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On Line Reader Service
 Publisher's Letter
What a Year!

 Assembly Lines
Art for Art's Sake - Or What Is Intel's Dr. Noyce Doing on an AMD Sculpture?

 Standards
New Lead-Free Finishes Require Testing to Determine Best Reflow Temperatures

 Wafer-Level Watch
Wafer Level Establishes a Beachhead

 Harvey Miller's Notebook
Cost of Leadframe Packages Falling, Raising Cost of Entry for WLCSPs

 Industry News
Company News
People in the News
Packaging Foundries
Letters
Calendar of Events
Editorial Index

 Features
Cover Story: X-Ray Inspection - Increasingly Popular, Systems Offer a Non-Destructive View
Directory of X-Ray Inspection System Suppliers

Cover Story: How Ultrasound 'Sees' CSP Defects

Cover Story: Socket Makers Face New Demands for Tighter Pitches and More I/0s

Directory of Socket Vendors

A Critcal Review of the Top CSP Patents

Keep the Reliability, Dump the Lead: Japanese Companies Accelerate Lead-Free Packaging

 Technical Forum
Wire Bonding Optoelectronics Packages

 Tools & Technologies
Thermagon Claims 'Lowest' Impedance for Conductive Film and more...

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Current Issue
The International Reference for Chip-Scale Electronics, Flip-Chip Technology, Optoelectronic Interconnection and Wafer-Level Packaging
November - December 2001
Socket Vendor Directory

Company Name
Address
Founded: Year Founded
Model
Introduced
I/O Range
Operating Temperature
(Degrees Celsius)
Contact Pitch (mm)
Technology
Inductance (nH)
Typical Insertions
Applications
Packages Accomodated
Handlers Accomodated
[website]
Contact e-mail
Phone: Phone Fax: Fax
Additional Offices
Note: Notes
3M Electronic
Handling & Protection
6801 River Place Blvd.
Austin, TX 78726
Phone: 800.328.0411
Founded: Not Supplied

Textool 0.65 mm Open Top July 2001
Up to 625
0.65
Patented dual beam
20K
Burn-in, test
BGA, CSP, LGA
N/A
[3m.com/ehpd/sockets]
Brian Abrams,
Sales & Marketing Manager
bdabrams@mmm.com
Phone: 512.984.5492
Note: MicroTouch Area Array: planned
2001/2002 release
MicroTouch Area Array Technology 2000
Up to 600
0.75 and up
Proprietary contacts
<0.4, >10 GHz
High performance test, prototypes,
robust automation aps
BGA, CSP, LGA
Aehr Test Systems
400 Kato Terrace
Fremont, CA 94539
Founded: 1977

DiePak Carrier
June 1995
1-320+
-55° to 150°
0.75
Contact technology
<2 100-500
(bare die in carrier)
KGD die screening before module assembly
Bare die (flip chip or wire bonded)
All
[aehr.com]
Martin Hemmerling,
Fixtures Sales & Service
mhemmerling@aehr.com
Phone: 510.623.9400 Fax: 510.623.9450
AQL Manufacturing Co.
9755 SW Commerce Circle Wilsonville, OR 97070
Founded: Not Supplied

B Series–Shielded
Fall 2000 >2000
-50° to 150°
1 and 1.27
Patent pending spring probe
0.37 100K
Prototype and test
BGA, CSP, MLF, QFP, etc.
All
[aqlmfg.com]
Doug Kocher
doug@aqlmfg.com
Phone: 503.682.3193
Fax: 503.682.1648
B Series
2001 16-2000
-50° to 150°
0.5-1.27
Compliant probe
1 100K+
Prototype and test
BGA, µBGA, MLF
All
LI Series
2001 16-2500
-50° to 150°
1-1.27
Custom spring probe
0.3 150K+
Prototype and test
BGA, µBGA, MLF
All
Aries Electronics
62A Trenton Ave.
Frenchtown, NJ 08825
Founded: 1972

BGA/CSP RF Test Socket
July 2001
1-1600
-55° to 150°
0.5-2.54
Spring probe
<0.6
500K
Test, burn-in, characterization
BGA, CSP, LCC, LGA, MLF, QFN
Aetrium, Aseco, Delta, Multitest, Seiko-Epson
[arieselec.com]
Frank Folmsbee,
Sales Manager
frankf@arieselec.com
Phone: 908.996.6841
Azimuth Electronics Inc.
2605 S. El Camino Real
San Clemente, CA 92672
Founded: 1964

5250-100W-7S/R
March 2001 7-14
-55° to 150° (240° option)
1
Cantilever/wiping action 50K
Burn-in, prototype, test
BGA, CSP, MLF, etc.
Laser diode, flatpacks and
butterfly packages with wider leads up to 0.39 wide
[azimuth-electronics.com]
RoJean Hall, Sales & Marketing
sales@azimuth-electronics.com
Phone: 949.492.6481
Fax: 949.492.0744
Note: 5253-100W-7S/R: Contact to meet
5 amp requirements
5253-100W-7S/R
March 2001 7-14
-55° to 150° (240° option)
1
Cantilever/wiping action 50K
Contech Solutions Inc.
631 Montague Ave.
San Leandro, CA 94577
Founded: Not Supplied

CSBG
July 1997
Up to 2000
-50° to 150°
0.4 and up
Spring probe
1 to 1.3
Burn-in, prototype, test
BGA, CSP, LCC, MLF, etc.
All
[contechsolutions.com]
Afshin Nouri, President
afshin@contechsolutions.com
Phone: 510.357.7900 Fax: 510.357.7600
Note: High performance at a reasonable price
DCI, Division of
Credence Systems
3350 Scott Blvd., Bldg. 58
Santa Clara, CA 95054
Founded: 1989

Controlled Impedance Test Socket
July 2001 44-1500
-35° to 125°
0.8 and 0.65
Double-ended spring pins
1.3
100K+
Characterization and
production test
BGA, CSP, MLF, QFP
50Ω test socket
[dci-us.com]
Nick Langston Sr., Product Line Mgr.
nicksr@dci-us.com
Phone: 408.988.6800 Fax: 408.988.8950
Note: High-speed digital applications
Emulation Technology Inc.
27 St. Cuthberts St.
Bedford MK403JG United Kingdom
Founded: 1983

Silver Wings Socket System
April 2001
48-2500
-20° to 100°
0.50, 0.75, 0.80, 1, 1.27, 2.54
Elastomer
>5K/contact pad
Debug, development, emulation, hand test, programming, qual, test
BGA, µBGA
Not adapted to handlers
[emulation.com]
Joseph Bagliere, President
joe@emulation.com
Phone: 408.982.0660 Fax: 408.982.0664
Note: Five sockets handle every pin count, pitch and package size
Enplas Tesco Inc.
765 N. Mary Ave.
Sunnyvale, CA 94085
Founded: 1995

BGA-484-0.5-01 Oct. 2001
Up to 484 grid matrix
-55° to 150°
0.5
Micro coil spring
3 10K
Burn-in, test
CSP 0.5 mm
Delta Design, others to be announced
[enplas.com]
Ken Turnbaugh
kturnbaugh@enplas.com
Phone: 408.749.8124 Fax: 408.749.8125
Note: Modular contact, field repairable
BGA-784-0.5-01 Oct. 2001
Up to 784 grid matrix
-55° to 150°
0.5
Micro coil spring
3 10K

 
Copyright © 2001