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On Line Reader Service
 Publisher's Letter
Lessons Learned in Whitefish, Montana

 Assembly Lines
Unlike MacArthur's Old Solders, Old Web Sites Never Die, They Just Go On and On

 Opto-Electronically Speaking 
The Next Big Thing? Move IC Interconnects to the PC Board!

 Industry News
Company News
The Faces of Semicon West 2002
Opto/Nanotechnology
People in the News
Calendar of Events
Editorial Index

 Features
Special Feature: Skeptical About KGD? Relax, It's Better than Ever!
Cover Story: Die Attach, Flip Chips and Wire Bonding: New Rules, New Tools for Chip and Wire

International Directory of Die Attach, Wire and Flip-Chip Bonding Systems

Emerging Technologies: New Fine-Beam, Abrasive Water Jet Technology Enables Photonic and Small Device Singulation

Singulation Equipment Provider Directory

The QFN: Smaller, Faster and Less Expensive

 Tools & Technologies
Test Socket Lid Sports Low Profile and more...

 Patents
Embedded Capacitors Improve Overall Device Performance

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Current Issue
The International Reference for Chip-Scale Electronics, Flip-Chip Technology, Optoelectronic Interconnection and Wafer-Level Packaging
August - September 2002
The Faces of Semicon West 2002

(L to R) Sam Gomez, Mike Gholson and Mena Villena of PSi Technologies Doug Day, Shinkawa USA
Steve Godber, Cookson Electronics, (left) and Mike Chapman, Motorola Gordon Glen, Asymtek
(L to R) CSR Publisher Gene Selven, S. Okuda, Towa Corp., K. Ibusuki, Towa America, and Vada Dean, Intercon Technology Mark DiOrio, MTBSolutions
Steve Durrett, Plastronics Socket Co. Keith Waterman, Rika Denshi America (left) and Bob Marrs, consultant
Kirk Flatow and Joyce Smaragdis, Tessera Technologies Dr. Subash Khadpe, SEMITECH, and Dr. Ken Gilleo, Cookson
 
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