July - August 1999
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CyberOptics WaferGage Measures Thickness
CyberOptics has introduced the WaferGage, a noncontact, laser-based wafer thickness inspection system, targeted for a variety of specialized uses, including MEMS, read/write head and optoelectronics inspection.The unit features a 16-micron (0.016 mm) laser beam diameter and the capacity to collect submicron measurement data from wafers up to 100 mm thick and 150 mm wide.
WaferGage is a manual sampling tool utilizing dual CyberOptics DRS™ laser triangulation sensors. After performing a simple calibration procedure, the operator places a wafer in the holder on the microscope stage. One mouse click triggers thickness data collection. Because of its small laser spot size, WaferGage can distinguish even the smallest etchings and features, according to the company.
After the operator has captured the first thickness measurements, the manually adjusted x-y microscope stage may be used to reposition the wafer, enabling thickness readings to be collected at multiple locations.
CyberOptics Corp., 5900 Golden Hills Dr., Minneapolis, MN 55416, 612.542.5000, fax 612.542.5100.