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The Next Big Thing? Move IC Interconnects to the PC Board!

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The Faces of Semicon West 2002
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Special Feature: Skeptical About KGD? Relax, It's Better than Ever!
Cover Story: Die Attach, Flip Chips and Wire Bonding: New Rules, New Tools for Chip and Wire

International Directory of Die Attach, Wire and Flip-Chip Bonding Systems

Emerging Technologies: New Fine-Beam, Abrasive Water Jet Technology Enables Photonic and Small Device Singulation

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The QFN: Smaller, Faster and Less Expensive

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Embedded Capacitors Improve Overall Device Performance

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Current Issue
The International Reference for Chip-Scale Electronics, Flip-Chip Technology, Optoelectronic Interconnection and Wafer-Level Packaging
August - September 2002
The Faces of Semicon West 2002

San Jose-Despite earlier fears that the July 17-19 manufacturing portion of the industry's largest trade show would suffer from lack of attendance, the opposite appeared true. For most of the show's three days, navigating space inside McEnery Hall was at a premium. And despite the continuing downturn, few long faces were seen.

A view of the SEMICON floor N.K. Kwak, HAN-MI; David C. Campbell, ESC; and Mike Kim, HAN-MI
Ronny Theriault, SolVision David Sbiroli, Indium Corp., (left) and Joe Link, consultant
(L to R) Tan Eng Kee, Teh Kean Khoon and Francis Wong, Greatech Automation Kulicke & Soffa booth
Malee Lowchareonkul, Hana USA, and Ralph Iscoff, CSR Jacques Coderre, Universal Instruments Corp.
(L to R) Dr. Elke Zakel, Pac Tech GmbH; Dave Tovar, OSE-USA; Ron Blankenhorn, Pac Tech USA, and Thomas Oppert, Pac Tech GmbH (L to R) Phil Marcoux and Myron Peskar of Tru-Si with Gautham Viswanadam, Absara Micro Systems Pte., Singapore
 
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