The International Magazine for Device and Wafer-Level Test, Assembly, and Packaging Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS, MOEMS, RF/Wireless, Optoelectronic and Other Wafer-fabricated Devices for the 21st Century

July 2008
Chip Scale Review is produced for a worldwide audience of engineers, specialists, researchers and end-users of chip-scale and wafer-level back-end electronics manufacturing in print and digital editions. Chip Scale Review covers the chip-scale, flip-chip and wafer-level packaging market with a thoroughness unmatched by any other magazine.
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IWLPC 2014 Gold Sponsors
CSR Advertisers Stock Index
SymbolNameLastPct
Change
MMM3M Company145.71-0.67
AMKRAmkor Technology9.06-2.27
AMATApplied Materials21.94-2.71
EMNEastman Chemical83.83-1.16
HONHoneywell Intl.94.70-1.87
NEWPNewport Corp.17.62-2.11
NDSNNordson Corp.76.84-2.06
RTECRudolph Tech9.22-1.91
STSensata Tech46.41-0.17
SMGZYSmiths Group PLC21.660.28

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