August - September 2005
Chip Scale Review is produced for a worldwide audience of engineers, specialists, researchers and end-users of chip-scale and wafer-level back-end electronics manufacturing in print and digital editions. Chip Scale Review covers the chip-scale, flip-chip and wafer-level packaging market with a thoroughness unmatched by any other magazine.
Featured Articles
• Going Green and Lead-Free: The Race Is On!
• How to Control Voiding in Reflow Soldering
• International Directory of Pb-Free Solder Vendors
• Solder-Ball Placement as an Alternative to Stencil Printing for Flip Chips and Wafer-Level Packaging
• New Advances in Wafer-Breaking Technology Complement Laser-Scribed Wafer Singulation
Table of Contents
• Publisher's Letter: To be or not to be? That was SEMICON West!
• Assembly Lines: Blogging? Podcasting? Help, somebody!
• Trendlines: Farewell SECAP, a winning WLP advocate
• Engineer's Bookshelf: Introduction to Microfabrication
• Calendar
• Inside Patents: How to achieve cost-effective foreign patent prosecution
• Ad Index
| CSR Stock Index | |||
| Symbol | Name | Last | Pct Change |
| ASX | Advanced Semicond | 3.57 | 0.00 |
| AEHR | Aehr Test Systems | 1.17 | 0.00 |
| AMKR | Amkor Technology | 5.41 | 0.00 |
| AMAT | Applied Materials | 10.79 | 0.00 |
| ASMI | ASM International | 23.06 | 0.00 |
| CSCD | Cascade Microtech | 3.99 | 0.00 |
| IMOS | ChipMOS TECHNOLOG | 0.93 | 0.00 |
| INTC | Intel Corporation | 18.28 | 0.00 |
| KLAC | KLA-Tencor Corpor | 29.77 | 0.00 |
| KLIC | Kulicke and Soffa | 5.90 | 0.00 |
| LRCX | Lam Research Corp | 37.73 | 0.00 |
| NEWP | Newport Corporati | 10.37 | 0.00 |
| NDSN | Nordson Corporati | 68.09 | 0.00 |
| QCOM | QUALCOMM Incorpor | 40.02 | 0.00 |
| RTEC | Rudolph Technolog | 8.60 | 0.00 |
| ST | Sensata Technolog | 17.91 | 0.00 |
| SPIL | Siliconware Preci | 4.61 | 0.00 |
| STM | STMicroelectronic | 7.07 | 0.00 |
| TGAL | Tegal Corporation | 0.36 | 0.00 |
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