Media Kit
For advertisements and demographics
click here

On Line Reader Service
List of the sponsors with ChipLinks

 Publisher's Letter
The Best of Times, the Worst of Times

 Assembly Lines
From Poetry to China - If You're Looking For Variety, I've Got It All!

 Opto-Electronically Speaking 
Intriguing New Technologies Emerging as MEMS Continue Their Upward Trek

 Electronic Trends
SEMICON West 2002 Revisited: Expectations Were Fulfilled

 Industry News
Company News
Opto/Nanotechnology
People in the News
Calendar of Events
Editorial Index

 Features
Send in the Cleans! Wafer-Level Packaging Is Raising the Traditional Bar on 'Clean Enough'
Addressing Key Plasma-Induced Damage Issues in Flip Chip and Wafer-Level Packaging Methods

Plasma Cleaning Equipment Provider Directory

Wet Process Cleaning Systems Provider Directory

Higher Performance, Cost and Shrinking Pad Pitches Top Concerns of Socket Industry

International Directory of Socket Manufacturers

Shrinking IC Package Sizes Are Driving the Quest for More Powerful X-Ray Inspection

X-Ray Inspection System Suppliers

Continued Improvements in the Use of Alloys and Polymers Enhance Wafer-Level IC Performance

How the Spiraling Growth of Leadless Packages Is Challenging Tape-and-Reel Processing

 Tools & Technologies
BIS Unit Inspects, Maps Wafer Surface and more...

 Patents
QFN Package Variation Improves on Thermal Specs

 Archives
2002
Jan-Feb Mar-Apr May-Jun
July Aug-Sep Oct
2001
Jan-Feb March April
May-June July Aug-Sep
October Nov-Dec  
2000
Jan-Feb Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec
1999
Jan-Feb Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec
1998
  Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec


Subscription
Free U.S. Subscription Form

 
Current Issue
The International Reference for Chip-Scale Electronics, Flip-Chip Technology, Optoelectronic Interconnection and Wafer-Level Packaging
October 2002

The Best of Times, The Worst of Times
Gene Selven
Publisher

As Charles Dickens wrote in A Tale of Two Cities, "It was the best of times; it was the worst of times," but that was in 1775. Compare that to the mood at the recent SEMICON West of July 2002.

Many exhibitors were surprised (and pleased) with the turnout, especially at the wafer processing segment in San Francisco. Exhibitors remarked positively about the quality and the quantity of the visitors. Attendees and exhibitors alike spoke glowingly about the growth prospects for 300mm wafer technology.

Now that SEMICON is a fading memory, much of the show's enthusiasm has waned, and the economic recovery seems stalled at square one again.

At Chip Scale Review, we like to say that "the technology has caught up with our magazine." Judging by the assembly and manufacturing technologies that are being employed in chip-scale, flip-chip and wafer-level packaging, there will be a bright, inexhaustible future.

Just consider the host of old and new companies now appearing at the various conferences around the country. A majority are showing applications focused on these advanced packaging processes.

The $64 million question that still bedevils me-and almost everyone in the industry-is, "When will the industry resume its former robust growth?"

Time to Get the Show on the Road Again!

Some suppliers, after severe cutbacks and downsizing, seem ready to embark anew on an aggressive marketing program. Their sentiments can be expressed as, "We've been dark too long; it's time to get this show back on the road!"

Others are content to wait for the recovery by sitting on the sidelines. While we can't fault the latter group for being ultra-conservative, history has shown, again and again, "out of sight, out of mind."

How would Mr. Dickens characterize the current recession? Perhaps he would say, "It was the worst of times, but the best is yet to come!" All that we have to remember is that the semiconductor industry has proven its resilience. It has proven emphatically, time and time again, that it will bounce back, stronger than ever.

Meanwhile, keep the faith. And let's turn the lights up again, together, in a return to the best of times!

[gselven@ChipScaleReview.com]

 
Copyright © 2002