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MANUFACTURERS OF SINGULATION EQUIPMENT
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All information has been supplied by the respective manufacturers. Punch singulation equipment will be featured in a future article. Issue advertisers are listed in boldface type.
Compilation copyright © 2001 by Chip Scale Review. All rights reserved. |
Avalon Technology Ltd. Pte. (Division of Advanced Systems Automation Ltd.)
54 Serangoon North, Avenue 4
Singapore 55585
Phone: +65.4825885
www.asa.com.sg |
Model: SSS V2
Intro: May 2000
Machine Size (LWH): 1.6 m x 1.7 m x 1.5 m (excluding saw and tube offload)
Largest Substrate: 250 mm (L) x 75 mm (W)
M, S-A or Auto: Automatic
Singulation Mode: Saw
Applications: Array BGA, QFN |
Robin Seah,
Marketing Executive
robin@asa.com.sg |
Disco Corp. Japan
U.S. Sales: Disco Hi-Tec America Inc.
3270 Scott Blvd., Santa Clara, CA 95054
Phone: 408.987.3765
www.disco.co.jp or www.discousa.com |
Model: No Data
Supplied Intro:
Machine Size (LWH):
Largest Substrate:
M, S-A or Auto:
Singulation Mode:
Applications: |
Li Chiu
lichiu@discousa.com |
Greatech Automation (M) Sdn Bhd
Plot 287B Lengkok
Kampung Jawa Satu, Bayan Lepas FIZ
Phase 3, 11900 Penang, Malaysia
Phone: +604.6463.260 Fax: +604.6432.920 |
Model: BDH6000 CSP Dicing Handler System
Intro: Oct. 2000
Machine Size (LWH): 1.7 m x 1.45 m x 1.43 m
Largest Substrate: 250 mm (L) x 76 mm (W) x 3 mm (thick)
M, S-A or Auto: Automatic
Singulation Mode: Tapeless, Nestless Saw
Applications: BGA, CSP |
E.K. Tan, Manging Director
ektan@greatech-group.com
www.greatech-group.com |
Han-Mi Co. Ltd.
533-3 Kajwa-Dong, Seo-Ku
Inchon, Korea
Phone: +82.32.577.9751 Fax: +82.32.578.9753
www.hanmico.com |
Model: Sawing & Placement – 2000 D
Intro: Nov. 1998
Machine Size (LWH): 2.04 m x 1.6 m x 1.44 m
Largest Substrate: 230 mm (L) x 70 mm (W)
M, S-A or Auto: Automatic
Singulation Mode: Saw
Applications: CABGA, LFBGA, MiniBGA, MLF, MLP, QFN, QLP |
Mike Kim,
Overseas Sales & Marketing
mike@hanmico.com |
Industrial Tools Inc.
1111 S. Rose Ave.
Oxnard, CA 93033
Phone: 805.483.1111 Fax: 805.483.6302
www.itiblades.com |
Model: No Data Supplied
Intro:
Machine Size (LWH):
Largest Substrate:
M, S-A or Auto:
Singulation Mode:
Applications: |
Reidar Kristiansen
reidark@itiblades.com |
Intercon Technology Inc. (A Towa Group Company)
18255 Sutter Blvd.
Morgan Hill, CA 95037
Phone: 408.778.5992 Fax: 408.778.9557
www.intercontechnology.com |
Model: Matrix Array Singulation System SBS-8800
Intro: July 1998
Machine Size (LWH): Not Supplied
Largest Substrate: 250 mm (L) x 100 mm (W) x 3 mm (thick)
M, S-A or Auto: Automatic
Singulation Mode: Tapeless Saw
Applications: BT Resin, Copper QFN Frames |
Jerry Joslen,
Sales Manager
jjoslen@intercontechnology.com |
Kulicke & Soffa Industries
2101 Blair Mill Rd.
Willow Grove, PA 19090
www.kns.com |
Models: 7300, 7500, 7500M
Intro: Nov. 1999, Nov. 1999, July 2001
Machine Sizes (LWH): 1.1 x 0.8 x 1.186 m, 1.1 x 1. x 1.186 m
Largest Substrate: 250 mm capable
M, S-A or Auto: S-A, Auto, Auto
Singulation Mode: Saw
Substrate Types: PBGA, QFN |
Eyal Kaully, Package
Singulation Program Manager
ekaully@kns.com
Phone: +972.4.854.5367 |
Manufacturing Technology Inc.
2226 Goodyear Ave.
Ventura, CA 9303
Phone: 805.644.9681 Fax: 805.644.3541
www.mtionline.com |
Model: No Data Supplied
Intro:
Machine Size (LWH):
Largest Substrate:
M, S-A or Auto:
Singulation Mode:
Applications: |
Tim Pyle
tpyle@mtionline.com |
MCT
2340 West County Road C
St. Paul, MN 55113
Phone: 651.697.4075 Fax: 651.697.4111
www.mct.com |
Model: Smart Sort SS-2
Intro: May 2000
Machine Size (LWH): 1.62 m x 1.32 m x 1.93 m
Largest Substrate: 275 mm (L) x 75 mm (W)
M, S-A or Auto: Automatic
Singulation Mode: Saw, Gang Blade
Applications: FPBGA/LGA, QFN |
Brett Nordin,
Product Manager
brett.nordin@mct.com
Phone: 480.456.3505 |
MECO Equipment Engineers BV
Marconilaan 2, 5151 DR Drunen,
Netherlands
Phone: +31.416.384.384 Fax: +31.416.384.399
www.meco.nl |
Model: Meco Interposer Singulation System II (MISS II)
Intro: June 2001
Machine Size (LWH): 1.99 m x 1.47 m x 2.19 m (complete system)
Largest Substrate: 254 mm (L) x 75 mm (W)
M, S-A or Auto: Automatic
Singulation Mode: Tapeless Saw
Applications: BGA, CSP, Flip Chip On Board, QFN |
Product Manager Singulation Equipment
sales@meco.nl |
Motorola Manufacturing Solutions
7755 S. Research Dr., Suite 110
Tempe, AZ 85284
Phone: 480.75.2500 Fax: 480.755.2840
www.motorola.com/manufacturingsolutions |
Model: HDS 250-4
Intro: July 2001
Machine Size (LWH): 812.8 mm x 1948.2 mm x 1270 mm
Largest Substrate: 250 mm (L)
M, S-A or Auto: Auto
Singulation Mode: Saw
Applications: BT Resin |
Todd Ezrailson, Marketing Communications Manager
manufacturingsolutions@motorola.com |
TSK America
2520 Junction Ave.
San Jose, CA 95134
Phone: 408.952.7900 Fax: 408.952.7901
www.tskamerica.com |
Model: No Data Supplied
Intro:
Machine Size (LWH):
Largest Substrate:
M, S-A or Auto:
Singulation Mode:
Applications: |
niwanor@tskamerica.com |
