Current Issue The International Reference for Chip-Scale Electronics, Flip-Chip Technology, Optoelectronic Interconnection and Wafer-Level Packaging August - September 2002 Email the editor

Please submit calendar listings to the editor at least two months prior to cover date. Due to limited space, listings are restricted to non-commercial, non-profit organizations.

August 22 International Wafer-Level Packaging Conference 8 a.m-5 p.m. Conference; 5-7 p.m. Reception and Tabletop Exhibits Four Points Sheridan 1250 Lakeside Dr., Sunnyvale, Calif. Presenter: Dr. Thomas H. Di Stefano, Decision Track Inc. Sponsors: Chip Scale Review, MEPTEC, Microelectronics Forum [mepteconline.com]

September 3-6 IMAPS 2002 3-6 Conference 4-6 Exhibition Denver, Colorado Convention Center IMAPS [imaps2002.org] 8-11 The 9th Annual International KGD Packaging and Test Workshop "Die ProductsÑKey to the Portable World" Embassy Suites Napa Valley, Napa, Calif. Die Products Consortium [dieproduct.com] 16-18 SEMICON Taiwan 2002 Taipei World Trade Center, Taipei SEMI [semi.org] 22-26 SMTA International 2002 Donald Stevens Convention Center, Chicago SMTA [smta.org] 24-28 SEMI Expo CIS 2002 New Manege Exhibition Hall Moscow, Russia SEMI [semi.org] Alla Famitskaya [afamitskaya@semi.org]

October 3 Suppliers Expo 9 a.m.-6 p.m. Santa Clara (Calif.) Convention Center Fabless Semiconductor Association [fsa.org] 15-16 SEMICON Southwest 2002 Austin (Texas) Convention Center SEMI [semi.org]