Publisher's Letter eMail the Editor

Features In Search of the Perfect Cut Longer blade life, sawing accuracy and high throughput are major concerns in the selection and use of next-generation singulation systems. Test-Handler Makers Look at the Challenges Ahead The growing popularity of CSPs has forced test-handler makers to invent new methods and/or adopt old techniques for accommodating the leadframe-free needs of these advanced packages. Technical Forum Keeping Pace with Technology Demands Changes in Package Design and Selection Semiconductor makers and packaging engineers are confronting a new set of challenges as ICs become faster, smaller and more power hungry. Keeping pace with the latest technology advances demands implementing massive changes in package design and routing practices. Electrical and thermal test methods must also be re-examined, since standard tests may no longer apply.