Asymtek's New DP-3000 Pump Configurations Allow Faster, More Precise Dispensing

Asymtek's new configurations to its DP-3000 Series Linear Pump allow for increased refill speeds and faster priming. The DP-3000-02 version is configured with a low-speed gearbox for more precise dispensing. [asymtek.com]

MP500: Ismeca's Integrated Test & Taping Machine

This leadframe-to-tape machine is ideal for mid-volume input from leadframe-to-tape applications requiring plunge-to-board test. Its integrated processes include state-of-the-art vision inspection, electrical test, and taping with optional laser mark capabilities, while achieving throughputs up to 3,600 pph. [ismeca.com]

For further information, contact: Ken Kolden, Marketing Manager, 2365 Oak Ridge Way, Vista, CA 92083-8341, Tel: (760) 305-6224, Fax: (760) 305-6294, e-mail: kkolden@ismeca.com

View Engineering's Non-Contact Metrology System

The View Summit is View Engineering's latest high-performance non-contact metrology enabling technology for the electronics and other high-precision manufacturing industries. The Summit series of large travel systems are designed for near-process automated measurement, enabling manufacturers to reduce defects and improve yields. View Summit addresses a wide range of applications including SMT component placement verification, multi-layer PCB registration, artwork, stencils, etc. [vieweng.com]

Next-Generation Singulation System

Greatech has introduced its next-generation BDH6000 Singulation System, which utilizes a tapeless and nestless concept for BGAs, CSPs and QFNs. This system can handle various substrate types-without a nest apparatus for conversion-to reduce operating costs. This enhancement enables a 60% throughput, enabling a total throughput as high as 8K units/hr. Windows NT-based software offers the flexibility of English and Chinese versions. Test and laser mark are available features.

For further information, contact Greatech Automation (M) Sdn Bhd, Penang, Malaysia, greatech@tm.net.my, +604-6463260, fax +604-6432920. [greatech-group.com]

High-Density Substrate Singulation System Handles Packages as Small as 4 mm

With easy substrate changeover and a proprietary pick and place head, this tapeless system singulates package sizes as small as 4 mm square and provides certified flux removal. Its production-hardened graphics user interface minimizes training and permits a single technician to operate three or four systems, increasing efficiency, reliability and throughput while lowering costs. Contact Motorola Manufacturing Solutions for more information. [motorola.com/manufacturingsolutions]

New Yamaichi Catalogs Available

Yamaichi Electronics USA Inc. is offering New 2001 Test & Burn-in and Production catalogs. The catalogs contain updated information from earlier 1998-99 versions. Yamaichi, a world leader in the socket technology and high-density connector markets, is currently expanding its Smart media and flash memory card divisions. All catalogs will soon be available in CD-ROM format. For additional information, visit our website at www.yeu.com or click on ChipLinks at www.ChipScaleReview.com.