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On Line Reader Service
 Publisher's Letter
300 mm Bumps and Grinds at 'Europa'

 Assembly Lines
UTAC's J.C. Lee Is 'The Man with the Plan' for the Singapore IC Assembler

 Opto-Electronically Speaking
Keep Those Cards & Letters Coming

 Electronic Trends
Chip Industry Growth to Return

 The View from Europe
European Fabless Companies Facing a Variety of IC Packaging Challenges

 The View from Asia
Hong Kong's Laissez Faire Approach Hastens Local IC Packaging's Demise

 Wafer-Level Watch
Wafer-Level Packaging Is Driving the Convergence of Fab and Assembly

 Packaging Insights
Look for Wafer-Level Packaging to Rule as the Natural Choice for Opto Packages

 Harvey Miller's Notebook
E-Waste Is the New Growth Industry!

 Industry News
Company News
Packaging Foundries
Opto/Nanotechnology
People in the News
Calendar of Events
Editorial Index

 Features
Special Feature: IC Package Design - Growing Chip Complexity Is Pushing the Envelope in CAD Design Tools
Special Feature: STATS Develops Design/Documentation Interface

IC Package Design Software Suites

Cover Story: Wafer Bumping - As the Technology Moves into the Mainstream, Some Technical Issues Remain

Cover Story: APiA - Advanced Packaging and Interconnect Alliance: Targeting Enhanced Productivity

Cover Story: SECAP - A Consortium to Address Equipment Integration Issues in Wafer-Level Packaging

International Directory of Wafer Bumping Service Providers

Cover Story: How Automated Visual Inspection and CD Metrology Will Impact Wafer-Level Packaging

Feature: Wafer-Level Packaging - Making 300mm a Reality

Emerging Technolgies: High-Resolution, Large-Area Projection Lithography Offers a New Alternative for Wafer-Level Packaging

Emerging Technolgies: A Lithography Cluster for Wafer-Level Packaging

 Tools & Technologies
K & S Introduces Bonder and more...

 Patents
Chip-Stacking Method Employs Standard Packaging Technology

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Current Issue
The International Reference for Chip-Scale Electronics, Flip-Chip Technology, Optoelectronic Interconnection and Wafer-Level Packaging
July 2002
People in the News
Paul Sakamoto

Sakamoto Joins Inovys Corp. as Chief Executive Officer

Pleasanton, Calif.-Paul M. Sakamoto has joined Inovys Corp., a maker of test systems and software, as chief executive officer. Sakamoto, a contributing editor and frequent columnist for Chip Scale Review, was most recently vice president and general manager of the Memory Test Division at Credence Systems, Fremont, Calif.

Earlier, he was vice president of sales at Micro Component Technology, director of sales development at Megatest and with Intel Corp. for six years. He is a graduate of Oregon State University and holds a BSEE. [inovys.com]

Xanoptix Welcomes Moore as Vice President of Sales

Merrimack, N.H.-Xanoptix, a developer of high-speed optical connectors, has appointed Karen Moore vice president of sales. Prior to joining Xanoptix, Moore held various sales and applications engineering posts with Corning's Photonic Technologies Division.

Earlier, she was regional sales manager at Nufern, a specialty fiber company. She is a graduate of the U.S. Naval Academy with a bachelor's degree in systems engineering and obtained an MBA from Syracuse University. [xanoptix.com]

UTAC Appoints Alcantara Technical Program Manager

Pleasanton, Calif.-UTAC America Inc. has appointed Ariel Alcantara technical program manager, reporting to Dr. Anthony Sun. Alcantara will act as liaison between customers and the UTAC factory in Singapore.

Alcantara was most recently sales manager for Silicon Turnkey Solutions, Manteca, Calif. [utac.com.sg]

Nicholas Leonardi

Tiros Names Leonardi Worldwide Sales Manager

Tempe, Ariz.-Tiros Corp., a manufacturer of reflow furnaces, has appointed Nicholas Leonardi its worldwide sales manager.

Leonardi, a member of the MEPTEC Editorial Advisory Board, was most recently sales manager at Auer Precision, Mesa, Ariz. [tiros.com]
Jack Trautman

Agilent Technologies Appoints Trautman GM of Test Group

Palo Alto, Calif.-Agilent Technologies has appointed Jack Trautman senior vice president and general manager of Agilent's Automated Test Group. He replaces John Scruggs, who retired after a 29-year career with Agilent and Hewlett-Packard.

Trautman was most recently vice president and general manager of Agilent's Communications Management Solutions Business Unit. He earned a bachelor's degree in engineering from the University of Illinois, a master's in electrical engineering from Stanford and an MBA from INSEAD in Fontaine, France. [agilent.com]

Artwork Conversion Offers AIF Viewer as Free Download

Santa Cruz, Calif.-Artwork Conversion Software Inc. has created and released a new program, AIFVU, that reads and displays AIF files without additional software. The viewer is being offered as a free download "to simplify the adoption of the AIF file format throughout the packaging industry," according to Steve DiBartolomea, Artwork's applications manager. The code will be supported by the company, which will provide updates as needed for its site. [artwork.com/ package/aif2apd/index.htm]

FormFactor Files with the SEC

Livermore, Calif.-FormFactor Inc. has filed a registration statement with the SEC for a proposed public offering of its common stock. The filing provides for an offering of up to $100 million.

The company is a developer and vendor of advanced IC wafer probe cards. [formfactor.com]

Aries Electronics Names Batis New Rep for N. Cal. and Nevada

Frenchtown, N.J.-Aries Electronics has appointed Robert Batis Inc. its rep for Northern California and Nevada, excluding Clark County.

Owner Robert Batis will work with Aries to market the company's high-frequency test sockets throughout the region. [arieselec.com]

Palomar Technologies Elevates King to VP-Sales and Support

Vista, Calif.-Palomar Technologies has promoted Jeffrey King to vice president of sales and product support.

King joined Palomar in 1988, when it was part of Hughes Aircraft. He has held several engineering, marketing and sales posts with the company. [bonders.com]

Koh Joins Electroglas as GM for Asian Manufacturing

San Jose-Chin Koon Koh has joined Electroglas Inc. as general manager of Asian manufacturing operations, based at Electroglas' new facility in Singapore.

Koh was most recently Asia Pacific operations director for 3Com Corp. [electroglas.com]

Cookson Electronics Chemistry Promotes Corbett to President

West Haven, Conn.-Steven J. Corbett has been promoted to president of Cookson Electronics Chemistry (Enthone), replacing Barry Luther, who resigned to pursue other interests. Corbett reports to Joseph Santolucito, president of Cookson Elec-tronics PWB Materials and Chemistry Group. [cooksonelectronics.com]

 
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