This month issue An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics September - October 2000 Email the editor

ECT Intros Universal BGA Contactors

PrimeYield Systems, part of ECT's Semiconductor Test Group, has introduced a new family of standardized contactors designed for BGA packages, known as Universal Contactors.

These contactors provide the features and benefits of PrimeYield's custom-designed contactors, but are offered in a shorter time and at a lower price.

Footprint and customer-level contactor drawings are immediately available to support rapid board layout and handler kit development. Universal Contactors can be reconfigured in the field from one standard-size package to another of the same pitch.

Universal Contacts employ the same contacting technology as standard, application-specific µHPC/GA contactors. Each path consists of a contact element and a port of SMM elastomer with features for handler alignment. The guide plate consists of a base and a removable package guide. The base contains a full grid of contact element locations, enough to suport the highest ball count for any given size package.

PrimeYield Systems, 4837 White Bear Parkway, St. Paul, MN 55110 [ectinfo.com]

Synergetix Adds Particle Probe Contact

Synergetix has introduced the Particle Probe contact for use in test socket and multi-cycle connector applications requiring extremely low contact resistance.

The design is unlike conventional spring probe technology and boasts a .085 inch OAL with a compressed length of .063 inch.

Synergetix has also expanded its line of CSP sockets. The sockets are designed for devices with a 0.5 mm pitch and feature spring contact probes, providng a reliable signal path and a cycle life of 500,000 insertions.

The extremely short compressed height of the spring contact probes (2.4 mm) results in a socket with a nearly transparent signal path, self-inductance values as low as 0.5 nH and a bandwidth of -1.0 dB at 6 GHz. Two separate optional lid designs are offered: a clip-on setup lid for automated test or a clamshell lid for manual test.

Synergetix, 310 S. 51st St., Kansas City, IKS 66106, phone 913.342.6623 [synerget.com]

OptiGrid Confocal Microscope Debuts

The OptiGrid offers desktop access to realtime confocal imaging.

Optem has introduced the OptiGrid desktop microscope, said to offer realtime, research-quality confocal imaging for semiconductor applications.

Designed to work in tandem with most desktop computers and any electronic camera, the OptiGrid converts a standard reflected-light microscope into a fully operational confocal unit, capable of optical sectioning, image stacking, full-focus compilation and 3-D rendering.

The OptiGrid yields a light efficiency of 92%, nearly twice that of the brightest alternative confocal techniques, Optem claims.

With the OptiGrid activated, the operator can still observe a specimen conventionally through the microscope eyepieces, allowing easier maneuvering and fine focusing of the specimen for confocal image acquisition.

Optem, 78 Schuyler Baldwin Dr., Fairport, NY 14450, phone 716.223.2370 [optemintl.com]

TI's New CSP Burn-In Socket Debuts

Texas Instruments Interconnection Business has introduced a new high-volume Touch-Spring burn-in socket for memory and logic ICs that are packaged in ultrafine 0.5 mm-pitch CSPs.

The new socket supports the growing market of wireless devices, such as cell phones and personal digital assistants, which increasingly rely on fine-pitch semiconductors for high performance in a small package.

The socket will enable chip designers, manufacturers and product developers to take advantage of next-generation chipsets that integrate multiple components, such as memory, logic and DSP semiconductors, TI says.

Employing a clamshell technique, the CSP socket uses a compressive spring contact system and delivers a contact force of 10g-12g target. The current I/O range is 40, 56, 84, 151, 241 and 289 with higher and lower I/O offered for custom applications.

Texas Instruments Interconnection Business, 111 Forbes Blvd., Mansfield, MA 02048 [ti.com/mc/igb]

Schlumberger Aims at SOC Testing

Schlumberger Semiconductor Solutions has introduced the EXA3000 series for high-performance system-on-a-chip testing.

The EXA3000 can offer up to ±75ps edge placement accuracy, 800 Mb/s data rates and a -120 dB analog noise floor to generate higher product yields when testing high-speed datacom ASICs.

Scalable levels of price-performance are available to suit the different needs of high-volume SOC device makers.

The EXA3000 can be fitted with more than 100 mixed signal test options, including RF for integrated wireless devices and a broadband analog channel to meet the requirements of emerging HDTV, ADSL and high-performance DVD applications.

Schlumberger Semiconductor Solutions, 150 Baytech Dr., San Jose, CA 95134, phone: 1.877.SABER.US.

[schlumberger.com]

Delta Design Premieres Gravity-Fed Handler

Cohu's Delta Design has premiered the Delta 1888 gravity-fed handler for RF/wireless handling applications.

The test site has been designed to allow maximum flexibility in RF interface design. The plunge-to-board feature is software programmable for ease of setup. Plunge index time enables up to 7,200 UPH for single site and 14,400 UPH for dual site high frequency testing.

The Delta 1888 incorporates active mechanisms throughout the parts path to provide a continuous flow of parts through the handler.

Delta Design Inc., One Monarch Dr., Littleton, MA 01460, phone 978.486.1060 [deltad.com]

Alphasem Previews New Die Attach Unit

Alphasem, a Universal Instruments company, recently previewed its new Swissline 9002 die attach system for flex-based packages. The unit is based on the Swissline 9002.

Features include flexible indexing system, inline pre-cure station, a matrix lamination station and heated chucks (supporting different process stations).

A new indexing system can accommodate flex substrates without carriers or boats for smooth handling with minimum space required for transporting substrates.

The inline pre-cure solution and the matrix lamination station secure the placement position before transferring the flex substrate to the magazine of the inline snap cure oven.

Alphasem AG, Andhauserstrasse 64, CH-8572 Berg/TG, Switzerland [alphasem.com]

Alphasem's Swissline 9002 die attach system

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