By Gary Wagner
Imaging Technology Inc.
Bedford, Massachusetts
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For manufacturers of semiconductors
and electronics, machine vision has
become an essential component in the quest
to achieve competitive economies of scale.
Machine vision typically employs video
cameras, frame grabbers and computers
to replace human vision in evaluation
and inspection tasks where extreme
precision, repetition and/or high speed
are needed.
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Overview
As shown in Figure 1, the typical machine
vision system uses one or more video
cameras to precisely position or inspect
parts. Proper lighting of the scene is nec-essary
for the camera to reliably see subtle
defects or differences in contrast.
A lens focuses an image from the part
being inspected onto the camera's sensor.
The signal from the video sensor is digi-tizedÑ
converted from a continuous
(analog) signal into samples called "pixels."
These pixels represent light intensity (or
some other measure) at points on the part.
An array of pixels is called an "image."
The image is typically manipulated by
general purpose processors, such as
Pentium-class personal computers. Two
types of manipulation are involved:
image processing and image analysis.
First, image processing converts one image
into another image. Processing operations
are used to select or amplify important
features in an image, such as the edge of a
package. A feature, roughly speaking, is a
component or attribute of an object such
as its color, intensity, texture, or edges.
Second, image analysis converts an
image into measurements, such as the
package's size and location. For example,
image analysis is used to characterize the
size and shape of particles trapped on a
PWB to determine whether a high-quality
solder joint can be produced. In machine
vision, measurements such as color, size
and distance between edges are used to
evaluate various package parts and reject
those with defects.
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Figure 1. Basic components of a machine
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System Components
Machine vision systems acquire and
process images and use the collected
information to report on (or control) a
process. The primary components
involved include cameras, lighting, one
or more vision controllers or frame
grabbers and machine vision software
running on a computer.
Lighting
Four primary types of lighting can be
used in machine vision applications:
front lighting, backlighting, structured
lighting and strobe lighting. The goal is
to find the combination of techniques
that results in the best possible image.
Front lighting illuminates the area in
front of a part. The result is a pattern
that is created by the part intersecting
the light. Backlighting places the light
source behind the object of interest so
that a silhouette is created. Structured
lighting uses sheets of light to determine
the shape or dimensions of a part by
observing the pattern made when the
part intersects the structured light.
Finally, strobe lighting allows high-speed
processes to be monitored by providing
a short burst of light, typically in the
microsecond range.
Within these four categories are a
dozen or more specific types of lighting
techniques. For example, diffused lighting
is employed when image contrast is high
and edges are distinct, such as when traces
contrast with the background wafer.
A special way to implement diffused
lighting is with a light tent. This technique
helps eliminate glare, such as when imag-ing
ball grid arrays, by bouncing light off
a surface placed in front of a part.
Cameras
Today, most machine vision applications
use analog cameras to capture the image
of the part being inspected. While digital
output cameras are available and may
produce better signal-to-noise ratios, the
benefits are not always cost justified over
lower cost analog cameras.
Ultimately, the application's inspection
rate, algorithm details, and physical
constraints will determine the speed, res-olution,
and type of camera used. While
RS170 or CCIR cameras are common, the
need for more detail and faster acquisition
rates is rapidly driving machine vision in
the direction of higher resolution, pro-gressive
scan cameras.
Frame Grabbers
A frame grabber is an image capture board
that connects to either a proprietary
processor or off-the-shelf computer
(Figure 2). The board takes a set ("frame")
of image data from a camera, converts it
from analog to digital, and stores it in
memory for further processing.
A primary difference between com-peting
frame grabbers is their memory
architecture. There are two basic kinds:
The FIFO-based and the on-board
memory-based.
A FIFO-based design streams data
into a 1K or 2K temporary buffer at the
output rate of the camera. Data is sent
from the FIFO to the host computer's
memory after the FIFO fills.
A problem with this type involves data-rate
mismatch between the incoming
data (usually 0 Hz to 50 MHz, slow scan
video to very fast scan video), and the
computer's bus architecture, which, in
the case of the PCI bus, must transfer
data across the bus at 132 Mb/second.
On the other hand, memory on the
frame grabber, coupled with a DMA
(direct memory access) engine, allows data
to simultaneously enter from a camera
sensor and be transferred to the host
computer's memory with very little over-head
from the CPU. The difference in CPU
loading can be as dramatic as 1% from a
frame grabber with on-board memory
vs. 42% from a FIFO frame grabber.
With 40+% CPU loading, there is little
time left for other computer processes,
like image analysis.
Vision Software
When considering machine vision software,
first assess how much of the software inte-gration
task you are willing to assume. The
choice of whether to write a custom algorithm
or use an off-the-shelf package depends
on the uniqueness of the application and
the time constraints of the project.
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Figure 2. Frame grabbers transfer the image from the camera and convert it into a digital format for further processing.
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In general, using software packages written
specifically for machine vision not only speeds
the completion of the project, it usually
results in a faster, more reliable solution.
Common Bottleneck
One of the most common bottlenecks is
the integration of the host computer-based
software with the frame grabber.
Because of this potential problem, strong
consideration should be given to the
maturity of the interface between the frame
grabber's software and that of the image
processing package being considered.
Basic frame grabber software function-ality
should, at a minimum, include methods
for triggering, strobing, frame reset, data
transfer to host, image display, and a way
to dynamically tweak the camera interface.
These are invaluable features when first
setting up the system to acquire an image.
Once the desired image is acquired and
delivered to the host memory, the task of
actually solving the machine vision
problem begins. Here, again, access to a
powerful image processing library designed
for machine vision (vs. medical or general
purpose image analysis), can greatly
improve performance, decrease develop-ment
costs and improve success rates.
Solving Problems
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Figure 3. Measuring the lead spacing on an IC package
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Figure 4. Bond pad evaluation on a small PC board
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Original
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Threshold
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Closing
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Result
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Machine vision has been particularly
successful in the evaluation and testing of
electronic components. These devices are
precisely built and with few variations, so
a machine vision system can easily inspect
for defects based on a defined set of limits
for a specified set of measurements.
Figure 3 shows a machine vision system
measuring the spacing of leads on an IC
package. The leads are illuminated so that
they are bright white against a black
background. A threshold operation on the
input gray-scale image creates a binary
(or bi-level) image where the leads are all
one intensity value, say 255, and the back-ground
another value, say 0. Image analy-sis
is used to find each lead and measure
its area and approximate position.
Using this information, precise meas-urements
of lead position are made on
the gray-scale image. These measurements
can typically be made from 1/4 to 1/16 of
a pixel (or more) with special conditions.
If the field of view is 50 mm and an image
with 640 columns by 480 rows of pixels
is used, then with 1/10 pixel accuracy the
measurement limit is about 0.01 mm.
Evaluating Bond Pads
Figure 4 shows evaluation of the bond
pads on a small PC board. (The pads are
used to electrically connect an IC to the
package pins.) The gold bond pads are
bright white.
As before, the input gray-scale image
is brought to its threshold to generate a
binary or two-level image; then a series
of image processing operations, known
as morphological operations, is used to
gauge pad size while looking for any
breaks. The photos in Figure 5 show part
of the process for a small area near the
top of the previous image.
The left image is a magnified view of
the original image; the next is the result
of bringing the original to its threshold.
A morphological closing is used to "fill-in"
any cracks in the threshold image,
resulting in the closing image. Subtracting
the threshold image from the closing
image yields the result image, which clearly
shows the gaps or open circuits in the
bond pads. This part is defective!
New Technologies
The above examples, along with most
machine vision applications, make heavy
use of a traditional mathematical tool for
finding and aligning patterns: normalized
grayscale correlation. This correlation has
been used for years within the machine
vision industry as the main vision align-ment
tool. In the past, it has met the
demands of most alignment tasks, but
today there is a big push for machine
vision software that can handle a much
wider variety of process variations.
While normalized grayscale correlation
is an accurate pattern-matching algorithm
under ideal conditions, its accuracy degrades
with variations in contrast, rotation, scale
and partially degraded and occluded patterns.
For those reasons, the need to provide the
industry with fast, flexible and accurate
pattern locating tools has become a must.
For example, wafer manufacturing
presents a difficult challenge for machine
vision. In pattern wafer alignment, many
changes are made to the material as it
proceeds through the production process.
To accommodate these changes, machine
vision tools are required to perform under a
variety of challenging conditions, including:
- Contrast reversal and intensity gradients
- Angular uncertainties of up to ±8 degrees
- Blur due to changes in depth of field
- Partial obliteration/missing features
and scale changes due to normal
process variations
Under these conditions, the vision tool
must locate the position and orientation of
the wafer within 1 µm in both the X and Y
directions, and within 0.1 degree theta of
rotation.
To accomplish this positioning, new,
adaptive pattern location tools have been
developed using geometric search tech-niques.
These new tools are able to over-come
the kinds of variations that affect the
appearance of a pattern. Once the desired
pattern is located to within a pixel, a sub-pixel
calculation is performed using neural-net-based
techniques to compute high sub-pixel
accuracy. The result is a robust and precise
pattern recognition tool that allows man-ufacturers
to handle the variations inevitable
in most packaging processes more easily
(Figure 6).
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Figure 6. New pattern recognition systems are able
to handle blurs due to changes in depth-of-field,
scale changes due to variations in the camera's Z
positioning, partial obliteration or missing features
and other manufacturing variations.
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Conclusion
Machine vision has finally come of age as
a mainstream tool for performing precise,
repetitive and high-speed package inspec-tion.
Furthermore, this technology promises
continued advancements that will enable
new and greater levels of manufacturing
quality, flexibility and cost control.
Mr. Wagner is President of Imaging
Technology Inc. [gwagner@imaging.com]