The International Magazine for Device and Wafer-Level Test, Assembly, and Packaging Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS, MOEMS, RF/Wireless, Optoelectronic and Other Wafer-fabricated Devices for the 21st Century

October 2005
Chip Scale Review is produced for a worldwide audience of engineers, specialists, researchers and end-users of chip-scale and wafer-level back-end electronics manufacturing in print and digital editions. Chip Scale Review covers the chip-scale, flip-chip and wafer-level packaging market with a thoroughness unmatched by any other magazine.

RFID Assembly: Plugging into the 'Next Big Thing'

Laser Singulation and Scribing Technologies as Alternatives to Conventional Mechanical Dicing

International Directory of Scribing and Singulation Tools

Equipment Advances: 3D Inspection of Bumped Wafers in Production

Table of Contents

Publisher's Letter: To be or to be more: It's the 10th anniversary of SEMICON Taiwan!

Assembly Lines: Rehabilitating history: Refurbishment is underway to preserve the HP garage

Electronic Trends: Wafer-applied underfills protect ICs subjected to rough use

Test Topics: Probing where no one has gone before

China Watch: China's packaging foundries must promote core competancies and fill technology gap

What's New

Industry News

Calendar

Inside Patents: Two recent patents improve on flip-chips' CTE problems

Ad Index

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CSR Stock Index
SymbolNameLastPct
Change
ASXAdvanced Semicond4.721.51
AEHRAehr Test Systems0.770.00
AMKRAmkor Technology6.071.34
AMATApplied Materials12.791.19
ASMIASM International35.053.27
CSCDCascade Microtech3.630.00
IMOSDIMOSD0.000.00
INTCIntel Corporation26.741.75
KLACKLA-Tencor Corpor51.980.87
KLICKulicke and Soffa11.632.11
LRCXLam Research Corp44.19-0.72
NEWPNewport Corporati19.492.31
NDSNNordson Corporati47.903.03
QCOMQUALCOMM Incorpor61.060.54
RTECRudolph Technolog10.831.21
STSensata Technolog31.001.74
SPILSiliconware Preci5.47-0.91
STMSTMicroelectronic7.010.29
TGALTegal Corporation3.120.00