Aries Electronics has introduced an RF center probe test socket.

Aries Announces RF Center Probe Socket

Frenchtown, N.J.-Aries Electronics has announced a new, high-frequency test socket for devices with pitches as small as 0.50mm, for use in applications with speeds from 1GHz to greater than 18GHz.

The center pitch socket is aimed at applications and packages for DSP, etc.

Aries says the new socket provides minimal signal loss for higher bandwidth via a signal path of only 1.95mm. The socket's overall size of 89.08mm x 69.85mm offers the maximum allowable space for load board components and connectors.

The socket is solderless and employs pressure-mount compression spring probes that enable it to be mounted to and removed from the test board. [arieselec.com]

The FlexTRAK-WR is based on the March Plasma FlexTRAK platform.

March Plasma Systems Debuts Wafer Processor

Concord, Calif.-March Plasma Systems has announced the FlexTRAK-WR for high-volume processing of semiconductor wafers up to 300mm.

Based on the company's FlexTRAK platform, the unit will handle wafers loaded into multiple cassettes or front-opening universal pods (FOUPs). The system is capable of direct, downstream or ion-free plasma processing for a wide range of semiconductor applications.

Proprietary software offers an intuitive graphical user interface with touch-screen programming. The company says the unit "easily integrates with other process equipment and is SMEMA compatible."

A three-axis symmetrical chamber and proprietary process control provides "unmatched process uniformity while minimizing cycle times." [marchplasma.com]

The ACCEL MicroCel centrifugal cleaning system has been improved with enhancements added.

Speedline Shows Improved ACCEL Cleaning Unit

Franklin, Mass.-Speedline Technologies has demonstrated an enhanced ACCEL MicroCel centrifugal cleaning system with an enhanced user interface, functionality and flexibility.

The improved system is targeted at the cleaning of circuit assemblies, precision parts, medical devices, bumped wafers and advanced packages including CSPs and MCMs.

Improvements include a new PLC control, the ability to store and retrieve up to 50 recipes, adjustable programming, configurable alarms and the option to manage recipes remotely via an Ethernet link.

New software enhancements, formerly available only as customized customized options, are now included as standard. [speedlinetech.com]

BETAsoft has released new thermal analysis software.

BETAsoft Intros Thermal Analysis Software for SIPs

Pittsburgh, Pa.-BETAsoft has introduced BETAsoft-SiP/MCM thermal analysis software for Windows to support System-in-Package, System-on-Chip, COB with encapsulation, BGA and others.

BETAsoft claims that accurate modeling of power transients in a chip as short as 0.1ns and thin layers of materials as small as 0.1 micron, such as SOI, can be easily performed. [betasoft-thermal.com]

AMD Qualifies New Dow Corning Grease

Midland, Mich.-Dow Corning Corp. says that AMD has qualified its new thermally conductive grease, TC-5022, for AMD64 processors and inclusion into its bundled Processor-in-a-Box product line. [dowcorning.com]

Synergetix Offering 0.4mm Probe for Many Packages

Kansas City, Kan.-Synergetix has developed a 0.4mm test socket probe that employs the same design concept the company uses in many of its 0.5mm test sockets.

The probe is available for many package types, including BGA, LGA, QFN and QFP. To achieve additional force, a higher force spring is available for lead-free and highly contaminated environments. [synergetix.com]

Advanced Dicing Releases Laser Scriber for Si Wafers

Haifa, Israel-Advanced Dicing Tech-nologies Ltd. has introduced the Laser Scriber 8000 to replace the first step in the traditional two-step method for dicing complex Si wafers that contain high-conductivity metals and low-k isolation materials.

ADT says it has improved on the two-step method with the CO2 laser that ablates only the non-silicon components in the wafer streets. The Si, itself, remains transparent to the specific wavelength employed and remains virtually unaffected by the radiation.

An alternative method modifies the traditional mechanical two-part process, in which one pass removes the active layers and another singulates the wafer. Scribing removes only the active layers of the Si substrate as an alternative to the first pass.

The new system, according to ADT, can laser scribe at up to 600mm/second in one pass. [adt-dicing.com]

DEK Develops High-Throughput, Backside Wafer-Coating Process

Weymouth, U.K.-DEK has developed a high-throughput, backside wafer coating process, based on a mass imaging platform and capable of exceeding a ±12.5µm total thickness variation (TTV).

The process is compatible with underfill or adhesive-type coatings that are normally applied at a nominal 50µm thickness to the backside of semiconductor wafers before singulation. DEK's backside wafer-coating process is compatible with the company's metal stencil and emulsion screen technologies. [dek.com]