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Features Attaching Die to Substrate: Rethinking a Traditional Assembly Process Ron Iscoff, Editor. CSPs are placing new demands on the makers of equipment for attaching and/or mounting the die to the substrate. Progress of Worldwide Standards for CSPs Dieter Bergman, IPC. Standards now being developed will help the infrastructure manufacture chip-scale packages and mount them-and bare die- on organic PC boards. Technical Forum Radial Lead Bonding Offers Increased Flexibility and Process control Joseph F. Lippincott Jr., Kulicke & Soffa Industries µBGA® Lead Bonding Process Requirements and Capabilities Daniel Bolliger, Christian Brändli and Daniel Zanetti, ESEC SA.