• RFID Assembly: Plugging into the 'Next Big Thing'
• Laser Singulation and Scribing Technologies as Alternatives to Conventional Mechanical Dicing
• International Directory of Scribing and Singulation Tools
• Equipment Advances: 3D Inspection of Bumped Wafers in Production
• Publisher's Letter: To be or to be more: It's the 10th anniversary of SEMICON Taiwan!
• Assembly Lines: Rehabilitating history: Refurbishment is underway to preserve the HP garage
• Electronic Trends: Wafer-applied underfills protect ICs subjected to rough use
• Test Topics: Probing where no one has gone before
• China Watch: China's packaging foundries must promote core competancies and fill technology gap
• Calendar
• Inside Patents: Two recent patents improve on flip-chips' CTE problems
• Ad Index
| CSR Stock Index | |||
| Symbol | Name | Last | Pct Change |
| ASX | Advanced Semicond | 4.72 | 1.51 |
| AEHR | Aehr Test Systems | 0.77 | 0.00 |
| AMKR | Amkor Technology | 6.07 | 1.34 |
| AMAT | Applied Materials | 12.79 | 1.19 |
| ASMI | ASM International | 35.05 | 3.27 |
| CSCD | Cascade Microtech | 3.63 | 0.00 |
| IMOSD | IMOSD | 0.00 | 0.00 |
| INTC | Intel Corporation | 26.74 | 1.75 |
| KLAC | KLA-Tencor Corpor | 51.98 | 0.87 |
| KLIC | Kulicke and Soffa | 11.63 | 2.11 |
| LRCX | Lam Research Corp | 44.19 | -0.72 |
| NEWP | Newport Corporati | 19.49 | 2.31 |
| NDSN | Nordson Corporati | 47.90 | 3.03 |
| QCOM | QUALCOMM Incorpor | 61.06 | 0.54 |
| RTEC | Rudolph Technolog | 10.83 | 1.21 |
| ST | Sensata Technolog | 31.00 | 1.74 |
| SPIL | Siliconware Preci | 5.47 | -0.91 |
| STM | STMicroelectronic | 7.01 | 0.29 |
| TGAL | Tegal Corporation | 3.12 | 0.00 |
| Refresh page to update | |||




