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 This month issue
An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics

November - December 2000

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 Convergence Ahead? EMS Providers Enjoying Strong Growth
By Harvey Miller
Contributing editor

One group in this complex industry–the board-box assemblers--havehas fared somewhat better in the public financial markets than another well-known group, namely, the IC assemblers.

We'll explore the implications and suggest future scenarios for each, which will include the potential for convergence.

Electronic manufacturing service (EMS) providers meet the manufacturing outsourcing needs for board-box-systemsboard-box systems of OEMs and IC package assembly and test of IDMs (integrated device manufacturers).

EMS Categories

These two major classes of customers, OEMs and IDMs, define the two major EMS categories. One is comprised composed of Celestica, Jabil, SCI, Solectron and hundreds more; the other group counts comprises Amkor, ASAT, ASE and dozens more.

Chip Scale Review often refers to the latter EMS group as packaging foundries, a synonymous term. For clarity, we'll designate the board-level group by the acronym originally devised by the IPC for them, EMSP, and we'll designate the IC package assembly group PF.

Actually the world is not that pure. PF Amkor, with its multi-chip and RF module offerings, and PF OSE are also board-level assemblers; Flextronics, a major board-level EMSP, puts chips on boards, eliminating the package. But we're getting ahead of our story.

Key Similarities and Differences

Both EMSPs and PFs are in a high-growth mode and need lots of capital. The public money markets are a capital rationing device, made to order for high growth industries.

Growth is rewarded with high price/earnings ratios. In turn, the highly valued stock becomes great currency for acquisitions. It's positive feedback that spirals ever upward. While the process goes on, no one worries about the limits.

(The party is too much fun, so we won't spoil it-just now-by talking of dilution and other nasties.)

Hereby Herein lies a major difference between the two EMS groups. After climbing to P/Es in the 60s to70s in April 2000, the stock prices of the two groups headed in opposite directions. Speaking in general terms, The the EMSPs moved up while the PFs headed downward, (along with the semiconductor infrastructure companies), ). speaking in general terms.

Electronics industry output reached such high levels early this year that production shortages and glitches cropped up, interrupting demand. They rippled back and impacted the semiconductor bottom of the food chain first. That was an underlying reason for the divergence–but there are two others:

(The reason is certainly not gross margins. The PFs, gauged by Amkor, earn twice as much as the EMSPs, which are stuck below 10% for most.)

  1. The board-box assembly EMS firms get to resell almost everything else - semiconductors, sheet metal, you name it–fast turnover is what they offer and profit from.
  2. Every other day an OEM somewhere in the world decides to peel off a factory to an EMSP. With the recent exception of ChipPAC’s buyout of an older Malaysian Intersil assembly plant, there is no comparable move by the IC companies to divest their packaging operations–yet.

Using Y2K total available market (TAM) figures, the EMSPs have room to grow sixfold, and that growth is almost guaranteed! The PFs may be looking at 3x growth, but that's not guaranteed - yet. Capital markets love guarantees. (See the sidebar for our derivation of TAMs.)

Suggestions for Increasing Market Share

Following are suggestions for increasing PF market share and enhancing value:

  • Take a page from the board-box EMSPs–take your proper place in the supply chain with more B2B interconnectivity to OEM designers, IDMs and wafer foundries for fast execution
  • Become more expert than the IDMs in chip stacking, and wafer-level packaging; solicit more outsourcing. The IDMs have other things to do to improve their competitive positions.
  • Form alliances with the other group of EMS companies to deliver more complete solutions to OEMs from chip-on-board for mobile/internet Internet appliances to C4 for high-end servers.
Acquisition activity increases with focus on OEM divestitures and expanding product and service capabilities.
Source: Market Manufacturing Insiders/Robertson Stephens EMSP Conference.
Amkor and Toshiba Breakthrough

Recently news was released about a new IC packaging partnership between IDM Toshiba and PF Amkor. It’s to be a joint venture in Japan, 60% owned by Amkor.

According to a forecast by wafer foundry giant TMSC, Toshiba will be neck and neck with TMSC and Hyundai, each leading with 4.7 million wafers in 2001.

This development validates the outsourcing model from IDM to PF, similar to what happened in board assembly from OEM to EMSP.

(The recent Robertson Stephens Electronics Manufacturing Products and Services and semiconductor conferences in San Francisco provided a rich source of data and background information for this column.)

DERIVATION OF TAMS FOR BOARD-BOX AND IC PACKAGE EMS MARKETS

How big is the electronics equipment market–that’s the TAM for the EMSPs?

There is no direct way to measure it. It’s much too diverse and dynamic (and secret) to sample.

There are problems of definition–separating out software, media, maintenance, hand-holdinghandholding.

So how do we measure total annual electronic equipment on the world’s loading docks–the basic electronic hardware revenues of the Ciscos, the Toshibas, the GEs? The answer is indirectly.

Semiconductors–ICs, discretes and optical devices–will run $200 billion in 2000, and represent 25% of OEM revenues on average. That gives us $800 million for electronic equipment in 2000. But not all of this will be available to the EMSPs.

There is $100 billion in what John Tuck of Manufacturing Market Insider calls ODMs–Original Design Manufacturers–who make motherboards, memory modules, power supplies, embedded boxes and assemblies for which they own the designs.

And not all captive production will be divested. Some is too valuable and proprietary.

How big is the package assembly market–that’s the TAM for the PFs?

We have to go back to that $200 billion semiconductor shipment above. Packages used to be 9%; it’s moving up, and now represents 13%. So the theoretical TAM for the package assembly PFs is $26 billion. The independent outsourcing industry has already achieved a 30% penetration.

Mr. Miller shares his insights about the electronics industry whenever he can break away from taking the industry's pulse at conferences and seminars. He is editor of InfraFOCUS, an industry newsletter in Palo Alto, Calif. Contact him at hmiller560@aol.com.

 

 
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