AI Offers Modified Adhesive Film Princeton Junction, N.J.—AI Technology Inc. has recently modified its ESP7675 film adhesive to enable in-line die attach. Known as ESP7675-HF, the enhanced adhesive can be tacked and induced to flow onto heated substrates with placement pressure during pick-and-place within seconds. Once the die has been tacked onto the substrate, the placement tools can be removed and the device will continue to cure without any mechanism holding it down. The device will maintain its position during curing with heat kept between 100-150oC for less than five minutes. [ait@aitechnology.com][aitechnology.com] GPD Introduces Micro Dispenser SystemGrand Junction, Colo.—GPD, a division of LIFT Industries Inc., recently introduced the Micro Dispenser, part of the DS Series of liquid dispensing systems. The machine is aimed at dispensing conductive materials and microlectronics liquid encapsulants for IC packaging. The Micro Dispenser is available in both stand-alone (Micro I) and in-line (Micro II) versions.
The Micro I features an 18 in. x 18 in. heated work area with vacuum and dual substrate locking fixtures, while the Micro II can be equipped with three zones for pre-, post- and work-area heat. Comparable to other DS Series dispensers, the Micro I/II operate on a QNX realtime "true" multi-tasking operating system using proprietary GPD dispensing software displayed in an X Windows format. The Micro II is also available with a magazine loader and unloader for automated applications. 970.245.0408 [gpd-global.com]
LPKF Laser Intros Next Generation Garbsen, Germany—LPKF Laser Electronics has introduced a new generation of laser systems for use in the electronics/semiconductor industries. The LPKF MicrolineLaser II, an excimer laser powered direct imaging system is targeted for producing ultra fine-line circuits on flexible and rigid materials. Typical applications are CSP interposers, sensors and all other circuits that require extremely fine structures. This system, according to the manufacturer, produces geometries as small as 15 microns and can accept layouts up to 6 in. x 6 in. with a resolution of two microns. The MicrolineLaser II achieves an extremely high throughput of up to 1.5 inches2/second. Its automatic handling system allows full integration in a production line, as well as hands-off operation. LPKF also announced a new contracting service for the production of flex circuits using the company’s new MicrolineLaser II technology. The company’s North American offices are located at 28220 SW Boberg Rd., Wilsonville, OR 97070, 503.454.4203, fax 503.682.7151. [lpkfcadcam.com] [sseco@lpkfcadcam.com]
San Jose—Ultratech Stepper has introduced a wafer stepper targeted at the micro-electromechanical systems (MEMS), micro-opto-electrical systems (MOEMS) and micro-machining applications market. The unit is designated the Model 1600DSA. [ultratech.com] APS TechFilm Offers Improved Film AdhesiveBillerica, Mass.—APS TechFilm has introduced preforms and film adhesives for use in electronics packaging and surface mount attachment. The preforms and adhesives are accurately pre-dispensed on easy-to-handle carrier sheets, continuous rolls or preforms to the manufacturers’ specs. Once the film adhesive is applied to one component or substrate, the carrier sheet is removed and another component can be easily mated. The adhesive is activated with heat to produce a uniform bond, freee of squeeze-out and undesirable contact between substrates and components. APS’ products effecitvely eliminate many of the environmental concerns associated with liquid, lead and traditional solder attachment. [adhesivepackaging.com]
Universal Launches Chip Shooter Web Info Binghamton, N.Y.—Universal Instruments Corp., a subsidiary of the Dover Corp., has launched the latest in a series of support tools for its electronics assembly equipment on the Web. UIC’s new "Knowledge Base for HSP (high-speed placement) Products" was developed to enhance the performance of high-speed placement chipshooters. The Knowledge Base provides solutions for a variety of common HSP machine issues. Its design allows users to quickly and easily search by symptoms, sub-symptoms, multiple sub-symptoms and keywords. For each sub-symptom, a list of possible causes is displayed, as well as known troubleshooting strategies. Users are encouraged to share best practives and add new strategies by using the guide’s interactive data entry screens. [uic.com/support/hsp] Schlumberger’s Laser Probe for Flip-ChipsSan Jose—Schlumberger has introduced the IDS 2500 laser probing system for design verification and failure analysis of flip-chip packaged ICs. The IDS 2500 employs Phase Interforometer Detector technology to adjust the laser scanning microscope. Schlumberger Semiconductor Solutions said that Mitsubishi Electric Corp has become the first to acquire the unit in Japan. [schlumberger.com] Low-Cost Image Processing System DebutsBurlington, Mass.—Vision Components has debuted the VCM30, said to be a "complete image processing system for under $400." The VCM30, according to its manufacturer, is the first image processing unit to include a NEMA 4 (IP67) housing as a standard feature. [vision-components.de] Hyundai Licenses FormFactor’s TechnologyLivermore, Calif.—FormFactor announced recently that it has licensed its wafer-level packaging and test processes to Hyundai Electronics Industries Co. Ltd. for use in the Korean company’s advanced DRAM devices. FormFactor says the technology will enable "Hyundai to dramatically lower back-end production costs for its DRAM products." [formfactor.com]
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