Current Issue The International Reference for Chip-Scale Electronics, Flip-Chip Technology, Optoelectronic Interconnection and Wafer-Level Packaging October 2002 Email the editor

The BIS applies advanced vision and image processing to inspect wafer surfaces and bumped wafers.

BIS Unit Inspects, Maps Wafer Surface

Camtek, Migdal HaEmek, Israel, has introduced the BIS (bump metrology and wafer-surface inspection system) for use on wafer surfaces and bumped wafers. The unit provides wafer mapping and detects variable-size defects. It inspects all bump types and shapes.

The BIS system combines 2D and 3D measurements to offer statistical process control for production monitoring. The system is equipped with a self-learning program that can distinguish between good and bad bumps. [camtekusa.com]

New Phase Changing Material Is Available

Henkel Loctite Corp., Laguna Hills, Calif., has developed Power-strate 51R, a phase change, thermal interface material targeted for use between lidded microprocessors and heatsink assemblies.

Powerstrate is offered as an alternative to thermal grease for processor heatsink attachment and is thixotropic. The material is available in roll form, with or without adhesive edge-strips. [henkel.com]

This monitor image shows the surface current response of a Bluetooth antenna at 2.45 GHz input with Micro-Stripes software.

Research Spotlights Bluetooth RF Problems

Flomerics, Southborough, Mass., says it has demonstrated the negative effects plastic enclosures can have on the RF signal performance of Blue-tooth antennae.

Experiments using Micro-Stripes V6.0 electromagnetic modeling software show that placing a Bluetooth antenna against a plastic enclosure reduces signal strength by 37.5 percent, according to Flomerics.

The plastic also caused a broadcast signal shift to 2.1159 GHz, taking the device's performance outside Bluetooth standards.

The study has "huge implications for device manufacturers and demonstrates the potential hazards they could face if designers neglect to properly simulate and test their devices' RF outputs in-situ." [flomerics.com]

Autosplice's Solderball Pins are a new SMT interconnect technology.

Solderball Pin Technology Interconnects PC Boards

Autosplice, San Diego, has announced Solderball Pin technology, a new SMT interconnection method.

The Solderball Pin concept enables interconnections between parallel, stacked PC boards, such as those employed in power device modules and/or daughterboards to motherboard assemblies.

Designed with a high conductivity copper peg on one end and a solderball on the other, Solder-ball Pins can be inserted into the daughtercard, which is then placed on to the motherboard, and reflow soldered. [autosplice.com]

This 10 GHz BGA/CSP socket is targeted to 0.5mm pitch units, such as the Xilink CP132 package.

10 GHz Bandwidth CSP Socket Fits 0.5mm Pitch

Ironwood Electronics, Eagan, Minn., has announced the chip-size, 10 GHz bandwidth BGA/CSP socket for 0.5mm pitch packages, such as the Xilinx CP132 format.

According to Ironwood, the sockets easily support very dense BGA devices by employing a high-performance conductive elastomer contactor. Pricing is $430 in 100-lot quantities. [ironwoodelectronics.com]

New Microvia Drilling Technology Introduced

NanoVia LP., Londonderry, N.H., has developed the HyperVia holographic micovia drilling technology for drilling current and next-generation high-density 3G smart chip carrier packages.

According to the company, the technology can produce microvias on randomly pitched grid arrays at process rates that are twice as fast as current laser systems. [nanovia.com]

SynTECH is offered in a variety of formats.

Synthetic No-Clean Solder Cream Offered

AMTECH Inc., Branford, Conn., has introduced SynTECH, the world's first no-clean solder cream, fabricated from synthetic poly adducts.

SynTECH is targeted at solder joints in PC board assemblies and is claimed to offer higher throughput with less scrap and rework than existing solder creams.

AMTECH also claims a wider process window of 12 to 18-hour stencil life and 18 to 24-hour tack time, and no refrigeration is needed.

The product is available in a variety of formats. The cream leaves a non-conductive, non-corrosive post-reflow residue which acts as a protective coating. [solderproducts.com]

The TM-20C taping module

OEM Taping Module Is Easier to Interface

ON-TRAK LLC, New Berlin, Wis., has introduced the TC-20C OEM taping module in a small, easy to interface package. The self-contained unit is supplied with tape drive, sealing station, fault sensing, reel support and a process controller with operator interface. [ontrakllc.com]

Unitive Inc. Adds Electroplating Tool

Unitive Inc., Triangle Research Park, N.C., has become the first semiconductor packaging company to implement Semitool's new, fully automated electroplating tool, the APx for wafer-level packaging. [unitive.com]

Entry-Level X-Ray Unit Offers Benchtop Access

Phoenix X-Ray Systems and Services Inc., Camarillo, Calif., has introduced a configurable, entry-level benchtop x-ray system for inspection and failure analysis.

The Bench-Mate is a hi-res microfocus x-ray system that delivers high contrast inspections with a footprint about the size of a small filing cabinet. [phoenix-xray.com]