The International Magazine for Device and Wafer-Level Test, Assembly, and Packaging Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS, MOEMS, RF/Wireless, Optoelectronic and Other Wafer-fabricated Devices for the 21st Century

July 2008
Chip Scale Review is produced for a worldwide audience of engineers, specialists, researchers and end-users of chip-scale and wafer-level back-end electronics manufacturing in print and digital editions. Chip Scale Review covers the chip-scale, flip-chip and wafer-level packaging market with a thoroughness unmatched by any other magazine.
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IWLPC 2014 Gold Sponsors
CSR Advertisers Stock Index
MMM3M Company138.95-1.40
AMKRAmkor Technology7.23-2.30
AMATApplied Materials20.49-1.40
EMNEastman Chemical77.63-0.60
HONHoneywell Intl.91.16-1.89
NEWPNewport Corp.17.53-1.85
NDSNNordson Corp.71.35-1.15
RTECRudolph Tech8.63-2.27
STSensata Tech45.17-0.88
SMGZYSmiths Group PLC18.33-4.09

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