaysian Plant

Malvern, Pa.-Vishay Intertechnology Inc., has assumed full ownership of the Krubong, Malaysia, production facility where the infrared product lines acquired from Infineon Technologies are tested and assembled.

Devices manufactured at the 56,000- square-foot plant include optocouplers, solid-state relays, infrared data communication transceivers (IRDCs), and custom optoelectronic devices. With the acquisition of Infineon's entire infrared components business, Vishay became the largest supplier outside Japan of optocouplers and the largest supplier worldwide of IRDCs. [vishay.com]

Photo shows Digital Optics Corp's. Photonic Chips, created at the company's wafer-based integrated optical assembly facility in Charlotte, N.C.

Bell Labs Invents Technique for Imaging Atoms Within Si

Murray Hill, N.J.-Bell Labs scientists, the R&D arm of Lucent Technologies, have discovered a way to peer deep inside a semiconductor and create an image of a single impurity atom in silicon.

The Bell Labs technique is extremely sensitive and can be applied to almost any material, not just semiconductors. It has already proved useful in trouble-shooting and characterizing optoelectronic components.

Creating an image of a single impurity may be key to understanding the limits of transistor scaling. The feat-the first time that an individual impurity has been pictured in its undisturbed state within a crystal-was achieved using a special electron microscope.

This breakthrough, first described in an article in the journal Nature, will enable scientists to gain an understanding of the way impurities influence the properties of semi-conductors, something that is needed to shrink the size of future generations of high-speed electronic equipment.

By using a scanning transmission electron microscope, a team led by physicist David Muller of Bell Labs succeeded in directly imaging individual antimony dopant atoms within crystalline silicon. [lucent.com]

Report Contains Good News for Players in OEO Cross-Connects

Charlottesville, Va.-A report from industry forecasters Communications Industry Researchers Inc. (CIRI), contains some good news for players in the OEO (optical-electrical-optical) cross-connect market.

In spite of the optical recession, CIRI predicts in The Future of Optical Switching: A Market Forecast 2002-2006, that the OEO market will grow from $668 million this year to $4.3 billion in 2006. [cir-inc.com]

Mitsui Matsushita Bows 3D Optics

Los Altos, Calif.-Mitsui Matsushita Co. Ltd. has introduced a glass-molded 3D lens and mirror designed to reduce costs for high-speed, high-capacity optical communications systems. Sumitomo Corp., the U.S. distributor, says the product enables a smaller footprint for optical transport systems. [sumitomocorp.com]

 
Copyright © 2002