Test Socket Lid Sports Low Profile Synergetix, Kansas City, Kansas, has introduced the Integra 27 production test socket, which is built around a molded frame with an integral clamshell lid. This frame is combined with an interposer insert that is designed for each user's device. The interposer insert employs spring contact probes with an insertion life of 500,000 cycles. The contact probes offer an inductance as low as 0.33 nH and bandwidths well over 10 GHz. [synergetix.com]
Dispenser System Delivers 3 nl Dots Asymtek, a Nordson company, Carlsbad, Calif., has introduced the Axiom X-1010 dispenser designed for dispensing ultra-small dots of conductive epoxy. Configured with Asymtek's DV-7000 Heliflow pump, the machine delivers dots as small as 3 nl in volume and 0.165 mm in diameter. The system is said to be ideal for the production of MEMs, MOEMs, hybrid components, disk drive heads, micro potting and other electronic component assemblies. The system can create lines as small as 0.178 mm. [asymtek.com]
Fast Prober Speeds Device Throughput Wentworth Laboratories, Brookfield, Conn., has introduced the Pegasus S200 semi-automatic prober for 200 mm wafers. The unit offers a claimed performance up to 20 percent better than competitive units. The manufacturer says the unit is ideally suited to high-volume production probing applications, including LEDs and MEMS, as well as device characterization. [wentworthlabs.com] Stacked Memory Package Saves Space Tessera Technologies, San Jose, has introduced the MZ technology family, the newest addition to its MZ-ball stacked multi-chip memory package. The package enables stacking up to four DRAM chips into a single multi-chip package. The result, according to Tessera, is a sizeable increase in memory capacity-nearly 8x that of a TSOP. [tessera.com] Marking System for Wafer-Level CSPs GSI Lumonics, Wilmington, Mass., has introduced the CSP300 wafer-level CSP marking system for 200-300 mm wafers. The CSP300 is aimed at inline production marking and offers automatic alignment and calibration, on-board mark inspection/ validation, cleanroom compatibility and both FOUP and SMIF interfaces. [gsilumonics.com] Electroglas Inc., San Jose, has introduced DefeclD automatic defect classification software that works in conjunction with the company's QuickSilver automated wafer inspection systems. The new software employs special algorithms to expand existing defect classification capabilities. DefeclD will find random defects located anywhere on the wafer's surface, according to its developer. [electroglas.com]
Dage X-Ray Inspection Unit Magnifies 5800x Dage Precision Industries, Fremont, Calif., has announced the Model XT6600 X-ray inspection system with magnification up to 5800x and feature recognition of > 1 µm over its entire 458 x 407 mm inspection area. The unit is aimed at IC and PC board manufacturing applications. The unit achieves exceptionally high resolution and magnification through the use of the company's proprietary technology. The unit can make manual and automated point-to-point measurements and perform statistical analysis on void percentages. [dageinc.com] Process Bumped ICs Directly from Wafers Universal Instruments, Binghamton, N.Y., is now offering an enhanced flip-chip option for its GSM platform. This option allows the machines to process bumped devices directly from wafers using either ink dot recognition or wafer map input. Universal has also integrated the Kinesys ALPS software with the GSM platform operating system, allowing the user to seamlessly load up to 100 different map formats. [uic.com]
Tester for High-Mix IC Use Introduced in U.S. Teradyne, Boston, has announced the U.S. debut of its Integra FLEX high-volume, high-mix IC test system. The unit employs full-parallel distributed architecture and multi-level software. The Integra FLEX features Universal Slot architecture, which enables production flexibility for a wide range of devices from standard analog and power management to SOCs. [teradyne.com] Test Handler Boasts Improved Accuracy Mirae Corp., Chungnam S. Korea, has announced the Model MR 2700 pick-and-place type logic test handler. The unit is claimed to provide improved motion accuracy by employing a Mirae-built linear motor. This improvement enables the handler to accommodate IC packages from 5 x 5 mm to 70 x 70 mm, including the smallest SMD packages. Testing temperature range for the unit is from ambient to +155°C. [mirae.com] Thermal Management, Dicing System Debuts Kulicke & Soffa, Willow Grove, Pa., has introduced a new thermal management system and a dicing system for optoelectronic applications. The thermal management system is designed for applications in high-power simulation, temperature characterization and high-volume production testing. The heart of the unit is a thermal control unit that houses a thermoelectric cooler module and a resistance temperature device.
The new Model 7100adTS dicing system is equipped with a tilting spindle that makes angular cuts to suppress back reflection in optoelectronic components. The ability to provide a precise, 8° angular cut reduces or completely eliminates the cost and time needed for separate grinding operations when dicing planar and fiber wave guides. [kns.com] Rotating Bondhead Hikes Wire Bonder Throughput ESEC, Cham, Switzerland, has introduced rotating bondhead technology, claimed to enable more than 20 gold or copper wires to be bonded every second, with as much or more precision than slower machines The bondhead is the centerpiece of ESEC's next generation wire-bonding systems due for introduction early next year. With current bondhead techniques, based on an X-Y cross table, the physical limits of wirebonding speed with adequate accuracy have been reached, according to ESEC. The company has also announced a realtime process diagnostic tool for wirebonding. [esec.com] Mask Aligner for 300 mm Packaging Applications SUSS MicroTec, Munich, Germany, has introduced the MA300Plus, a full-field proximity mask aligner for IC packaging, capable of processing wafers up to 300 mm in diameter. The unit, according to SUSS, enables a fast and easy changeover between 200 and 300 mm wafers. Key features include a resolution of 5 microns, alignment accuracy of 1 micron and a full-field exposure intensity of 90 m/W/cm2. [suss.de]
Gas Plasma System Has Multiple Modes March Plasma Systems, a Nordson company, Concord, Calif., has released the XTRAK-IFP plasma treatment system. The product incorporates ion-free plasma technology for treatment of devices without exposure to direct plasma glow discharge. The machine's use of multiple plasma modes allows unrestricted choice of any process gas. A three-axis symmetrical chamber ensures uniform plasma treatment across all surfaces, according to March Plasma. The unit is SMEMA 1.2 compatible and integrates with most process equipment. [marchplasma.com] Die Attach Features 5-Minute Changeover Alphasem AG, Berg, Switzerland, has announced the new Swissline 9020 series of die attach systems. The modular 9020 series is targeted at wafers up to 300 mm, and features a five-minute changeover to different wafer sizes. The 9020 series enables handling of epoxy die attach applications on metal leadframes and organic substrates, as well as on adhesive tape-based packages. [alphasem.com] |
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