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The International Reference for Chip-Scale Electronics, Flip-Chip Technology, Optoelectronic Interconnection and Wafer-Level Packaging
August - September 2002
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Lessons Learned in Whitefish, Montana
Assembly Lines
Unlike MacArthur's Old Solders, Old Web Sites Never Die, They Just Go On and On
Opto-Electronically Speaking
The Next Big Thing? Move IC Interconnects to the PC Board!
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The Faces of Semicon West 2002
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Features
Special Feature: Skeptical About KGD? Relax, It's Better than Ever!
Cover Story: Die Attach, Flip Chips and Wire Bonding: New Rules, New Tools for Chip and Wire
International Directory of Die Attach, Wire and Flip-Chip Bonding Systems
Emerging Technologies: New Fine-Beam, Abrasive Water Jet Technology Enables Photonic and Small Device Singulation
Singulation Equipment Provider Directory
The QFN: Smaller, Faster and Less Expensive
Tools & Technologies
Test Socket Lid Sports Low Profile and more...
Patents
Embedded Capacitors Improve Overall Device Performance
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