The International Magazine for Device and Wafer-Level Test, Assembly, and Packaging Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS, MOEMS, RF/Wireless, Optoelectronic and Other Wafer-fabricated Devices for the 21st Century

July 2008
Chip Scale Review is produced for a worldwide audience of engineers, specialists, researchers and end-users of chip-scale and wafer-level back-end electronics manufacturing in print and digital editions. Chip Scale Review covers the chip-scale, flip-chip and wafer-level packaging market with a thoroughness unmatched by any other magazine.
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IWLPC 2014 Gold Sponsors
CSR Advertisers Stock Index
SymbolNameLastPct
Change
MMM3M Company153.661.03
AMKRAmkor Technology6.6311.06
AMATApplied Materials22.204.03
EMNEastman Chemical80.486.22
HONHoneywell Intl.96.270.71
NEWPNewport Corp.17.593.26
NDSNNordson Corp.76.441.12
RTECRudolph Tech8.790.80
STSensata Tech48.742.42
SMGZYSmiths Group PLC18.590.84

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