K&S Introduces Bonder, Capillary Material Kulicke & Soffa Inc., Willow Grove, Pa., has introduced the Nu-Tek, an automatic ball bonder designed to provide maximum yield and productivity in high-density matrix and small outline packages. K&S says that the Nu-Tek is substantially faster than the K&S 8028-S, one of the fastest ball bonders currently sold. The Nu-Tek can handle wire diameters ranging from 0.7-2 mils. The machine is in-line automation ready. Operator interfaces are compatible with the company's industry standard 8000 platform. The company also introduced ATLAS capillary material, claimed to offer the highest available mechanical strength and stiffness to enable increased resistance to breakage. The material is targeted at ultrafine-pitch ball bonding uses. The material's 0.45 micron average grain size allows a smoother surface finish and smaller hole diameter, enabling robust processes with fine bonding wire below 20 microns in diameter. [kns.com] IC Package Inspection System Makes Debut Electro Scientific Industries, Portland, Ore., has introduced the Model 8810 3D IC package inspection system. The machine is aimed at high-speed, 3D inspection of tray-fed BGAs and CSPs. The system is equipped with an integrated chip handling system, with three pickup heads for maximum sorting speed. [esi.com]
Patents Issued for Co-Axial Air Process Asymtek, Carlsbad, Calif., has been granted patents for its co-axial air process employed on the company's Century Selective Flux dispensing system. The co-axial technique is designed to increase the contact area between a viscous liquid and a substrate by using single or multiple bursts of pressurized air. The technique was invented by Bill Donges, Asymtek's product manager of conformal coating. [asymtek.com]
Thermal Gap Filler Pads for Electronics Fujipoly of America Corp., Carteret, N.J., has announced its SARCON XR-e and XR-j lines of thermal gap filler pads, composed of silicone gel sheets. The sheets are targeted at filling air gaps and uneven surfaces in a variety of electronic applications. The pads offer a thermal conductivity of 11 W/m-k for the XR-e and 14W/m-k for the XR-j. Made from silicone compound, the pads will easily adhere to components in a wide varity of shapes and sizes. They are also available in custom die-cut sizes. [fujipoly.com] Plasma Cleaning for WLP and Bumping Matrix Integrated Systems, Richmond, Calif., has introduced the Jaguar 300 single-wafer plasma cleaning system for wafer-level packaging, bumping, flip chip, redistribution and surface treatment. This system features dual process chambers and FOUP wafer load stations for continuous wafer processing and low cost of ownership. [gomatrix.com] Anti-Static, Low-Cost DIP Pin Straightener Aries Electronics, French-town, N.J., is now offering an anti-static version of a tool that provides a fast and low-cost means of straightening the pins of ICs in dual-in-line packages. [arieselec.com]
Test-Handling System Sees Defects After Wafer Dicing Electroglas Inc., San Jose, has introduced Pathfinder, a wafer, die and package test-handling system designed to catch defects post-dicing and post-thinning. The machine is fully automated and can accommodate a variety of devices, including singulated and ultrathin wafers, as well as film-mounted strips in either plastic or metal frames. [electroglas.com]
New Microvia Dielectrics Materials Toughened W.L. Gore & Associates Inc., Elkton, Md., has introduced MICROLAM 600 Series microvia dielectric products with optimized electrical and mechanical properties. The materials are toughened to ensure superior reliability in portable consumer products. The material is a drop-in replacement for resin-coated copper and minimizes dielectric cracking and provides improved PC board mechanical reliability, according to the company. [wlgore.com] New Stacked Package Enables Near-100 Percent Device Yield Tessera Technologies, San Jose, has announced the µZ Ball Stacked Package, the latest addition to Tessera's µZ product family. This package enables near-100 percent yield by allowing each die to be tested individually prior to stacking, which overcomes yield problems common to multichip packaging. A key application, according to Tessera, is the stacking of DDR-SDRAM chips, enabling OEMs and memory module makers to increase the density of their memory boards by up to 8x their current density. Tessera also reported that its µZ folded packaging technology now support the stacking of two folded stacked structures in a single package. [tessera.com] BGA Device Attach Advanced Interconnections Corp., W. Warwick, R.I. is now offering in-house BGA device attach and BGA solder ball reattach services. [advintcorp.com]
Dispense Valve Cartridges Target Micro Volume Users DL Technology, Haverhill, Mass., has introduced three styles of dispense-valve cartridges, precision machined for maximum dispensing accuracy in micro-volume applications. Available styles are floating/ fixed, large hub and Luer style. The floating/fixed cartridges are employed with DL footed/unfooted needles. Large hub style are used for larger multitip or X-form needles, and Luer style are for all metal and plastic Luer-type needles. [dltechnology.com] Photonics Assembly System Picks, Aligns and Places Objects Air-Vac Engineering, Seymour, Conn., has introduced a multi-functional robotic platform, the ONYX32, for unique assembly applications, including photonics, optoelectronics and ICs. The system can automatically pick, align and place any object with 1 micron accuracy. Quick-change end effectors provide dispensing and curing of glue and epoxy, convective reflow of eutectic compounds and conductive reflow of laser diodes. [air-vac-eng.com] Clean Probe Needles International Test Solutions of Livermore, Calif., has introduced the Probe Polish family of polymers for in-situ cleaning of rounded, radiused and cobra-type probes. [inttest.net]
Low-Dose X-Ray Mode Offers Better Imaging, Less Exposure Phoenix X-Ray Systems & Services, Camarillo, Calif., has announced an option to its x-ray systems that is designed specifically for inspecting high-rel components and boards. Termed the "low-dose/mode" option, the upgrade is targeted to applications in satellites, aerospace, military, medical and fail-safe industrial processes. The low-dose option upgrades the x-ray inspection system with the ability to block the unnecessary radiation exposure during movement and manipulation of parts and boards under test. [phoenix-xray.com] Semi-Auto Inspection Offers 2D/3D Views SolVision, Longueil, Canada, has introduced the Falcon 2D/3D semi-automated inspection system for bumped die and chip packages, including area array and leadless formats. The unit is based on the company's proprietary Fast MoirŽ Interferometry technology. According to the manufacturer, the unit provides complete z-topography of the entire field of view by employing the company's volume pixel acquisition technology to obtain x, y and z data for each pixel. [solvision.net] NanoVia LP Licenses Hitachi Exclusively NanoVia LP, Londonderry, N.H., has licensed its hybrid optical technology for laser microvia drilling to Hitachi Via Mechanics, Japan. Hitachi has also invested an undisclosed amount in the company. The duration of the exclusive Hitachi license is four years and calls for delivery of several optical subsystems for future Hitachi products. [nanovia.com]
Photonics Package in Joint Development Lumenon Innovative Lightwave Technology, Monreal, Quebec, Canada, says it has retained MTBSolutions, San Jose, to develop Lumenon's next generation of packaged optical components with the provider of photonic technology. Lumenon expects to introduce the next generation packaging with its product lines by fall 2003. [lumenon.com] Tamarack Delivers Projection Exposure System Tamarack Scientific Co., Corona, Calif., has delivered its first model 336 scanning projection tool, designed for use in solder bumping, to an undisclosed customer. Tamarack says its unit was selected for the exposure because it offers "the potential for significantly lower cost of ownership than alternative proximity aligners and projection steppers." [tamsci.com] |
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