Camdenton, Mo.—Speedline ELECTROVERT has extended its Bravo reflow oven family with the addition of the Bravo 8105.

The Bravo offers 8 heating zones and 105 inches of heated length. The heater placement within each zone’s process gas intake allows individual zone temperature control.

High convection blowers move and distribute the process gasses uniformly and consistently within the oven’s entire heated length, according to the manufacturer. Users may vary blower volumetric flow to fine

tune product heat transfer in difficult applications.

The oven’s Windows NT-based internal software program employs an enhanced graphical interface for easy process recognition and administration. 508.520.6999 [speedlinetechnologies.com]

The new Bravo 8105 oven offers enhanced reflow capabilities for curing and soldering attachment applications.

Twain Harte, Calif.—SMG Enterprises has debuted the IC-BGA1, a lightweight, handheld inspection camera used to ensure proper placement of ball grid array packages on solder balls.

The camera joins the company’s InspectaCam video inspection equipment line. With LED illumination and a prism tip, the unit offers a choice of viewable angles. [sonora-mfg.com]

Singapore—Ever Technologies PT has developed a test socket for ShellCase Ltd.’s ShellOP package, a wafer-level optical CSP used for image sensors and light detection devices.

Designated the ET ELITE test socket family, the the BGA-type units were developed in cooperation with ShellCase Ltd.

A ShellOP-compatible socket for optical devices differs from a regular BGA-type socket because it allows for direct illumination of the tested chip, thus allowing full electrical and optical testing. The ELITE socket is being offered for a variety of chips in ShellOP packages.

Available socket designs consider such elements as the socket’s electrical capabilities and its ability to provide an even and effective illumination of the tested, packaged chip by offering a window equal in size to the light-sensitive area on the chip. [evertech.com.sg] [shellcase.com]

West Caldwell, N.J.—Fancort Industries has introduced the "Batch Bonder," a tooling system that employs adhesives to attach flip-chip, CSPs and similar devices to packages and substrates.

Fancort says the process is low cost, low temperature and lead-free, making it environmentally friendly.

Although developed primarily for use with anisotropic, conductive adhesives, the bonder can also be used with non-conductive adhesives. Anisotropic and non-conductive adhesive attach for flip-chip is particularly attract, claims Fancort, since the adhesive acts both as the attachment medium and as the underfill material, thus enhancing connection reliability.

The Batch Bonder consists of a bench press with built-in heaters and a vacuum system that works with a PLC to control time, heat and pressure in the fixtured work area. 973.575.0610, 1.800.326.2678 [fancort.com]

Fancort Industries' Batch Bonder is designed for adhesive attachment.

Southborough, Mass.—Flomerics Inc. has released a new version of its Web-based thermal model generator, FLOPACK, which is used to create thermal models of IC packages.

The updated version includes a feature called "JEDEC Library Wizard," which recognized standard JEDEC package outlines and generates the appropriate thermal model instantly.

In previous FLOPACK versions, the user was required to enter up to 30 pieces of information about the package, such as substrate dimensions, number of leads, etc., to generate a thermal model.

With the Library Wizard, the user selects the JEDEC package, inputs the power, die size and possibly one or two other pieces of information for some package styles. The program fills in the rest of the information automatically and generates the thermal model.

The first series of JEDEC libraries released support the PQFP, wire-bonded PBGA and PLCC packages. Other packages are scheduled to follow over the next few months. [flopack.com]