The International Magazine for Device and Wafer-Level Test, Assembly, and Packaging Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS, MOEMS, RF/Wireless, Optoelectronic and Other Wafer-fabricated Devices for the 21st Century

July - August 2011
Chip Scale Review is produced for a worldwide audience of engineers, specialists, researchers and end-users of chip-scale and wafer-level back-end electronics manufacturing in print and digital editions. Chip Scale Review covers the chip-scale, flip-chip and wafer-level packaging market with a thoroughness unmatched by any other magazine.
Read the Issue   Download Issue

Content on this page requires a newer version of Adobe Flash Player.

Get Adobe Flash player

CSR Stock Index
SymbolNameLastPct
Change
ASXAdvanced Semicond4.90-0.61
AEHRAehr Test Systems0.76-8.43
AMKRAmkor Technology6.23-3.26
AMATApplied Materials12.901.49
ASMIASM International37.760.27
CSCDCascade Microtech3.70-6.40
IMOSDIMOSD0.000.00
INTCIntel Corporation26.73-1.58
KLACKLA-Tencor Corpor48.300.19
KLICKulicke and Soffa11.24-1.49
LRCXLam Research Corp40.46-0.30
NEWPNewport Corporati18.540.22
NDSNNordson Corporati51.86-1.98
QCOMQUALCOMM Incorpor62.55-0.37
RTECRudolph Technolog10.33-2.09
STSensata Technolog31.53-0.35
SPILSiliconware Preci5.701.60
STMSTMicroelectronic7.24-1.09
TGALTegal Corporation3.50-1.96