CAMALOT Completes Move from Haverhill to Corporate HQ Franklin, Mass.-Cookson Electronics Equipment, formerly Speedline Tech-nologies, has relocated its CAMALOT manufacturing facility to corporate headquarters in Franklin from Haverhill, Mass. The planned relocation was announced in October 2001 and, according to the company, "creates a Center of Excellence for dispensing and printing at the Franklin facility. [cooksonelectronics.com] New Name for SpecialtySemi Newport Beach, Calif.-Jazz Semiconductor has been selected as the new name for SpecialtySemi. [jazzsemi.com] Teradyne Connection Systems Will Close San Diego Facility Boston-Teradyne Inc. has announced that it plans to cease production at its San Diego, Calif., Connection Systems division and to terminate about 125 workers before year's end. Teradyne acquired the plant in August 2000. It will shift the division's printed circuit board work to its plant in Nashua, N.H. [teradyne.com]
Pac Tech's New Flip-Chip Unit Omitted from CSR's Vendor List Nauen, Germany-Due to a production error, we omitted Pac Tech's Laplace placer for flip chip, capacitor and resistor attach from our August-September list of die attach-flip-chip bonder manufacturers.
BiTS Workshop Calls for Papers Mesa, Ariz.-The Burn-in and Test Socket Workshop is looking for original, unpublished papers about the socketing field. BiTS is scheduled March 2-5 in Mesa. For more information, visit bitsworkshop. org.
Space Agency Tags Emulation Technology as Hubble Vendor Baltimore-NASA Goddard Space Flight Center has selected Emulation Technology (ET), Santa Clara, Calif., to provide a custom adapter needed to test the Intel MQ80386-20 microprocessor. The microprocessor is an integral part of the Hubble Space Telescope's Wide Field Camera 3 (WFPC3) project, which will replace the Hubble's previous camera. The Intel device required a custom adapter to convert its 164-lead quad flat pack into a 132-lead pin grid array footprint. Replacing the microprocessor would have been costly or impossible, according to the N. California company. [emulation.com] STATS Names Suh New COO and President of U.S. Operations Singapore-STATS has named Tae Suk Suh to the new post of chief operating officer. Additionally, Jeff Osmun has been promoted from vice president of U.S. sales to vice president of worldwide sales and marketing. Concurrently, Osmun will serve as president of U.S. operations, based at the company's Milpitas, Calif., facility. Both positions report to Tan Lay Koon, STATS' president and CEO. Prior to joining STATS, Suh was managing director of Philips Semiconduc-tor, Thailand. Earlier, he held senior posts in quality assurance and operations at Philips and Signetics Korea. He earned a degree in business administration from Kyung-Hee University, Korea. Osmun joined STATS in 1999 as director of U.S. sales and was promoted to vice president of U.S. sales last year. Earlier, he served in senior management posts with Kyocera America, where he was national sales manager. Osmun graduated from Leigh University in Pennsylvania with a degree in mechanical engineering. [stts.com] Industry-Wide Consortium Forms for Test Architecture Advantest Corp. is establishing the Semiconductor Test Consortium, the first industry-wide collaboration aimed at solving the challenges of testing complex logic devices cost-effectively. [advantest.com]
SunSil Inc. Will Represent Shibuya Kogyo's Ball Mounters Alamo, Calif.-Shibuya Kogyo of Kanazawa City, Japan, has appointed SunSil Inc. to represent its line of solder ball mounting systems in North America. The Shibuya solder ball mounters (the SBM 350 for ball placement on ICs in strip form and the SBM 360 for wafer-level ball placement) are employed to interconnect ICs to area array package substrates. [sunsil.com] Chip Supply Inc. Will Distribute Lightspeed's CMOS KGD Orlando, Fla.-Chip Supply Inc. will distribute Sunnyvale, Calif.-based Light-speed Semiconductor's known-good die in North America and Europe under a recently signed agreement. Chip Supply is also authorized to provide non-standard packaging options and modules using the Lightspeed CMOS die products. [chipsupply.com] Taiwan's WAE and Walton Advanced Engineering Merge Kaohsiung, Taiwan-Walsin Advanced Electronics (WAE) has been consolidated into Walton Advanced Engineering. Both companies were members of the Walsin Lihwa Corp. Founded in 1995, and now with more than 1,900 employees, Walton will focus on memory IC packaging and turnkey test services. Walton is also expanding into China, with a facility scheduled for completion in mid-2003. [wae.com.tw]
IBM Microelectronics Unveils 'Most Advanced' 300mm Wafer Fab in East Fishkill, N.Y. East Fishkill, N.Y.-IBM Microelectronics has opened a new 300mm wafer fab, he most advanced of its kind, according to IBM. The company says the new plant is "designed to satisfy increasing customer demand for IBM's chip technologies through high-end foundry manufacturing services, as well as IBM's custom and standard offerings." Work has started on prototype customer designs and the facility will begin volume manufacturing later this year.
The plant is 140,0002 feet, and is designed to support the creation of chips with circuits smaller than 100nm. IBM says the plant contains 200 miles of piping and tubing, 600 miles of cable and wiring and two million pounds of ductwork. [ibm.com] Epoxy Flux Series for Flip Chip Applications Indium Corporation of America's new Epoxy Flux Series, designed specifically for Flip Chip soldering processes, delivers powerful metal surface oxide cleaning activity and promotes excellent solderability during reflow. These Halide-Free, No-Clean fluxes then cure as an epoxy after reflow, becoming a rigid polymer layer surrounding the solder connections and providing excellent protection against current leakage and environmental corrosion. PK-001 Epoxy Flux is formulated for use with standard tin/lead solders, while PK-002 Epoxy Flux is designed for use with lead-free solders. [indium.com] (right) |
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