Photos © copyright 2000 by Chip Scale Review.

Space and time constraints limited this issue’s PackCon coverage. Look for a conference report in our next issue.

Industry legend Charlie Sporck (left), founder and retired president/CEO of National Semiconductor, reminisces with longtime friend Gene Selven, Chip Scale Review publisher. Sporck was on hand to speak at a MEPTEC luncheon honoring former National employee Bob Hilton for his contributions to packaging.

Melissa McCrossen, western regional sales manager for Nordson Plasma Systems, Concord, Calif., sends a dispatch to headquarters.

Jerry Dellheim, vice president of strategic marketing for ASM Pacific, San Jose, breaks for lunch at the adjacent Weston Hotel.

Ray Brachelli, Equipment Technology Conveyance, Santa Clara, representing DIAS Automation, ponders the next generation of bonding equipment—and the next trade show.

PackCon was sponsored by SEMI, in collaboration with MEPTEC. Representing SEMI at the show were (from left), Jane Finley, Simone Poff and Geneva Mikko.

Debra Vogler (right), editor of Website link2semiconductor.com, interviews Beverley Barnes, product manager of Johnstech International, while Gorden Gurley tapes.

Lloyd Chuakay, marketing director for Cirtek Electronics Corp., Santa Clara, Calif., discusses show logistics with name pending, title pending, also of Cirtek.

Ron Gilman (left), president of Chipscale Robotics, San Jose, greets show visitor Kerry Sorlie of Rexroth Star.

Jim Laite (left), vice president of sales-eastern region and Greg Johnson, vice president of sales, Signetics High Technology, prepare for show visitors.