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Asymtek Introduces New Dispensing System
Asymtek Inc. has introduced the Millennium M-2020 dispensing system for high-speed, highly accurate dispensing in microelectronics applications. The M-2020 dispenses a wide range of adhesives, encapsulants and thermal compounds, while delivering 2g peak acceleration and repeatability of ± 0.025 mm in high-throughput environments. The system is both SMEMA-compatible and SEMI-S2 compliant. The unit's pump is a positive displacement linear type that is unaffected by fluid viscosity, supply pressure, needle size or fluid/pump temperature. Dam and fill operations are easily accomplished with an optional dual-action dispensing head, according to Asymtek. Contact or impingement heating ensures a reliable thermal environment. The company has also announced a CCD non-contact laser height sensor for the M-2000 series. This height sensor provides high-speed dispense height measurement for delicate substrates, hybrids and ICs that may be compromised by tactile sensing. Non-contact height sensing eliminates concerns regarding flex, vibration and substrate contamination. The sensor's high-speed light processing capability accommodates wide variations in substrate finish, including rough, dark and mirrored surfaced, enabling greater throughput and higher yield. The high-resolution CCD sensing element is insensitive to stray light or beam reflections from nearby objects. According to Asymtek, the specialized automated circuitry employed to control the duration of laser emissions prevents measurement errors due to surface color variations. Asymtek, a Nordson Company, 2762 Loker Ave. West, Carlsbad, CA 92008, phone 760.431.1919, fax 760.471.2330 [asymtek.com] New Lead-Free Alternative Replaces Solder Epoxy Technology Inc. has released EPO-TEK EE165-3, a silver-filled, electrically conductive adhesive designed as a solder replacement for SMT, hybrid microelectronics and other electronic assembly applications. According to the company, the adhesive provides the electrical and physical stability of a solder joint, using an environmentally friendly process that demonstrates recognizable cost-savings in process clean-up and disposal. Conductive adhesives offer advantages such as low process temperature, electrical and physical joint stability and are usually preferred in applications where the temperature sensitivity of the components or substrates is critical to performance. The adhesive's low process temperature makes it suitable for flex circuits and temperature-sensitive ASICs. The compound was designed specifically as an alternative for mounting applications formerly dominated by metal solder. Epoxy Technology, 14 Fortune Dr., Billerica, MA 01821, phone 978.667.3805 [epotek.com] Aetrium Debuts Production Test Handlers Aetrium Inc. has introduced two new IC test handlers for leading-edge Micro Lead Frame, SON and QFN-packaged ICs. Designated Models 5500 and 5800, the handlers are suited to high-volume production test of MLF packages. The Model 5500 MLF employs a straight-through gravity-feed handling system and incorporated a dual test site able to run as independent single sites. It can operate with a tri-temp capability ranging from -55¡C to +155¡C. Throughput up to 14,000 UPH is claimed. The Model 5800 Small Component Integrated Test Handler operates at temperatures ranging from ambient to +155¡C and employs a vibratory bowl feed input. The system can reportedly achieve a thoroughput of up to 12,000 UPH. Aetrium Inc., 2350 Helen St., North St. Paul, MN 55109, phone 651.770.2000 [aetrium.com] LaserPro Sphere Attach System Debuts
Kulicke & Soffa Industries has introduced the LaserPro, the first laser solder sphere attach system suitable for high volume, ultrafine pitch plastic ball grid array and CSP production. The LaserPro combines the accuracy, material handling flexibility and speed of the company's Model 8000 wire bonder with a laser and proprietary ball placement system, according to K&S. The unit offers floor space savings because a flux applicator, reflow oven and flux residue cleaner are not needed. The LaserPro places solder balls in an N2 bath onto the substrate and immediately reflows the ball with laser energy, within the footprint of a wire bonder. K&S says a one-time purchase of ball size kits handles a broad range of package types. The system is a Class 1 laser product that mets CDRH and IEC laser safety standards. Volume shipments begin in October. Kulicke & Soffa Industries, 2101 Blair Mill Rd., Willow Grove, PA 19090, phone 215.784.6000 [kns.com] ESEC Introduces New Die Attach System The ESEC Group has introduced a new die bonding platform, the ESEC die Bonder 2008xP, tagged to a wide variety of applications. These include metal leadframes, substrates and films to singulated BGAs. The modular unit is based on ESEC's 2008 die bonder, which according to ESEC, has sold more than 200 units in its first 10 months. Delivery of the 2008xP is scheduled for January. For high-end applications, the unit features an advanced vision system, incorporating optical bond centering and optical dispense certering that locates and centers the bond pad. ESEC (USA) Inc., 9830 S. 51st St., Phoenix, AZ 85044, phone 480.893.6990 [esec.com] Taping/Inspection Unit Adds Laser Marking
Ismeca has announced the MP400L component handling and inspection system which adds laser marking abilities to the MP400 mid-volume, tray-to-tray platform. The MP400L enables a wide range of inspection and rejection functions to be performed during package handling to ensure that only good parts are placed on tape. The system provides true three-dimensional lead/ball coplanarity inspection and mark inspection of BGAs, CSPs and other two- or four-sided components. Two programmable axes enable components to be picked from standard JEDEC trays. A full 360-degree rotation on the pickup head offers proper orientation of parts before placement onto tape. An optional laser will mark the parts during processing. Another available feature enables the parts to be electrically tested before final packaging. An automatic tray load/unload feature outputs to tape at up to 4,500 parts/hour or to tray at up to 3,000 parts/hour. Ismeca USA Inc., 2365 Oak Ridge Way, Vista, CA 92083, phone 760.305.6200 [ismeca.com] Universal Launches Thin-Film Applicator Universal Instruments has launched its next generation fluxer, a linear thin-film applicator, compatible with the GSM, GSMx and GSMxs platforms and designed specifically to assist in the assembly of flip chips. The LTFA can simultaneously dip up to seven nozzles into the flux channel, more than double the capacity of Universal's rotary thin-film applicator. The LTFA consists of fewer parts than past thin-film applicators, enabling simple cleaning and maintenance procedures, according to the company. No tools are needed for the disassembly of viscous-fluid-related components. Additionally, the flux head maintains exact control over the flux thickness. Only two feeder slots are needed for the LTFA, a significant reduction from the number required for the Universal rotary thin-film applicator. Universal Instruments Corp., P.O. Box 7429, Endicott, NY 13760, phone 1.800.432.2607 [uic.com] GSI Lumonics Bows Laser Marking Unit
GSI Lumonics has unveiled the LightWriter F10, a compact fiber laster system suitable for marking IC packages and other small plastic devices. The unit combines the accuracy, reliability and throughput of the GSI Lumonics scan head with a zero maintenance, 10-watt fiber laser. Multiple marking-head capability is available for high throughput and large mark field requirements. LightWriter controls are rack-mountable and connect to the fiber laser marking head using only electrical cabling. The system is delivered with a choice of graphical user interfaces, including ICMARK II or LightWriter NT. Options include Flexmark, for marking strips and trays, and a TCP/IP SECS II GEM communications link. GSI Lumonics, 22300 Haggerty Rd., Northville, MI 48167, phone 248.449.8989 [gsilumonics.com]
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