Tables

Table 1: Amkor's CSPs and Near-CSPs

Package Size ChipArray® 5-15 mm (square package) 5 x 8 to 8 x 13 mm (rectangular option) FC-BGA 8 mm flexBGA 12-27 mm sq. body sizes µBGA® chip+0.5 mm MicroLeadframe™ near-CSP

Table 2: IC Packaging Foundries
Company Manufacturing Location U.S. Sales/Service Office European Sales/Service Office	Founded/Employees A=less than 100, B=100-249, C=250-499, D=500-1000, E=1000+ Stock Symbol (Exchange)	Customers by Region (%)	Types/Formats Ceramic, Plastic or Other	Max Leads/ Package Type/ Materials Offered/ CSPs	Other
Abpac Inc. 3201 E. Harbor Dr., Phoenix, AZ 85034 Gil Olachea, Vice President-Marketing golachea@abpac.com 602.431.1200, fax 602.431.0404 www.abpac.com	1996 B	N=100	BGA, CSP, Flip Chip, MCM	1140/PBGA	Final Test Package Design
Advanced Microtronics Technology Inc. Batam, Indonesia 7011 Koll Center Parkway, Pleasanton, CA 94566 925.426.3100, fax 925.426.2323 Garron Perrotti, Sales Director gperrotti@amtus.com www.amtus.com	1990 E (Formerly Astra Microtronics Technology)	NA	DIP, PLCC, QFP, QSOP, SOIC, SSOP, TSSOP Plastic	208/QFP	Backgrinding Final Test
Advanced Semiconductor Engineering www.ase.com*
Amertron Inc. Maloma Street, CSEZ, Pampanga, Philippines Donald L. Elam, Senior VP of Marketing delam@pantronix.com 510.656.5898, fax 510.656.7779 www.amertron@mozcom.com	1989 C	N=80 R=20	Ceramic: CERDIP, ceramic side brazed, chip carriers, PGA, hybrids, TO-18, TO- 39, TO-100, etc. Plastic: PDIP, PLCC, SOIC, SOJ Other: MCM	100/PQFP	COB, display module, hybrid, PC board, SMT assembly Final Test
Amkor Technology Inc. 1345 Enterprise Dr., West Chester, PA 19380 Ellen Ware, Director of Marketing Support, eware@amkor.com 1900 S. Price Rd., Chandler, AZ 85248 480.821.2408 x 5193, fax 480.821.6937 Patrick McKinny, Vice President of Sales, pmcki@amkor.com 3945 Freedom Circle, Santa Clara, CA 95054 Mike Lamble, Vice President of Sales, mlamb@amkor.com Las Colinas Corporate Center, 6363 North Highway 161, Suite 300, Irving, TX 75038, Cecil Cherico, Vice President of Sales, ccher@amkor.com Amkor Technology Euroservices-S.A.R.L. (France) Jean-Loup Rousseau, Vice President of Sales, jrous@amkor.com www.amkor.com	1968 AMKR (Nasdaq) Most IC assembly is done in Korea and the Philippines.	NA	Most package types offered, including CSPs Ceramic, Plastic Leadframe, rigid and flexible PC boards	1936/Flip-Chip BGA 45 x 45 mm (see Table 1)	Final test Package characterization, Package design and reliability testing Wafer foundry services
Apack Technologies Inc. Hsinchu, Taiwan Sebastian Liau, VP Marketing scliau@apack.com.tw 10 North Rd. Berkeley Heights, NJ 07922 908.582.5681, fax 908.582.2670 Albert W. Lin, Senior VP alin@apack.com.tw www.apack.com.tw	1996 C	NA	BGA, CSP, DIMM, MCM, PQFP, PC card, SIMM	600/BGA	Chip-on-chip Wafer bumping
ASAT Ltd. Hong Kong ASAT Inc. 46335 Landing Parkway, Fremont, CA 94538 510.249.1222, fax 510.249.9105 Bill Burks, bill_burks@asat.com www.asat.com	1998 E	NA	BGA, fpBGA, QFP, TBGA, TQFP and Others	fpBGA fxBGA LPCC	Final test
Bridgepoint Technical Manufacturing 4007 Commercial Center Dr., Austin, TX 78744 512.637.4702, fax 512.637.4701 Greg Nesbitt, gregn@bridgept.com www.bridgept.com	1998 A	E=10 N=90	BGA, CSP, DIP, PGA Ceramic, Other	384/BGA COB	Final test PC board assembly
Caesar Technology Inc. Hsinchu, Taiwan Chris Liu, Customer Service Director chris@caesar.com.tw Caesar International Inc. 2333 Zanker Rd., San Jose, CA 95131 408.474.0808, fax 408.474.0800 Gerry Linjuco, Director of Sales & Marketing gerry@caesarintel.com www.caesarintl.com	1992 E	NA	LQFP, PBGA, PQFP, TQFP Plastic	500+/PBGA CSPs under development	Final test
CARSEM Ipoh, Malaysia Tom Parrott, Business Manager tomparrott@s.carsems.com.my Carsem Inc. 17890 Castleton St., Suite 245 City of Industry, CA 91748 626.854.0939, fax 626.854.9139 gblackholly@carsem.com Liam Noone, Director of European Sales, England lnoone@carsem.com www.carsem.com	1972 E MPI (Kuala Lumpur)	A=8 E=30 J=2 N=60	BGA, CSP, LQFP, MQFP, PDIP, QSOP SOIC, SOT-23, SSOP, TO-220 TQFP, TSSOP and others	352/BGA
Chipbong Technology Group Science Based Industrial Park, Hsin Chu, Taiwan F.J.Wu, +886.3.567.8788 U.S. Representative: Silicon Coast Inc. Carl E. Lehtonen, President 512.794.0051, fax 512.794.0043 chipbond@sicoast.com www.chipbond.com.tw	1997 A	A=40 E=5 J=30 N=25	Flip-Chip on Flex	1000/bumped die ChipBGA wafer-level package	Wafer bumping- gold solder
ChipPAC Inc. 3151 Coronado Dr., Santa Clara, CA 95054 408.486.5964, fax 408.486.5910 Satya Chillara, Marketing Director chhilara@chippac.com Jan de Koning Gans, Sales Manager (Netherlands) jankg_chippac@csi.com www.chippac.com	1997 E (Formerly the Assembly & Test Division of Hyundai. Production is in Korea)	A=7 E=6 J=3 N=84	BGA, CSP, DIP, PLCC, QFP, SO, TQFP Plastic	750/BGA EconoCSP FGBA-T Flashpac M2CSP µBGA RAMPAC	Design centers in U.S. and Korea Final test
Chip Supply Inc. 3151 Orange Blossom Trail, Orlando, FL 32810 407.296.5604, fax 407.290.0164 Jim Rates, Director of Advances Products jrates@chipsupply.com John Kay (UK), jkay@chipsupply.com www.chipsupply.com	1978 B	E=5 N=90 R=5	BGA, CSP, DIP, PGA Ceramic, Laminate	300/BGA/CSP/PG A	Die supplier Final test
Corwil Technology Corp. 2127 Ringwood Ave., San Jose, CA 95131 408.321.6404, fax 408.321.6407 Robert Corrao, President info@corwil.com www.corwil.com	1990 B	A=3 E=3 N=90 R=4	BGA, CSP, DIP, PGA, others Ceramic, Plastic	550/BGA	Backgrinding Final test
CS2 (Custom Silicon Configuration Services) Hermesstraat 2g, 1930 Zaventem, Belgium +32.272.00000, fax +32.272.00001 Carole Maguire, Marketing Coordinator, carole.maguire@cs2.be www.cs2.be	1998 B	E=100	BGA, CSP, all area- array types Ceramic, Laminate, Plastic Glass or laminate image sensor BGA	1000+/PBGA/TBG A PSGA, Laminate/Ceramic LFBGA and TFBGA	Final test Package design
Gateway Electronics Corp. Makati City, Philippines 2880 Lakeside Drive, Santa Clara, CA 95054 408.980.1656, fax 408.980.1658 Scott Sylvester, Vice President of Sales & Marketing gsicdss@aol.com www.gec.com.ph
Hana Technologies* www.hanagroup.com
Hitachi Cable Ltd.* Tokyo, Japan H. Okabe, okabe@sj.hitachi-cable.com www.sj.hitachi.cable.com	1956	NA	BGA, CSP Plastic	µBGA
Integrated Packaging Assembly Corp. 2221 Oakland Rd., San Jose, CA 95131 408.321.3600, fax 408.321.3603 Phil Marcoux-VP of Sales and Marketing pmarcoux@ipac.com www.ipac.com	1993 B IPAC (Nasdaq OTC:BB) Now majority-owned by OSE	N=100	BGA, COB, CSP, LQFP, PQFP, TQFP Ceramic, Plastic and Pre-molded	696/BGA fBGA µBGA	Concurrent engineering One-day turn Final test Package design
Kyocera America Inc. 8611 Balboa Ave. San Diego, CA 92123 619.576.2792, fax 619.569.9412 Richard Sigliano, General Manager rick.sigliano@kyocera.com Mick Imanka (Germany) +49.711.93934.0, fax +49.711.9393450 www.kyocera.com	1959 E KYO	A=15 E=15 J=25 N=40 R=5	BGA, CSP, DIP, PGA, Others Ceramic, Plastic	1144/CBGA	Final test
Mitsui Hi-Tec Inc.* Kitakyushu, Japan International Leadframe Corp. 408.980.0782, fax 408.727.8160	NA
Multichip Assembly Inc. 71 Daggett Dr., San Jose, CA 95134 John J. Strinic, Vice President of Sales and Marketing, jjs@multichipassy.com 408.324.0244, fax 408.324.1036 www.multichipassy.com	1991 A	A=50 N=50	COF, Flip-Chip, FCOG, FCOB, FCOF, TAB, TBGA, TAB on glass	300 McCSP™	Engineering design Video arcade games
Neopac Semiconductor Corp. Hsinchu, Taiwan Vincent Chung, Deputy Sales Manager sales@neopac.com.tw 3825 Hopyard Rd., Suite 143, Pleasanton, CA 94558 Frank Wu, President sales@neopac.com 925.460.0328, fax 925.460.0327 www.neopac.com.tw	1998 B	A=30 N=70	BGA, CSP Ceramic, Plastic	850/PBGA Matrix BGA
NS Electronics Bangkok Ltd. Bangkok, Thailand Terence Chua, Business Development Director NS Electronics (USA) Inc. 3325 Kifer Rd., Santa Clara, CA 95051 Malee Lowchareonkul, Sales & Marketing Director malee@nseb.com 408.749.9155 x 103, fax 408.749.9239 Semis Industry Services (Austria) semis.streussnig@aon.at www.nseb.com	1993 E	E=30 N=70	PDIP, PLCC, QSOP, SOIC, SSOP, SOT- 23, TSOP, TSSOP, VSOP	48/TSOP Bump Chip Carrier (BCC) BCC++	Backgrinding Burn-in Final test Lead scan Test program dev.
Orient Semiconductor Electronics 12-2 Hei Huan south Rd., NEPZ, Kaohsiung 811, Taiwan John Wu, Sales & Marketing, john_wu@ose.com.tw OSE Inc., 2700 Augustine Dr., Santa Clara, CA 95054 Edmond Tseng, edmond_tseng@ose.com.tw 408.988.6650, fax 408.988.7574 David Taylor, UK infopaewafe.com www.ose.com.tw	1971 E (Taiwan)	A=40 E=15 N=45	BGA, CSP, FC, EBGA, LFBGA, LQFP, MCM, SSOP, TEBGA, TF-BGA, TQFP, TSSOP Plastic	576/PBGA µBGA	Final test Tape & reel Wafer grinding Wafer probe
Pantronix Corp. 2710 Lakeview Court Fremont, CA 94538 Donald L. Elam, Senior VP of Marketing delam@pantronix.com 510.656.5898 510.656.7779 (fax) www.pantronix.com	1974 C	N=100	Ceramic: CERDIP, side-brazed, CERPAK, hybrids, power devices, microwave devices Plastic: Flat packs, LSOP,PBGA, PDIP, PLCC, PPGA, PQFP, SOIC, SSOP, TQFP Other:Cavitypak, MCM-C, MCM-D, MCM-L , metal cans	357/PBGA	Final test Package design
Shinko Electric Industries Nagano, Japan 3211 Scott Blvd., #101 Santa Clara, CA 95051 Mohan Kirloskar, director of product development m.kirloskar@shinko.com 408.748.2600, fax 408.727.2524 www.shinko.com	1947 E	A=30 E=15 J=20 N=30 R=5	BGA, PGA, PQFP	1,900/BGA µBGA BCC SCSP D2BGA	Final test
Signetics KP Seoul, Korea kwlee@signetics.com www.signetics.co.kr	1966
Siliconware Precision Industries Co. Hsinchu, Taiwan Frank Hsu, Customer Service Director frankhsu@spil.com.tw 1735 Technology Dr., Suite 300, San Jose, CA 95110 Anthony Sun, Senior Director of Packaging Technology anthonys@spilca.com 408.573.5509, fax 408.573.5530 www.spil.com.tw	1984 E SILD (Taiwan)	A=50 N=50	BGA, CSP, QFP, SOIC Plastic	600/BGA D2BGA µBGA TF-BGA	Final test Wafer sort
Solid State Testing Inc. 56 Middlesex Turnpike, burlington, MA 01803 781.272.0972, fax 781.273.4896 John Bishop, Vice President sstmicro@ix.netcom.com	1969 A	E=5 N=10 R=85	Ceramic: BGA, COB, CSP, DIP, Flat pack, LCC, PGA TO Ceramic	200/PGA, BGA, QFP	Final test
Team Pacific Corp. Manila, Philippines Luisa Merana, Customer Service Manager, louie@teamglac.com 1799 Old Bayshore Highway, Suite 135, Burlingame, CA 94041 650.652.4606, fax 650.652.4612 Gene Bautista, Senior VP-Sales, gene29@ix.netcom.com Web: NA	1996 E	A=9 E=15 N=76	SOT-227, TO-247, TO-264, TO-268 Ceramic, Plastic, Other	40/CDIP
Tong Hsing Electronic Industries Ltd. 55 Lane 365, Ying-Tao Rd., Taipei, Taiwan +886.22.679.0122 Heinz Ru, VP Marketing & Sales Silicon Coast Associates Inc. 408.283.1801, fax 408.924.0929 Raymond Petit, Chief Operating Officer rppetit@sicoast.com www.theil.com	1975 C	A=10 E=20 J=5 N=50 R=15	CSP MCM, RF modules Ceramic	<100/CSP	Final test
VLSI Packaging Corp. 750 Presidential Dr., Richardson, TX 75081 972.437.5506, fax 972.644.1286 Gene Wakefield, Co-President, g.wakefield@vlsip.com www.vlsip.com	1984 B	J=20 N=80	BGA, CSP, DIP, FP, LCC, PGA Ceramic, Laminate, Plastic	1024/BGA	Final test
A=Asia  E=Europe  J=Japan  N=North America  R=Rest of World    Black=Asia  Blue=U.S.-based companies and/or representatives  Red=Europe *Table compiled from information supplied by vendors. Asterisk indicates vendor did not respond to survey by press time. Copyright 1999