Rochester, N.Y.-Zecal Technology and Amkor Technology Inc., Chandler, Ariz., have announced a strategic alliance that will combine Zecal's ceramic circuit technology with Amkor's high-volume RF module manufacturing services to drive the growth of system-in-package (SiP) electronics.

Zecal will employ its Z-Strate substrate to enable high-volume production of advanced ceramic circuits and CSPs at Amkor's facilities in Korea and in the Philippines. This technology will be employed for selected SiP applications, with an emphasis on electronics for use in communications hardware. [amkor.com]

Atlantic Technology Expands

Crumlin, South Wales-Atlantic Tech-nology (formerly ASAT's U.K.-based assembly and test facility) recently expanded its workforce to 250 by adding 65 employees, following a three-month recruitment drive.

The company also embarked on a major capital expansion by investing $5 million in new technology with another $12 million investment planned by the end of this year. [atlantic1.co.uk]

CARSEM Adds to Test

Ipoh, Malaysia-CARSEM is expanding electrical test and wafer probe at its Malaysian facilities. Testers on order include 10 Teradyne Catalyst 100 sys-tems, five Eagle ET 500D systems and six TMT ASL 1000 units.

CARSEM, which has some 140 test systems, says it plans to install additional test equipment above the projected capacity needs of existing customers. "This test expansion will place CARSEM in a position to handle unforecasted business." [carsem.com]

ChipPAC Inc. Goes Public

New York-ChipPAC, the Korean-based IC assembly and test house, became a publicly traded company in August by selling 10 million shares at $12 each.

The company, formerly Hyundai's assembly and test business, is listed on NASDAQ as CHPC. Earlier, lead under-writer Credit Suisse First Boston esti-mated that 15 million shares would sell for as much as $22 each. [chippac.com]

CS2 Opens Analysis Lab

Brussels-Packaging foundry CS2 has established a signal integrity lab special-izing in high frequency analysis, design, characterization and test of electronic assemblies.

According to the company, the lab is offering comprehensive signal integrity management services to optimize the performance of single-chip or multi-chip packages and RF front-end modules.

Available services include design support for HF applications, HF module design, electrical package analy-sis and HF final test.

Final test is accomplished with a Teradyne Catalyst test system equipped with the UW6000 mixed-signal, plug-in module. CS2 also announced that it has signed a memo of understanding with chipmaker Atmel Corp. for development and imple-mentation of a thin-film technology.

This interconnect technology will be employed for multi-element integration with passive components on a single substrate and has been validated at fre-quencies up to 50 GHz. [cs2.be]

Psi Technologies Sets Record

Manila-Psi Technologies Holdings Inc. said it has achieved record revenue and net income for the second quarter, while in the midst of an aggressive ramp-up of its assembly and test facilities.

Revenues amounted to $18.4 million for Q2, up 13% from $16.2 million for the prior quarter and up 53% from $12 million for the same quarter in 1999.

"The growth of PSi's revenues in the second quarter was driven by the rapid growth of outsourced volumes from many of PSi's newer customers, many of whom manufacture power semiconduc-tors...," according to Arthur J. Young Jr., president and CEO.

Gross profit for the second quarter amounted $3.84 million, up 10% from the $3.49 million recorded in the prior quarter. [psitechnologies.com]

STATS Bulks Up Capacity

Singapore-ST Assembly Services has expanded the manufacturing capacity of its facility by 80,000 square feet of class 10,000 clean room space at a cost of $5 million.

The expansion increases STATS' total operating area to more than 300,000 square feet. The additional floor space "will facilitate further business growth," the company said. [statsus.com]

51st ECTC Plans Set

Orlando, Fla.-The 51st Electronic Components and Technology Conference is slated for May 29-June 1 at the Wyndham Palace Resort & Spa in Lake Buena Vista, Fla. The conference is sponsored by the IEEE/CPMT and EIA/ECA.

ECTC will present papers on advanced packaging, components and RF, interconnections, manufacturing technology, materials and processing, modeling and simulation, optoelec-tronics packaging and quality/ reliability. [ectc.net]