The International Magazine for Device and Wafer-Level Test, Assembly, and Packaging Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS, MOEMS, RF/Wireless, Optoelectronic and Other Wafer-fabricated Devices for the 21st Century

July 2008
Chip Scale Review is produced for a worldwide audience of engineers, specialists, researchers and end-users of chip-scale and wafer-level back-end electronics manufacturing in print and digital editions. Chip Scale Review covers the chip-scale, flip-chip and wafer-level packaging market with a thoroughness unmatched by any other magazine.
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IWLPC 2014 Gold Sponsors
CSR Advertisers Stock Index
SymbolNameLastPct
Change
MMM3M Company144.220.15
AMKRAmkor Technology10.622.12
AMATApplied Materials22.93-0.76
EMNEastman Chemical83.070.73
HONHoneywell Intl.95.500.28
NEWPNewport Corp.18.81-0.32
NDSNNordson Corp.81.340.35
RTECRudolph Tech9.680.10
STSensata Tech49.00-0.35
SMGZYSmiths Group PLC21.93-0.36

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